Electronic Components & Devices

Applications Processor scales over 1 GHz for digital devices.

MarvellÂ-® PXA168 enables features such as web surfing, multiformat video, Adobe Flash-based content playback, video conferencing, and advanced GUIs on digital consumer devices. It supports HD video with hardware graphics acceleration and includes Qdeo(TM) Color Intelligent Color Remapping technology for maximized display quality. Designed for Linux and Windows CE, unit includes 5-in-1 memory...

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Interconnects enable ultra-thin cables for consumer devices.

Model QLx4270-DP Q:Active Media Interconnect delivers 10.4 Gbps DisplayPort connectivity in 4 x 7 mm package, while QLx3300-16B, also 4 x 7 mm, delivers HDMI for active cables and media switch devices. At 3 x 3 mm, QLx1600 is suited for SuperSpeed USB. Units can run up to 5 m on active copper cabling and up to 10 m for USB 3.0, providing 10.2 Gbps full bandwidth DisplayPort over 40 ga copper....

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Digital Audio IC combines processing and amplification.

Sound Terminal(TM) model STA339BWS utilizes techniques such as Full Flexible Amplification (FFX) to enable fully digital stream from sound source to loudspeaker, promoting audio performance and reducing size for home-audio equipment using small speakers, such as flat-panel TVs and docking stations. Solution combines IP from audio processing and class-D power amp ICs into one chip and includes...

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Digital Video Format Converter includes Qdeo technology.

Implemented in 65 nm process, MarvellÂ-® 88DE2750 converts high-definition, standard-definition, and low-resolution video and graphics into any desired output format up to and including 1,080p and 4K x 2K. Qdeo(TM) True Color enables 8-bit consumer video to use full dynamic range of 10-bit and 12-bit displays, producing natural-looking images free from contouring or banding. Applications...

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Hybrid Socket provides test or burn-in down to 0.30 mm pitch.

CSP/BallNest Hybrid Socket is suited for prototyping, test, or burn-in of CSP, BGA, micro BGA, and LGA devices. ZIF-style socket features solderless, gold-plated pressure mount spring probes which simplify PCB mounting/removal, and 4-point crown ensuring scrub on solder oxides. Signal path is 0.077 in. and device offers contact forces from 15 g/contact on 0.30-0.35 mm pitch and up to 25 g/contact...

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Heat Sink cools AMD-based 1U servers.

Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.

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Wire-Wound Power Inductors offer low-profile, high current.

Wire-Wound Power Inductors offer low-profile, high current.

Measuring 3.2 x 2.5 x 1.7 mm, BRL3225 series is comprised of 7 wire-wound chip inductors used for switch-mode DC/DC converter applications in high-current-use devices. Each employs sleeveless square-core winding that eliminates wasted space and thickens lead wire inside inductor to achieve lowest possible DC resistance (down to 0.043 W). From EIA 1210 form factor, models offer inductance values...

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High Power Connectors suit electric/hybrid-electric vehicles.

ApexÂ-® 950 connectors offer current capacity of up to 150 A, while RCS-800 terminals feature 8 mm round pin and high number of contact points for operation up to 250 A. Surface platings protect against damage caused by arcing, and 2-step mating process and 3 sec delay between power cutoff and release promotes safety. Terminals are encased in plastic protective grid that physically prevents...

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Low VCE(SAT) Dual Transistors come in 3 x 2 mm package.

Low VCE(SAT) transistors are packaged in TLM832D(TM) Tiny Leadless Module, which has power dissipation of 1.65 W and is optimized for space conservation. Specific models include CTLM3410-M832D (Dual, NPN); CTLM7410-M832D (Dual, PNP); and CTLM3474-M832D (Complementary NPN and PNP) devices. Featuring typical VCE(SAT) of 20 mV (NPN) and 25 mV (PNP) at 50 mA, all devices are rated at 40 Volts VCBO,...

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Overvoltage Protection IC optimizes available PCB space.

Supplied in 3.0 x 4.0 x 0.9 mm package, NUS6189 integrates performance and functions of overvoltage protection (OVP) circuit, 30 V P-channel power MOSFET, low VCE(sat) transistor, and low Rds(on) power MOSFET to protect sensitive electronic circuitry in portable devices from overvoltage transients and power supply faults. Overvoltage turn-off time of less than 1.0 Â-µsec ensures quick...

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