Test Socket is designed for devices up to 13 sq mm.
Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm...
Read More »Denso Selects Tektronix for Automotive Test Solution
Largest Japanese Automotive Electronics Manufacturer Uses Tektronix DPO7000 Oscilloscopes and TDP1000 Probes to Enable Nanosecond-Order High Frequency Analysis BEAVERTON, Ore., Jan. 22 -- Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, announced that both its DPO7000 Series Oscilloscope and TDP1000 High Voltage Differential Probes are being used...
Read More »BGA Probes enable DDR2 and DDR3 testing and evaluation.
Offering direct access to balls of DRAM with minimal loading or impact to signal integrity, DDR2 and DDR3 BGA probes provide signal access points to clock, strobe, data, address, and command signals of DDR3 DRAM for true compliance testing with oscilloscope. Logic analyzer provides timing and protocol view of DRAM activities. DDR2 BGA probe enables simultaneous access to oscilloscope and logic...
Read More »Eddy Current Probe operates in temperatures to 240-
Used to monitor rotating shaft alignment and axial position, PRS05 Senturion Proximity Probe is constructed with bobbin expansion chamber and wire strain relief techniques for high-temperature operation. Construction also includes glass-filled PPS bobbin case, rated to 300Ã-
Read More »Key Benefits of a Full Service Semi-Finish Manufacturer
Check out this white paper to learn what to look for in a manufacturer of rotating parts.
Read More »eASIC and IAR Systems Deliver e926 Development Kit for Designing Low-Cost, Customized ARM926EJ(TM) Embedded Systems
SANTA CLARA, Calif., May 22 // -- eASIC Corporation, a provider of Structured ASIC devices, and IAR Systems, a provider of embedded development tools, today announced the immediate availability of the e926 Development Kit for designing affordable ARM926EJ-based embedded systems. The e926 Development Kit provides embedded system designers with a comprehensive application development environment....
Read More »Current Probes measure AC/DC currents up to 500 Arms.
Utilizing hybrid technology that combines Hall effect sensor and AC current transformer, N2780A Series accurately capture transient or steady-state currents in power electronics applications. Units can measure currents without breaking into circuit. In conjunction with optional Agilent N2779A power supply, current probes operate with any oscilloscope featuring high-impedance BNC output.
Read More »Sypris Test and Measurement Adds Additional Capabilities
ORLANDO, FL (December 13, 2006) - Sypris Test & Measurement, Inc., a subsidiary of Sypris Solutions, Inc., today announced the addition of Antenna, Isotropic/Electromagnetic Field Probe, Line Impedance Stabilization Network calibrations and RF Screen Room/Anechoic Chamber Certification to its suite of calibration service offerings. The addition of these capabilities enhances our service offerings...
Read More »Probe System tests wafers up to 300 mm.
Designed for high-temperature, multi-site testing, Model PM300WLR features large programmable microscope movement and cable handling solutions that facilitate use. Contact stability is guaranteed at temperatures up to 400Ã-
Read More »RF Probe is optimized for tuner-based characterization.
Featuring thin-film technology and high-current capability, RF Infinity probe ensures accurate and repeatable wafer-level RF measurements at higher current for characterization of linear power amplifiers and other RF power devices. Designed for power load-pull and noise parameter testing, it allows designers to model transistors under load conditions at up to 2 A, while maintaining low contact...
Read More »Wafer Probing System features interactive test environment.
Series S600 Parametric Test System is available with KTE v5.2 wafer test development and execution environment. Users can create individual electrical tests at subsite level by drawing on pre-defined libraries then defining parameters and connections. Software features promote throughput for circuit materials testing, such as those requiring RF level frequencies. Environment also supports...
Read More »Micro Air's Dust, Fume, Mist Collection Equipment Facilitate a Safe Work Environment
Dust, fume, and mist collectors from Micro Air promote a safer, more productive work environment. Our wide array of products are available to the industrial manufacturing sector for processes such as welding, cutting, grinding, blasting, and more. Check out our video to learn more.
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