Electronic Chips

Electronic Chips

Marvell, Lenovo and China Mobile Team Up to Drive Mass Market Adoption of China's 3G TD-SCDMA Smartphones

Marvell continues its leadership in China's 3G TD-SCDMA standard with introduction of Lenovo's LePhone A66t powered by industry's first commercially available single-chip TD-SCDMA solution BEIJING - Marvell (NASDAQ: MRVL), a worldwide leader in integrated silicon solutions, today announced the launch of Lenovo's LePhone A66t, a 3.5-inch high-definition screen smartphone customized for China...

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Electronic Chips

Microprocessors enable low-power, high-performance designs.

Sitara(TM) AM335x ARM® Cortex(TM)-A8 microprocessors with NEON at up to 720 MHz consume as little as 7 mW of power while providing developers with 3D graphics capabilities, touch screen controller, and peripherals on one chip. Power management options help keep power levels as low as 700 mW in active mode, while integration provides CAN, 2-port Gbe switch, Dual USB + PHYs, LPDDR1/DDR2/DDR3,...

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Electronic Chips

Altair Semiconductor Chipset Powers Softbank Mobile's 110Mbps 4G Demonstration

FourGee(TM) LTE Chipset by Altair Breaks Its Second Speed Record in Two Months HOD HASHARON, Israel, - Altair Semiconductor ( http://www.altair-semi.com), the world's leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets [http://www.altair-semi.com/fourgee-31006200 ], announced today that its FourGee(TM) LTE chipset, integrated in a commercial USB dongle, was...

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Electronic Chips

Low-Voltage 32-Bit MPU SoC serves medical, WSN, mobile fields.

Implemented in 65 nm CMOS process, ST-MIT voltage-scalable microprocessor SoC suits applications with limited power budget and time-varying processing loads. Power consumption is 10.2 pJ/cycle at 0.54 V, and SRAM memory cells can operate at 0.4 V. Memory-access power consumption is further reduced via latch-based instruction and data caches at first level of hierarchy. Additional features include...

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Electronic Chips

Qualcomm Announces Industry's Highest Capacity Femtocell Solution for Enterprise and Metro Markets

- Qualcomm Also Announces New Femto-Wi-Fi Reference Design - SAN DIEGO, -- Qualcomm Incorporated (NASDAQ: QCOM) today announced expanded availability of the Company's Femtocell Station Modem(TM) (FSM(TM)) FSM9216, FSM9816 and FSM9832 enterprise chipsets, Qualcomm's fully integrated system-on-chip (SoC) solutions for femtocell development with an extended user capacity of up to 32 active users....

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Electronic Chips

EtherWaves Expands Digital Radio Choice - Adds Support for Tensilica Dataplane Processor Cores

Mobile device designers now have additional choices for adding ClearSignal advanced Software Defined Radio (SDR) capability TEL-AVIV, ISRAEL and SANTA CLARA, CALIF. USA -- EtherWaves, an acknowledged industry leader for Digital Radio Intellectual Property (IP) for cars and SoC (system-on-chip), and Tensilica, the leader in customizable dataplane processor IP cores, today announced the further...

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Electronic Chips

IBM Unveils Cognitive Computing Chips

- IBM introduces first(1) computing core that combines digital "neurons" and on-chip "synapses" in working silicon. - Radical new compute core demonstrates synaptic plasticity, the foundation of learning and memory. - With no set programming, these cores mimic the event-driven, parallel processing abilities found in the brain. SAN JOSE, Calif., -- Today, IBM (NYSE: IBM) researchers unveiled a new...

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Electronic Chips

ARM® Core-Based Processors include UI development software.

Integrating Mentor® Embedded Inflexion(TM) User Interface software, SPEAr Processors enable implementation of dynamic 2D and 3D UIs for product differentiation in embedded control applications. Microprocessors combine one or two ARM926 processor cores and Dual Cortex A9 cores with memory interfaces and set of IP blocks delivering connectivity, communication, and A/V functions. Applications...

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Electronic Chips

IBM Microprocessors to Power the New Wii U System from Nintendo

ARMONK, N.Y. - IBM (NYSE: IBM) today announced that it will provide the microprocessors that will serve as the heart of the new Wii U(TM) system from Nintendo. Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012. The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will...

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Electronic Chips

EnSilica and Evatronix Collaborate on USB Connectivity for eSi-RISC Processors

Collaboration delivers fully featured eSi-RISC processor sub-systems with USB 1.1, 2.0 and 3.0 connectivity Wokingham, UK and Bielsko-Biala, Poland -EnSilica, a leading independent provider of front-end IC design services and system solutions, has announced a collaboration with silicon Intellectual Property (IP) provider, Evatronix SA, to offer fully featured eSi-RISC processor SoC solutions...

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