Electronic Chips

Electronic Chips

Mobile WiMAX Baseband IC reduces power consumption to 0.5 mA.

Manufactured using 65 nm low-leakage CMOS process and CoolAdjust power-gating technology, Fujitsu MB86K23 mobile WiMAX baseband IC supports channel bandwidths including 3.5, 5, 7, 10, and 20 MHz, along with 64 QAM, 16 QAM, and QPSK adaptive modulation schemes. WiMAX Forum Wave 2 mobile device certified unit provides wireless access using 512/1024/2048 FFT OFDMA with integrated MAC processors, and...

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Electronic Chips

Mobile WiMAX Baseband IC reduces power consumption to 0.5 mA.

Manufactured using 65 nm low-leakage CMOS process and CoolAdjust power-gating technology, Fujitsu MB86K23 mobile WiMAX baseband IC supports channel bandwidths including 3.5, 5, 7, 10, and 20 MHz, along with 64 QAM, 16 QAM, and QPSK adaptive modulation schemes. WiMAX Forum Wave 2 mobile device certified unit provides wireless access using 512/1024/2048 FFT OFDMA with integrated MAC processors, and...

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Electronic Chips

Mobile WiMAX Chip integrates baseband and triple-band RF.

Incorporating baseband/triple-band RF in 65 nm die, SQN1210 delivers maximum throughput of greater than 40 Mbps with power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby. Chip RF supports TDD and half-duplex FDD and covers 2.3, 2.5, and 3.5 GHz global WiMAX bands. Unit also supports 2 Tx, enabling uplink MIMO, as well as H-ARQ up to category 4....

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Electronic Chips

Mobile WiMAX Chip integrates baseband and triple-band RF.

Incorporating baseband/triple-band RF in 65 nm die, SQN1210 delivers maximum throughput of greater than 40 Mbps with power consumption of less than 350 mW with fully loaded MIMO traffic and less than 0.5 mW in standby. Chip RF supports TDD and half-duplex FDD and covers 2.3, 2.5, and 3.5 GHz global WiMAX bands. Unit also supports 2 Tx, enabling uplink MIMO, as well as H-ARQ up to category 4....

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Electronic Chips

Interconnects enable ultra-thin cables for consumer devices.

Model QLx4270-DP Q:Active Media Interconnect delivers 10.4 Gbps DisplayPort connectivity in 4 x 7 mm package, while QLx3300-16B, also 4 x 7 mm, delivers HDMI for active cables and media switch devices. At 3 x 3 mm, QLx1600 is suited for SuperSpeed USB. Units can run up to 5 m on active copper cabling and up to 10 m for USB 3.0, providing 10.2 Gbps full bandwidth DisplayPort over 40 ga copper....

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Electronic Chips

Interconnects enable ultra-thin cables for consumer devices.

Model QLx4270-DP Q:Active Media Interconnect delivers 10.4 Gbps DisplayPort connectivity in 4 x 7 mm package, while QLx3300-16B, also 4 x 7 mm, delivers HDMI for active cables and media switch devices. At 3 x 3 mm, QLx1600 is suited for SuperSpeed USB. Units can run up to 5 m on active copper cabling and up to 10 m for USB 3.0, providing 10.2 Gbps full bandwidth DisplayPort over 40 ga copper....

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Electronic Chips

Renesas Technology Receives Certification for New IP that Supports the PCI Express® 2.0 High-Speed Serial Interface Standard

IP supporting the 65-nm process node allows 5Gbps data transfers and will be used in advanced semiconductor solutions for graphics, networking and data storage applications. SAN JOSE, Calif. - December 16, 2008 - Renesas Technology America, Inc. today announced the development of a new logical- and physical-layer intellectual property (IP) conforming to PCI Express Base Specification Revision 2.0...

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Electronic Chips

Renesas Technology Receives Certification for New IP that Supports the PCI Express-® 2.0 High-Speed Serial Interface Standard

IP supporting the 65-nm process node allows 5Gbps data transfers and will be used in advanced semiconductor solutions for graphics, networking and data storage applications. SAN JOSE, Calif. - December 16, 2008 - Renesas Technology America, Inc. today announced the development of a new logical- and physical-layer intellectual property (IP) conforming to PCI Express Base Specification Revision 2.0...

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