MCU IP Core (32-Bit) serves low-power embedded applications.
Featuring 32-bit modern RISC architecture with sixteen 32-bit registers and 5-7 stage pipeline, APS3R delivers 1.21 CoreMarks/MHz and 2.29 DMIPS/MHz computational performance. CPU's dynamic power is 11.6 -µW/MHz with standard 90 nm process and 16.8 µW/MHz for 130 nm (both UMC). Able to be as small as 8,700 gates, this native 32-bit core, optimised for use with C or C++, is available with...
Read More »MCU IP Core (32-Bit) serves low-power embedded applications.
Featuring 32-bit modern RISC architecture with sixteen 32-bit registers and 5-7 stage pipeline, APS3R delivers 1.21 CoreMarks/MHz and 2.29 DMIPS/MHz computational performance. CPU's dynamic power is 11.6 Ã-µW/MHz with standard 90 nm process and 16.8 õW/MHz for 130 nm (both UMC). Able to be as small as 8,700 gates, this native 32-bit core, optimised for use with C or C++, is available...
Read More »
Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal
Wokingham, UK - EnSilica, a leading independent provider of IC design services and system solutions, has announced that Xtendwave has licensed its high-performance eSi-3200 32-bit processor core to power Everset(TM), Xtendwave's time code receiver solution for the next-generation WWVB atomic timekeeping signal. The new signal, broadcast by NIST (the National Institute of Standards and...
Read More »
Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal
Wokingham, UK - EnSilica, a leading independent provider of IC design services and system solutions, has announced that Xtendwave has licensed its high-performance eSi-3200 32-bit processor core to power Everset(TM), Xtendwave's time code receiver solution for the next-generation WWVB atomic timekeeping signal. The new signal, broadcast by NIST (the National Institute of Standards and...
Read More »
Ten Important Questions to Ask Before Selecting a Sign Company
This white paper outlines 10 questions that should be asked when selecting a sign company, eliminating some of the guesswork from making the best choice for your branding and signage needs.
Read More »Come Explore the VIA Smart Ecosystem at Computex 2012
VIA to demonstrate a wide range of next generation Smart Solutions for a truly interconnected world Taipei, Taiwan - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly...
Read More »Come Explore the VIA Smart Ecosystem at Computex 2012
VIA to demonstrate a wide range of next generation Smart Solutions for a truly interconnected world Taipei, Taiwan - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly...
Read More »IC-Logic Licenses Arteris FlexNoC and C2C Interconnect IP for Automotive Systems on Chip
Network on Chip interconnect IP enables shorter design time and expands product market SUNNYVALE, Calif. - Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that iC-Logic has selected ArterisÃ-® FlexNoCî network on chip interconnect IP and C2C chip-to-chip interconnect IP for systems-on-chip (SoCs) targeting high end...
Read More »IC-Logic Licenses Arteris FlexNoC and C2C Interconnect IP for Automotive Systems on Chip
Network on Chip interconnect IP enables shorter design time and expands product market SUNNYVALE, Calif. - Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that iC-Logic has selected Arteris-® FlexNoC® network on chip interconnect IP and C2C chip-to-chip interconnect IP for systems-on-chip (SoCs) targeting high end automotive...
Read More »Qualcomm Announces Roadmap and Resources Supporting the 'Internet of Everything'
- Chips Include 1X, EV-DO, HSPA, LTE, Wi-Fi and HomePlug Green PHY Technologies, with More than 100 Third Party Solutions Now Available for Developers at M2MSearch.com - NEW ORLEANS - Qualcomm Incorporated (NASDAQ: QCOM), the world leader in 3G and next-generation mobile technologies, today announced that vendors have released more than 100 cellular and connectivity solutions for the emerging...
Read More »Qualcomm Announces Roadmap and Resources Supporting the 'Internet of Everything'
- Chips Include 1X, EV-DO, HSPA, LTE, Wi-Fi and HomePlug Green PHY Technologies, with More than 100 Third Party Solutions Now Available for Developers at M2MSearch.com - NEW ORLEANS - Qualcomm Incorporated (NASDAQ: QCOM), the world leader in 3G and next-generation mobile technologies, today announced that vendors have released more than 100 cellular and connectivity solutions for the emerging...
Read More »
Trotec Laser Offers Customizable Industrial Laser Marking Solutions for Any Application
Trotec's laser marking solutions provide your company with configurable workstations and intuitive, customizable software. Check out our video to learn more.
Read More »
