Electronic Components & Devices

Power Amplifier serves point-to-point radio applications.

Power Amplifier serves point-to-point radio applications.

Supplied in 5 mm, 20-Lead PQFN package, MAAP-008924 three-stage, 1.2 W GaAs power amplifier (PA) is fully matched to 50 ohms on input and output and provides high output IP3 (44 dBm) while maintaining low DC power consumption. Product, fabricated with MESFET Process, operates in 10-13.3 GHz frequency range and can be used as PA stage or driver stage. Quiescent current rating is 1,000 mA, and...

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Gate Driver IC drives GaN FETs and MOSFETs in low-side applications.

Offered in 6-pin SOT-23 package and 6-pin LLP package with exposed pad, LM5114 drives Gallium-Nitride (GaN) power field-effect transistors (FET) and MOSFETs. Independent source and sink outputs from 5 V supply for optimal rise and fall times promote efficiency, while +4 to +12.6 V single power supply range supports range of applications. Other features include 0.23 ohm open-drain, pull-down, sink...

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COM Express Module supports low-power Intel® processors.

Suitable for vibration-resistant applications, conga-TS67 is available in 4, second-generation low-power Intel® Core(TM) processor versions, from 1.0 GHz Intel® Celeron® 807UE processor with 10 W TDP to 1.50 GHz Intel® Core(TM) i7 2610UE dual core processor with 17 W TDP. Pin-out Type 6 module provides VGA and LVDS as well as 3 digital display interfaces, which can be configured for...

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Multimedia Outlet Modules support distances up to 100 ft.

Supporting video applications over distances up to 100 ft, Enhanced Multimedia Outlet System Modules include 3 types: VGA, RCA composite video and stereo audio, and RCA component video. Modules provide point-to-point connections over twisted pair cable, for connection of everything from PC monitors to DVD players. Modules offer industry-standard 110-punchdown termination and give installers...

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Metal Shunt Resistor features 3 W power and low resistance values.

Metal Shunt Resistor features 3 W power and low resistance values.

Combining resistance values from 100-750 -µW with 3 W power capability in 3124 size package, Power Metal Strip® WSMS3124 is designed for industrial and consumer single- or multiphase energy meters. It features 5-terminal connection design, all-welded construction, and offers very low inductance values of less than 0.5 nH and low thermal EMF of less than 3 -µV/°C. Device is lead-free and...

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Stäubli Connectors and Robotics to Exhibit at PLASTEC West 2012

DUNCAN, SC - Each year PLASTEC West draws thousands of plastics professionals in search of the most innovative solutions in the industry. When the show returns February 14 - 16 at the Anaheim Convention Center in Anaheim, CA, Stäubli's Connectors and Robotics Divisions will jointly present their solutions for automation in the plastics industry at Booth 3811. Take advantage of this unique...

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Maxwell Technologies Inks Agreement with Pana-Pacific to Distribute Its New Ultracapacitor-Based Engine Start Module for Trucks

Engine Start Module available in all OEM after-market truck dealerships in U.S., Canada and Mexico SAN DIEGO - Maxwell Technologies, Inc. (Nasdaq: MXWL) announced today it has entered into a one-year agreement with Pana-Pacific, a preferred integrator and engineering partner in the commercial vehicle market, to distribute Maxwell's new ultracapacitor-based Engine Start Module (ESM) in the United...

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Rectangular Connectors meet MIL-DTL-28804 requirements.

Rectangular Connectors meet MIL-DTL-28804 requirements.

Rated at 5 A/contact, CCM-20, 21, 22, and 23 Series design allows optimized solder flow and for post solder visual inspection. Pin counts of 38, 50, 88, 108, and 132 are available with standard pin length of .250 ±0.025. Made of glass-filled polyester with beryllium copper alloy contacts that are gold-plated in mating area, high density connectors are suited for advanced missile systems,...

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Miniature Power Chip enhances AMOLED smartphone designs.

Miniature Power Chip enhances AMOLED smartphone designs.

Supplied in 3 x 3 mm package, STOD13AS is produced using Silicon On Insulator process technology and integrates step-up and inverting DC/DC converters needed to generate positive and negative supplies on same chip. Immunity to cellphone communication noise produces consistent, flicker-free display, while Enable pin and pulse-skipping operation promote power conservation. Along with 85% typ...

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Software Development Kit aids design of multi-mode modems.

Incorporating CEVA-XC323 DSP silicon, which delivers 800 MHz performance, CEVA-XC SDK enables full implementation of physical layer signal processing in software for range of communication standards, including LTE, LTE-Advanced, HSPA+, HSPA, TD-SCDMA, WiFi, DTV demodulation, digital radio, and GPS. In addition to silicon, kit includes comprehensive set of DSP software libraries, range of standard...

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