Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing Tool
Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of...
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Wafer Dicing System processes wafers up to 6 in. dia.
ChromaDice(TM) IX-300 UV Laser Wafer Processing System features ProtectoLEDÃ-® Technology, which is based on water-soluble protective coating that prevents contamination of wafer during dry-etch process. Utilizing UV-DPSS laser technology at 355 or 266 nm wavelengths, system operates at cut rates up to 150 mm/sec on GaAs wafers, with kerf widths down to 2.5 Ã-µm.
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6 Reasons to Consider Hydroforming over Traditional Metal Stamping
To learn more about the functions of the hydroforming process, the key differences from other processes, and why it is preferable over other stamping options, download this eBook now.
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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.
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