Electronic Components & Devices

FPGA consumes less than 200 mW standby power.

Part of 65 nm CycloneÂ-® III family, Model EP3C120 offers 5-120 K logic elements, memory up to 4 Mbits, and digital signal processing capabilities. Low power consumption enables unit to address power-sensitive applications or thermally challenging environments where heat generated by device operation cannot easily be dissipated. Applications include wireless communications infrastructure,...

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Post Amplifier is designed for fiber optic transceivers.

Model SY88973BL low-power limiting post amplifier offers multi-rate capability from 622 Mbps up to 3.2 Gbps operation. It incorporates low loss-of-signal, open-collector TTL output with external 4.75-10k micron pull-up resistor, and also features internal 50 micron data input and low-noise 50 micron CML data output. Available in 3 x 3 mm 16-pin MLFÂ-® package, device operates from single +3.3...

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Security Processor suits GigE networking applications.

Model 8450 ensures data security, integrity, and simultaneous support for multiple security protocols as well as encryption and authentication algorithms. FlowThrough(TM) architecture enables security services to be provided directly in data path and ensures low-latency packet processing in Ethernet networking systems. Solution supports 2 full-duplex Gigabit Ethernet (GigE) ports and delivers 4...

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FPGAs are designed for use in space applications.

Targeted towards space-flight designs, radiation-tolerant RTAX-SL field programmable gate array (FPGA) series is comprised of three members with embedded memory, SEU-hardened flip-flops, multiple I/Os, and hermetic packaging. Each programmable logic solution offers radiation performance that exceeds requirements of space applications. Also available, prototyping capabilities address early concept...

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RadiSys Introduces MicroTCA Development Kit

Joint Solution with CorEdge Networks, Arrow Electronics allows telecom equipment manufacturers to develop network elements for Edge/access, WiMAX markets CHICAGO, June 19 /- RadiSys Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced today the introduction of a MicroTCA platform development kit aimed at helping telecommunications equipment manufacturers...

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Stackpole Electronics, Inc. Announces 0201 Size Thin Film High Frequency Inductor

RALEIGH, NC (May 31, 2007) - Stackpole Electronics, Inc. announces the addition of an 0201 chip size for their AL series of thin film high frequency inductors. Thin film inductors are ideal for applications or designs requiring tight inductance tolerance, tightly controlled SRF, and excellent stability over temperature. The AL series now has chip sizes from 0201, 0402, and 0603 with wide...

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AMC Module offers 1.5 GHz dual core PowerPC-® performance.

Based on 1.5 GHz dual core Freescale PowerPCÂ-® MPC8641D, Model AM4100 delivers up to 2.3 MIPS/MHz computing performance and high Ethernet bandwidth. With integrated Altivec 128-bit Vector Processing Unit and 4 Gigabit Ethernet interfaces, Advanced Mezzanine Card includes up to 2 GB of soldered DDR2-SDRAM, 4 MB bootable redundant NOR Flash, up to 4 GB NAND Flash, and EEPROM for user and...

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Gate Distribution Board synchs 2 GHz A/D processing modules.

Gate Distribution Board synchs 2 GHz A/D processing modules.

Configured as 6U VME board, Model 6890 synchronizes multiple Pentek I/O modules, each receiving common clock up to 2.2 GHz along with timing signals for synchronizing, triggering, and gating functions. Clock, synch, and gate distribution board, which supports Pentek Model 6826 Dual 2-GHz, 10-bit ADC VME board, facilitates sampling and timing for multichannel, high-speed DAQ, DSP, and...

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QUALCOMM Powers World's First 3G Handsets Based on 65-Nanometer Chipsets

- Advanced Process Technology Enables Rich Functionality for Slim and Power-Efficient Devices, Launching Worldwide Now - SAN DIEGO, June 18 -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced a significant milestone in semiconductor process technology as multiple 3G handsets...

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LSI Strengthens Leadership in Modem Market with New Line of Embedded Products

LSI delivers new embedded modem product portfolio to address all segments of the modem market MILPITAS, Calif., May 29 -- LSI Corporation (NYSE:LSI) today announced a complete line of embedded modem products, which include a pin-compatible family of data and fax modem chipsets and a single package monolithic DAA (data access arrangement). The new line builds on the company's long history of...

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