Electronic Chips

Electronic Chips

Fujitsu and Partners Teak Technologies, Gennum, CorEdge, and Terranetics to Exhibit Leading 10-Gigabit Ethernet Applications at Interop Las Vegas 2007

SUNNYVALE, Calif., May 17 // - Fujitsu Microelectronics America, Inc. (FMA) and four customer partners will showcase the Fujitsu 20-port, 10 Gigabit Ethernet (GbE) switch chip, and their GbE solutions used in a variety of applications at Interop Las Vegas, May 20-25, 2007, in the Mandalay Bay Convention Center, Las Vegas. The Fujitsu MB8AA3020, the industry's most powerful 20-port, 10GbE switch...

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Electronic Chips

Teranetics Announces Production Availability of Industry's Only Single Chip Ethernet 10GBASE-T PHY

Chip includes all the Features essential for Commercial Deployment Today; IEEE 802.3an Compliance, including 100m reach, and 10G/1G Multi-Rate Auto-negotiation SANTA CLARA, Calif., May 8 -- Teranetics, Inc., a leading provider of high performance Ethernet solutions, announces immediate production availability of the company's TN1010 Ethernet 10GBASE-T PHY. This single-chip solution is designed to...

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Electronic Chips

ICS Triplex ISaGRAF Collaborates with Beck IPC GmbH to Allow IPC@CHIP® Embedded Web-Controller Users to Take Advantage of ISaGRAF 5 and IEC 61499 Functionality

Montreal, Canada - April 2nd, 2007 - ICS Triplex ISaGRAF Inc., the leading automation software technology partner, announced today that its flagship product ISaGRAF is compatible with Beck IPC GmbH's popular IPC@CHIP® SC123/SC143 series of embedded web-controllers. Local I/O drivers are available, additional drivers can be developed upon request. The ISaGRAF 5 automation software can also be...

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Electronic Chips

E2v Chooses 32-Bit Processor for Upcoming Products: The Cortus APS3 Core from CAST

NICE, France, April 16 - DATE Conference - Semiconductor intellectual property (IP) provider CAST, Inc. today announced that e2v in Grenoble, France, has selected the APS3 IP core as its embedded processing core of choice for upcoming mixed-signal sensor and imaging system products. e2V is an award-winning international company specializing in the design, development, and manufacture of...

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Electronic Chips

Microprocessors for use in 2.5 and 3.0 G SIM cards.

Models ST21Y036 and ST21Y144 provide 36 and 144 Kb user EEPROM, respectively, to mobile phone SIM cards. Processors feature 8/16-bit CPU core, 16 Mb linear addressing capability, hardware Data Encryption Standard, Cyclic Redundancy Code calculation block, 64 byte user One Time Programmable memory, CMOS submicron technology, 10-year data retention, and Erase/Write endurance of 500,000 cycles....

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Electronic Chips

DLP Cinema® Unveils New .98 Chip as it Marks 350% Growth Globally of Theaters Powered by DLP Cinema Projectors

18 Top-Grossing Films of 2006 Released Digitally as Worldwide Adoption of DLP Cinema Technology Continues LAS VEGAS, March 13 - Texas Instruments (TI) (NYSE:TXN) DLP Cinema® unveiled the new .98 DLP Cinema chip today at ShoWest, the largest annual convention for the cinema exhibition and distribution community. The announcement aligns with a banner year at the box office for DLP Cinema,...

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Electronic Chips

Polymorphic Computer adopts different forms based on need.

Performing as single SoC, MONARCH can reconfigure itself on-the-fly to optimize processing for application at hand. Solution addresses data volume of sensor systems as well as their signal and data processing throughput requirements. Containing 6 MCUs and interconnected reconfigurable computing array, solution provides 64 gigaflops (floating point operations per second) with more than 60 GBps of...

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Electronic Chips

ARM Processor is optimized for implementation on FPGAs.

ARM® Cortex(TM)-M1 processor implements subset of high-density Thumb®-2 instruction set, is capable of more than 170 MHz, and delivers 0.8 DMIPS/MHz. Compatible with M1-enabled Actel Fusion Programmable system chips and ProASIC3 FPGAs, 3-stage 32-bit RISC processor is available as Cortex-A series for complex OS and user applications, Cortex-R for real-time systems, and Cortex-M...

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Electronic Chips

AMD Demonstrates Accelerated Computing Solution that Breaks Teraflop Barrier

SAN FRANCISCO- AMD (NYSE: AMD) today showcased a single-system, Accelerated Computing platform that breaks the teraflop computing barrier. Organizations are ultimately expected to be able to apply this technology to a wide range of scientific, medical, business and consumer computing applications. At a press event in San Francisco, AMD demonstrated a Teraflop in a Box" system running a standard...

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Electronic Chips

ARC International Announces New Licensing Agreements with Leading European Semiconductor Companies and Design Teams

ARC's Configurable Subsystems and Processors Driving High-Growth Applications Including Multimedia, GPS, and Networking ELSTREE, England, March 6, 2007 - ARC International (LSE: ARK), the world leader in configurable subsystems and CPU/DSP processors, today announced new licensing agreements with leading European semiconductor companies and system-on-chip (SoC) design teams. All have adopted...

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Performance Packaging's AIRSHIELD™ Achieves FDA Approval for Food & Beverage Applications
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Performance Packaging's AIRSHIELD™ Achieves FDA Approval for Food & Beverage Applications

As a globally recognized provider of full-service packaging products and services, we have a history of developing innovative solutions that promote enhanced efficiency in a wide range of packing applications. Our new AIRSHIELD™ product is just another example of how we are helping food and beverage manufacturers to extend the life of their products. To learn more about this cutting-edge product, see our video.

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