Cores

Cores

MCU IP Core (32-Bit) serves low-power embedded applications.

Featuring 32-bit modern RISC architecture with sixteen 32-bit registers and 5-7 stage pipeline, APS3R delivers 1.21 CoreMarks/MHz and 2.29 DMIPS/MHz computational performance. CPU's dynamic power is 11.6 -µW/MHz with standard 90 nm process and 16.8 µW/MHz for 130 nm (both UMC). Able to be as small as 8,700 gates, this native 32-bit core, optimised for use with C or C++, is available with...

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Cores

MCU IP Core (32-Bit) serves low-power embedded applications.

Featuring 32-bit modern RISC architecture with sixteen 32-bit registers and 5-7 stage pipeline, APS3R delivers 1.21 CoreMarks/MHz and 2.29 DMIPS/MHz computational performance. CPU's dynamic power is 11.6 Â-µW/MHz with standard 90 nm process and 16.8 µW/MHz for 130 nm (both UMC). Able to be as small as 8,700 gates, this native 32-bit core, optimised for use with C or C++, is available...

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Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal
Signal Processors

Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal

Wokingham, UK - EnSilica, a leading independent provider of IC design services and system solutions, has announced that Xtendwave has licensed its high-performance eSi-3200 32-bit processor core to power Everset(TM), Xtendwave's time code receiver solution for the next-generation WWVB atomic timekeeping signal. The new signal, broadcast by NIST (the National Institute of Standards and...

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Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal
Signal Processors

Xtendwave Selects EnSilica's eSi-3200 Processor for the Receiver IC Implementing NIST's Next-Generation WWVB Atomic Timekeeping Signal

Wokingham, UK - EnSilica, a leading independent provider of IC design services and system solutions, has announced that Xtendwave has licensed its high-performance eSi-3200 32-bit processor core to power Everset(TM), Xtendwave's time code receiver solution for the next-generation WWVB atomic timekeeping signal. The new signal, broadcast by NIST (the National Institute of Standards and...

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Miscellaneous Software

Come Explore the VIA Smart Ecosystem at Computex 2012

VIA to demonstrate a wide range of next generation Smart Solutions for a truly interconnected world Taipei, Taiwan - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly...

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Miscellaneous Software

Come Explore the VIA Smart Ecosystem at Computex 2012

VIA to demonstrate a wide range of next generation Smart Solutions for a truly interconnected world Taipei, Taiwan - VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced its attendance at Computex 2012, showcasing the VIA Smart Ecosystem which demonstrates how VIA is leading the way in the creation of next generation Smart Solutions for a truly...

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Cores

IC-Logic Licenses Arteris FlexNoC and C2C Interconnect IP for Automotive Systems on Chip

Network on Chip interconnect IP enables shorter design time and expands product market SUNNYVALE, Calif. - Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that iC-Logic has selected ArterisÂ-® FlexNoC® network on chip interconnect IP and C2C chip-to-chip interconnect IP for systems-on-chip (SoCs) targeting high end...

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Cores

IC-Logic Licenses Arteris FlexNoC and C2C Interconnect IP for Automotive Systems on Chip

Network on Chip interconnect IP enables shorter design time and expands product market SUNNYVALE, Calif. - Arteris Inc., the inventor and leading supplier of network-on-chip (NoC) interconnect IP solutions, today announced that iC-Logic has selected Arteris-® FlexNoC® network on chip interconnect IP and C2C chip-to-chip interconnect IP for systems-on-chip (SoCs) targeting high end automotive...

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Cores

Qualcomm Announces Roadmap and Resources Supporting the 'Internet of Everything'

- Chips Include 1X, EV-DO, HSPA, LTE, Wi-Fi and HomePlug Green PHY Technologies, with More than 100 Third Party Solutions Now Available for Developers at M2MSearch.com - NEW ORLEANS - Qualcomm Incorporated (NASDAQ: QCOM), the world leader in 3G and next-generation mobile technologies, today announced that vendors have released more than 100 cellular and connectivity solutions for the emerging...

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Cores

Qualcomm Announces Roadmap and Resources Supporting the 'Internet of Everything'

- Chips Include 1X, EV-DO, HSPA, LTE, Wi-Fi and HomePlug Green PHY Technologies, with More than 100 Third Party Solutions Now Available for Developers at M2MSearch.com - NEW ORLEANS - Qualcomm Incorporated (NASDAQ: QCOM), the world leader in 3G and next-generation mobile technologies, today announced that vendors have released more than 100 cellular and connectivity solutions for the emerging...

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