Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing Tool
Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of...
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Wafer Dicing System processes wafers up to 6 in. dia.
ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLEDÃ-® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Ã-µm.
Read More »Choosing the Right Load Ring for Your Needs
A Temper® Load Ring, also known as a Constant Force Adjustable Spacer, is a precision ring designed to perform as a predictable constant force element. It is fabricated from ductile, high strength stainless alloys.
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Optimize Your Workforce with Weavix™ by PK Industrial
The Weavix™ platform takes productivity, quality, and visibility to a new level by providing better communication and real-time KPIs. Check out the video to learn more!
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