Cores

Beken License CEVA Bluetooth 2.1+EDR and 4.0 IP for Low Power Bluetooth Product Families

CEVA-Bluetooth platforms provide Beken with cost-efficient, highly-integrated solutions for Bluetooth-enabled ICs MOUNTAIN VIEW, Calif. - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Beken Corporation, a leading IC supplier for wireless applications in China, has licensed CEVA's Bluetooth 2.1+EDR and...

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Dongbu HiTek and Cortus to Develop Joint Platform Solution for the Microcontroller (MCU) Market

Korean foundry Dongbu HiTek and French IP provider Cortus are to develop a design platform combining Dongbu HiTek's embedded flash technology and Cortus processor and peripheral IP. Montpellier, France and Seoul, Korea - Cortus, a technology leader in cost effective, silicon efficient, 32-bit processor IP, and speciality foundry Dongbu HiTek, announce that they are teaming up to offer platform...

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Atmel Expands Third-Party Ecosystem of Tools and Software Partners for Recently Launched ARM Cortex-A5 Processor-Based Family

Designers Gain Quick Access to a Variety of Easy-to-Use Tools Utilizing Android, Embedded Linux or Real-Time Operating Systems for Faster Time to Market NUREMBERG, Germany - Embedded World 2013, Atmel-® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has expanded its third-party ecosystem of tools and software partners for...

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Qualcomm Snapdragon 800 Processor First to Use TSMC's 28HPM Advanced Process Technology

Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices SAN DIEGO and HSINCHU, Taiwan, R.O.C. - Qualcomm Incorporated (NASDAQ: QCOM) and TSMC (TWSE: 2330, NYSE: TSM) today announced that Qualcomm's wholly owned subsidiary, Qualcomm Technologies, Inc., will be the first company to produce working silicon on TSMC's 28nm HPM (High Performance Mobile)...

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Atmel Showcases Smart, Connected Applications from the Lab to the Digital Living Room at Embedded World 2013

- Meet Our Technology Experts at EW Nuremberg, Germany, at Hall 5-Stand 5-311 - Atmel Technology Experts to Speak on Building an Intelligent Lighting Control Network, Ultra-low Power System Designs and Automotive Applications NUREMBERG, Germany - Embedded World 2013, Atmel-® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company...

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Allegro DVT Showcases Its HEVC/H.265 Video Decoder IP at Mobile World Congress 2013

GRENOBLE, France - HEVC (aka High Efficiency Video Coding ) is the next generation video standard, developed by the JCT-VC team. JCT-VC is a joint team between MPEG and VCEG. The HEVC standard, finalized in January 2013, will bring 50% bit rate savings compared to equivalent H.264/AVC encodings. At the Mobile World Congress, Allegro DVT will present on its booth: HEVC/H.265 Hardware Decoding IP,...

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Streamlined Development of 2G, 3G and 4G Radio Access Systems with High Performance Analog Wideband Transceiver and Advanced Radio IP

Streamlined development of 2G, 3G and 4G radio access systems with high performance analog wideband transceiver and advanced radio IP SAN JOSE, Calif. - Xilinx, Inc., (NASDAQ: XLNX) today announced the availability of a high performance development solution for designing next-generation heterogeneous wireless networks, such as high-end picocells, microcells, macrocells, and active antenna arrays....

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CEVA Introduces MUST(TM) Multi-Core System Technology, Adds Vector Floating-Point Capabilities for CEVA-XC DSP Architecture Framework

Architecture framework further enriched with full support for ARM-® AXI4 specification, AMBA 4 ACE cache coherency and a broad range of optimized tightly coupled extensions for wireless applications MOUNTAIN VIEW, Calif. - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced a suite of advanced- processor and...

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FPGA Evaluation Kit enables small form factor designs.

FPGA Evaluation Kit enables small form factor designs.

Equipped with All Programmable Artix-7 200T device,- Artix™-7 FPGA AC701 Evaluation Kit has IP and reference design tools- needed to accelerate design cycle. Artix-7 FPGA, featuring analog mixed signal, DDR3, DSP resources, parallel and serial I/O, provides optimal performance for low-end remote radio head, mobile backhaul, software defined radio, and motor control applications.- Kit also...

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Configurable Embedded Processors support embedded RTOS.

Scalable from 16 to 32-bits and starting from as low as 8.5k gates, eSi-RISC configurable soft processor cores- support Phoenix-RTOS for single- and multi-core embedded systems applications. Embedded RTOS is capable of fully utilizing eSi-RISC’s hardware MMU with memory protection and security features, such as data execution protection. Also, fully re-entrant and pre-emptive kernel of RTOS...

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