Deposition Systems

Thin-Film Coating Services

Ceramic Materials Help Manufacturers of Thin Film Photovoltaic Cells

The earth benefits from an impressive 125,000 terawatts (TW) of solar energy. While the future energy needs of the planet will undoubtedly be met with a combination of technologies, many believe that solar - in the form of photovoltaic (PV) cells - is the only renewable energy source with the capacity to make a significant impact on global energy production. As a result, the race is on to push...

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Deposition Systems

Intevac Receives Lean Solar(TM) Order

First Silicon Solar Cell LEAN SOLAR(TM) Order SANTA CLARA, Calif.,- Intevac, Inc. (Nasdaq:IVAC) announced today it has received an order for a LEAN SOLAR(TM) deposition system for shipment in the first quarter of 2011. We are pleased to announce this purchase order from a new customer for use in the manufacturing of crystalline silicon solar cells," commented Kevin Fairbairn, president and chief...

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Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications
Coatings

Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications

Dielectric films deposited on the VECTOR® platform demonstrate ALD-like step coverage with furnace-quality film properties SAN JOSE, Calif. -- Novellus Systems (NASDAQ:NVLS) announced today that it has developed conformal film deposition (CFD(TM)) technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology...

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Deposition Systems

Applied Materials Leads the Way to Enable TSV Interconnects for 3D Chip Stacking

o TSVs are a key driver of 3D chip packaging for future mobile communications devices o Applied introduces latest innovation for TSV production with Producer Avila system o Applied is first to integrate full portfolio of systems for fabricating TSVs in 3D-ICs SEMICON West 2010 SANTA CLARA, Calif.--Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via...

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Dielectric Deposition System is designed for 3D chip packaging.
Semiconductor Processing Equipment

Dielectric Deposition System is designed for 3D chip packaging.

Applied Producer® InVia(TM) dielectric deposition system uses CVD process to deposit uniform, thick oxide films in greater than 10:1 high aspect ratio (HAR) through-silicon via (TSV) structures. Process also enables electrical isolation of TSV to ensure reliable performance. For 3D packaging schemes, it electrically connects chips that are vertically stacked to boost speed and lower power...

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Abatement System suits solar cell, flat panel manufacturing.
Exhaust Systems

Abatement System suits solar cell, flat panel manufacturing.

Featuring integrated wet scrubbing system, Spectra ZW is used for abating deposition and clean gases used in high gas flow chemical vapor deposition process steps in solar and flat panel manufacturing. High-flow particulate and acid gas capture and processing are provided in one standalone system, which can also be integrated into Zenith for custom-built abatement and vacuum pump design. Greater...

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Plasmadust - Metallization and Coating of Substrates - Chemical-Free and Power-Efficient
Coating Equipment

Plasmadust - Metallization and Coating of Substrates - Chemical-Free and Power-Efficient

Reinhausen Plasma presents world first at the productronica Whether temperature-sensitive plastics, metals, silicium disks, glass, foil or paper - for the first time, Reinhausen Plasma GmbH's patented plasmadust technology permits almost all materials to be metallized and coated without solvents and with extreme power efficiency. The basis of the coating procedure developed by this Regensburg...

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Thin-Film Coating Services

New SAFC Hitech® Product Roadmap Plots Route for Future Generation Semiconductor Materials

ST. LOUIS and SAN FRANCISCO, July 15 -- SEMICON West -- SAFC Hitech , a business segment within SAFC , a member of the Sigma-Aldrich Group, today announced details of its new materials roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD) processes on silicon semiconductor substrates. The roadmap outlines the development paths across current and future...

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Coatings

Parylene Chemical Vacuum Deposition Systems

Aliso Viejo, California (January 5, 2009) - Para Tech Coating Inc. (PTC) manufactures three standard models of high quality automated Parylene vacuum deposition systems, from compact bench top units ideal for lab and R&D use through large scale production systems that can be customized to specific application needs. Parylene (di-para-xylylene) provides ultra-thin, pin-hole free, and hydrophobic...

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Thin-Film Coating Services

CVD Film extends gap-fill technology to 32 nm and beyond.

Extending HARP SACVD® gap-fill technology for critical STI2 device structures to 32 nm and beyond, Applied Producer® eHARP(TM) system delivers void-free films to fill less than 30 nm, greater than 12:1 aspect ratio features. High-density, strain-inducing films enable scaling of conventional planar and emerging 3D device structures. Virtually carbon-free, eHARP film requires no...

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