Dicing Services

Dicing Services

Quik-Pak Announces Installation of Wafer Dicing Saw

SAN DIEGO, Nov. 1 -- Quik-Pak, a division of Delphon Industries and leader in quick-turn integrated circuit (IC) prototype packaging, has announced the installation of a new 200mmm Disco Automatic Wafer Dicing Saw in it's recently expanded facilities in San Diego. The new in-house capability complements Quik-Pak's existing rapid turn IC assembly service offerings, which include die bonding, gold...

Read More »

All Topics