Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing Tool
Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of...
Read More »Wafer Dicing System processes wafers up to 6 in. dia.
ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLEDÃ-® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Ã-µm.
Read More »Metal Stamping for Lighting and Electronics Applications
This white paper provides an in-depth look into metal stamping for lighting and electronics applications.
Read More »Locon Sensors Withstand Extreme Temperatures
Locon Sensor Systems offer robust sensor solutions for even the most severe environmental conditions. Their line of high-temp inductive sensors and their cylindrical photoelectric series can operate in temperatures up to 250 degrees Celsius. See our video to learn more.
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