Electronic Components & Devices

New WFM Resistors Available in 2 W and 3 W Power Ratings
Resistors

New WFM Resistors Available in 2 W and 3 W Power Ratings

Processing technique enables wide range of low resistance values from 5 mΩ to 500 mΩ with tolerances down to ± 1.0 %. Features operating temperature range of -65 °C to +170 °C. Ideal for current sensing and pulse applications in automotive electronic controls, brushless DC motor controls and battery management.

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New WFM Resistors Available in 2 W and 3 W Power Ratings
Resistors

New WFM Resistors Available in 2 W and 3 W Power Ratings

Processing technique enables wide range of low resistance values from 5 mΩ to 500 mΩ with tolerances down to ± 1.0 %. Features operating temperature range of -65 °C to +170 °C. Ideal for current sensing and pulse applications in automotive electronic controls, brushless DC motor controls and battery management.

Read More »
New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Electronic Chips

New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments

Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.

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New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Electronic Chips

New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments

Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.

Read More »

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