Deposition Systems

ALD Systems enable production-scale coating of powders.

Designed to fit PICOSUN™ P-300 reactor frame, POCA™ 300 powder cartridge is constructed based on POCA 200 powder coating system with which Atomic Layer Deposition (ALD) coatings have been manufactured on several types of powderous carriers. ALD systems are equipped with Picovibe™ to ensure uniform and conformal ALD film formation around every single particle in batch. Coatings enable such...

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Picosun Develops ALD for Graphene-Based Displays and Electronics

ESPOO, Finland - Picosun Oy, a leading Atomic Layer Deposition (ALD) equipment manufacturer teams up with several prominent European nanotechnology companies and research institutes to develop novel, graphene-based solutions for display manufacturing, flexible electronics, and electronic component industries. With its phenomenal physical properties, such as excellent heat and electrical...

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Angstrom Engineering Keeps a Keen Eye on the Future

Angstrom Engineering Keeps a Keen Eye on the Future

Thin film is probably one of the most well-used and least well-known technologies in the world (contributing to everyday-uses such as televisions and corrective eyewear).Â-  As a company catering to the realm of research and development in the thin film industry, Angstrom Engineering, Inc. has been fortunate enough to be a participant in many revolutionary ideas – some, such as the...

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DSI Announces Specialized LPCVD Thin Film Coating Process for Complex Shapes/Surfaces

DSI Announces Specialized LPCVD Thin Film Coating Process for Complex Shapes/Surfaces

DSI Announces Specialized LPCVD Thin Film Coating Process for Complex Shapes/Surfaces Santa Rosa, CA - Deposition Sciences, Inc. (DSIÂ-®), global manufacturer of highly durable thin film optical coatings, announces the enhanced capability to apply highly specialized, durable coatings onto extremely complex shapes and multifaceted surfaces. Utilizing DSI's proprietary IsoDyn(TM) LPCVD (low...

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PECVD System supports sub-28 nm dielectric films.

Incorporating interface engineering to minimize RC delay constant without changing materials, VECTORÂ-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...

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Thin Film Vacuum Deposition Cluster Tool Delivered to Naval Research Laboratory

Clairton, PA. - Kurt J. Lesker Company recently shipped a multi-technique, production grade cluster tool to the Naval Research Laboratory in Washington, DC. Various stations of the cluster tool operate in high and ultra high vacuum and make use of advanced physical vapor deposition (PVD) processes, including magnetron sputtering, electron beam and thermal evaporation, and ion assisted deposition...

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Dielectric Deposition System is designed for 3D chip packaging.

Dielectric Deposition System is designed for 3D chip packaging.

Applied ProducerÂ-® InVia(TM) dielectric deposition system uses CVD process to deposit uniform, thick oxide films in greater than 10:1 high aspect ratio (HAR) through-silicon via (TSV) structures. Process also enables electrical isolation of TSV to ensure reliable performance. For 3D packaging schemes, it electrically connects chips that are vertically stacked to boost speed and lower power...

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Parylene Chemical Vacuum Deposition Systems

Aliso Viejo, California (January 5, 2009) - Para Tech Coating Inc. (PTC) manufactures three standard models of high quality automated Parylene vacuum deposition systems, from compact bench top units ideal for lab and R&D use through large scale production systems that can be customized to specific application needs. Parylene (di-para-xylylene) provides ultra-thin, pin-hole free, and hydrophobic...

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