Digital Memory

ATP Introduces 3D TLC-based Flash Solutions at FMS 2019

ATP Introduces 3D TLC-based Flash Solutions at FMS 2019

3D TLC SSDs and memory cards have high reliability and endurance due to reduced cell to cell interference. Automotive Grade 2 e.MMC performs reliably at temperatures ranging from -40°C to 105°C. ATP SecurStor protects data stored on the media as well as in transit and assure a safe and consistent system operation.

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Spansion and Sensoplex Launch High-Performance, Low-Power Wearable Development Platform

Enables Developers to Rapidly Develop New Wearables with Multi-Axis Sensors, Bluetooth Low Energy and ANT+; Demonstration at CES SUNNYVALE, Calif.Â- – Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions and Sensoplex, a world leader in the design and production of high performance wearable devices for sports, fitness, wellness and mHealth companies, today announced a...

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Transcend to Showcase Its Advanced Industrial Solutions at ICE Totally Gaming 2014

Transcend to Showcase Its Advanced Industrial Solutions at ICE Totally Gaming 2014

New Delhi – Transcend Information, Inc. (Transcend ), a leading manufacturer of industrial-grade products, today announced it will be attending ICE 2014 (ICE Totally Gaming), which will take place at the ExCeL Exhibition Centre in London, United Kingdom, 4-6 February. Transcend's booth will be located at booth number N1-140. During the exhibition, visitors will discover how Transcend's...

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Fusion-io and Quanta QCT Deliver Simplicity at OCP Scale

Fusion ioScale Now Qualified for Quanta Rackgo X, Making Efficiency Easy for Hyperscale Businesses SAN JOSE, Calif.Â- – [Open Compute Project Summit V Booth B8 - Fusion-io (NYSE: FIO) today announced that its ioScale flash memory products are integrated into Quanta Rackgo X product line. An innovative rack solution inspired by the Open Compute Project (OCP), the Rackgo X and Fusion ioScale...

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SDRAM Chips support industrial applications.

SDRAM Chips support industrial applications.

Operating on standard supply voltage of 3.3 V, SDRAM Chips are available in capacities from 256–512 Mb. Model with 256 Mb capacity is available in x8 and x16 configurations, while 512 Mb version comes in x16 configuration. In addition to standard 54-pin TSOP-II package, all products are alsoÂ- offered in 8 x 8 mm 54-ball FBGA package. Pin-outs, timings, and functionalities are...

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Transcend to Showcase Its Advanced Industrial Solutions at Integrated Systems Europe 2014

New Delhi – Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, announced it will be attending Integrated Systems Europe (ISE) 2014, which will take place at the Amsterdam RAI Exhibition and Convention Centre in Amsterdam, the Netherlands, 4-6 February. Throughout the exhibition, Transcend will display a wide range of industrial-grade products from SSDs...

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Embedded SSD includes 10-pin eUSB Modules and eUSB Keys.

Designed for to meet requirements of intelligent embedded systems, TuffDriveÂ-® eUSB products include 32 GB, SLC-based, 10-pin eUSB module and fully locked bill-of-material eUSB keys. Products offer solutions for primary and boot storage in networking, server, embedded, industrial, and transportation applications. While modules deliver respective sustained read/write speeds of 37 and 35 MBps,...

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Future Electronics Offers Availability of Digi International ConnectCore Modules

Pointe Claire, QuebecÂ- – Future Electronics, a global leading distributor of electronic components, is pleased to announce availability of ConnectCore Modules from Digi International. The ConnectCore i.MX51 module family comprises high performance 800 MHz frequency 128 MB for Flash and 128 RAM Memory 802.11 Standard Core Wi-Fi. These modules combine the fast integration, reliability and...

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Bipolar PROMs serve as drop-in replacements for OEM devices.

Manufactured on bipolar process, PROM Series has 4 members ranging in size from 2K (512 x 8) to 16K (2K x 8), with speeds from 90–125 ns. Units are One-Time Programmable devices, offering on-chip address decoding without separate fusing pins, 3-state outputs, and full TTL-compatibility. Available in variety of ceramic packages, including Leadless Chip Carriers, Dual Inline Packages, and...

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