Dicers

Wafer Dicing System processes wafers up to 6 in. dia.
Dicers

Wafer Dicing System processes wafers up to 6 in. dia.

ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLED® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Â-µm.

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