Custom Manufacturing Services

Controls and Controllers

Granger Plastics Pursues Sandsaver as a Tool to Ease the Pain of the Gulf Oil Spill

All across the globe, people are keeping a close eye on the problems caused by the oil spill in the Gulf of Mexico. The oil has caused and compounded numerous problems for wildlife, tourism and the economy in the affected areas. Though BP claims to be committed to the responsibility of cleaning up the mess, there will be decades of recovery ahead. Inevitably funding for this recovery will...

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Packaging Services

KitPackers Offers 3MTM Repackaging Capability

GERMANTOWN, WI - KitPackers®, an Ellsworth Company, recently announced an agreement to be a 3MTM adhesive repackager. This agreement provides the 3MTM Industrial Adhesives and Tapes Division with custom modification and packaging solutions for a wide range of one or two-component 3MTM Liquid Adhesive products such as epoxies, acrylics, urethanes, and premixed and frozen. The streamlined...

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ITT Corporation Presents Endicott Interconnect Technologies, Inc. Certificate of Appreciation
Assembly Services

ITT Corporation Presents Endicott Interconnect Technologies, Inc. Certificate of Appreciation

ENDICOTT, NY - July 7, 2010 - ITT Corporation Presents Endicott Interconnect Technologies, Inc. Certificate of Appreciation Successful delivery of complex, mixed materials PC board leads to EI's permanent status on ITT's approved supplier list ITT Corporation presented Endicott Interconnect Technologies, Inc. (EI) with a Certificate of Appreciation plaque for the EI team's support of the Thin...

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Engineering Services

Foundry Service adds integrated passive device process technology. .

Building upon HighQ(TM) copper on silicon integrated passive device (IPD) technology, HighQ IPD2 process utilizes 8 in. wafer technology and features second 5 Â-µm copper layer that promotes inductor performance and flexibility. It supports design of precise IPDs for RF system in package applications in portable electronics equipment. Typical designs include baluns, low pass filters, band...

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See the Newest Mitsubishi Technology at IMTS 2010
Machining

See the Newest Mitsubishi Technology at IMTS 2010

EDM, Waterjet and High-Speed Vertical Machining at Booth E-4920 Wood Dale, IL - MC Machinery Systems, Inc. will display several product lines at IMTS. Mitsubishi backs its supply chain of complementary technologies with industry-leading service and support. See the newest in EDM, waterjet and high-speed vertical machining at IMTS booth E-492. The FA20S Advance wire EDM features an advanced M700...

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Machining

EDM Notch Machining Service makes notches down to 0.010 in. wide.

Helping gas cylinder manufacturers meet production requirements, Straton machines EDM notches to customer specific length, width, and depth in wide range of conductive materials including titanium, tantalum, carbide, molybdenum, brass, copper, and aluminum. Size and location verification are provided for identifying position of these calibration flaws.

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Polymide and PEEK(TM) Materials are fully machinable.
Molding Services

Polymide and PEEK(TM) Materials are fully machinable.

Duratron® D7000 polyimide (PI) material is offered for applications that require thermal performance in 600°F range and are available variety of sheet thicknesses and tube configurations. Homogeneous Semitron® MP370 (modified PEEK) lets builders tailor socket material to application environment and is not subject to soft center or inconsistent physical properties found in...

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Software

Embedded Network Platform supports LIN communication bus.

NI-XNET platform is available with PXI-8516 and PCI-8516 LIN interfaces, which enable engineers and scientists to develop Local Interconnect Network (LIN) applications in LabVIEW, LabWindows(TM)/CVI, and C/C++ for Windows® and LabVIEW RTOSs. While providing integrated support for importing and using signals from LDF databases, interfaces employ NI-XNET device-driven DMA engine for coupling...

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SMT RF Chipset targets point-to-point radio markets.
Assembly Services

SMT RF Chipset targets point-to-point radio markets.

Covering 38 and 42 GHz bands, SMT/WSD chipset integrates into point-to-point backbone radios. It includes high-directivity power detector in 0402 wafer scale package, up-converter with variable gain amplifier for 24 dB gain control, and 20 dB power amplifier with 1 W output. Buffer and multiplier, as well as low-noise receiver/down-converter (with noise figure under 4.5 dB), are also included....

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