Dicers

Laser Cutting Services

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These...

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Dicers

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New Jersey—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software...

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Dicers

Die-Singulation System features plasma-based operation.

Utilizing energized plasma, MicroDieSingulator (MDS)-100 systems deliver singulation of semiconductor dies from 4, 6, and 8 in. wafers mounted on industry-standard tape frames. Singulation (dicing) of individual dies can be achieved with separation lines (streets) of 20 microns or less, maximizing utilization of silicon-wafer real-estate. Also, MDS technology separates dies without causing...

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Chemical Machining

Morgan Technical Ceramics Announces High Volume Precision Piezoelectric Material Manufacturing

Morgan Technical Ceramics (MTC) announced that its ElectroCeramics manufacturing site in Bedford, Ohio designs and manufactures a comprehensive range of precision piezoelectric ceramic components made of lead zirconate titanate (PZT) for use in aerospace, medical, industrial, commercial and consumer sensor and actuator applications. The company can produce intricate piezoelectric designs that...

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Foodservice Cutters and Cutting Machinery

Deville Technologies Introduces the FAM Hymaks Dicer/Strip-Cutter: a New Standard in Food Safety

Deville Technologies Inc. today announced the addition of the USDA accepted FAM Hymaks Dicer/Strip-Cutter to its line of premium quality industrial food cutting machines. Deville worked closely with its Belgian partner, FAM, to design a machine that would comply with the most stringent food safety regulations. Developed specifically for the cheese and meat industries, the Hymaks is a...

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Dicers

Precision Dicing System handles ultra-hard materials.

Fully programmable, Accu-Cut(TM) Model 5255-X diamond dicing system accommodates ceramics, ferrites, and quartz as well as semiconductor materials - silicon, gallium arsenide, and bismuth telluride - up to 6 x 6 x 1 in. in production quantities. Variable-speed spindle with 0-10,000 rpm control is standard, and menu-driven software enables operator to enter cut profile for repetitive dicing....

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Light Emitting Diodes (LED)

JPSA Awarded LED Wafer Scribing Process Patent

Manchester, New Hampshire, USA - J. P. Sercel Associates Inc. (JPSA), the world's leading designer, supplier, and systems integrator of laser materials processing workstations, has been awarded a patent for its front-side laser scribing technique for LED wafers. The patent is applicable in Korea. The patented technique involves the use of a unique laser energy distribution technique, allowing...

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Dicers

Increased Dicing Capacity by Ion Beam Milling, Inc.

Ion Beam Milling, Inc. of Manchester New Hampshire a manufacture of Laser Diode Submounts and Thin Film circuits; is happy to announce we have further increased our dicing capacity with a purchase of a 3rd Disco dicing system. Due to increasing customer orders the addition of the 3rd Disco dicing system positions Ion Beam Milling to well serve it's current customers as well as prepare for future...

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Waterjet Cutters and Cutting Machinery

Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing Tool

Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of...

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Dicers

Dicing System handles 100 mm sapphire wafers.

IX-200 Chromadice(TM) DPSS UV laser wafer singulation system can process 4 x 100 mm sapphire wafers/hr and is also suitable for wafer trimming and scribing. Providing 360° rotation, high-accuracy Z-theta capable air bearing stages enable continuous or limited travel, and include cog-free motor, zero gear backlash, and low wobble and bearing run-out. Unit achieves cuts down to 2.5 microns...

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