Cores

Miscellaneous Software

Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process

Multi-protocol PHY supports PCI Express 2.0, PCI Express 3.0, USB 3.0 and SGMII specifications SAN JOSE, Calif.- – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its multi-protocol Serializer/Deserializer (SerDes) PHY IP for PCI Express® (PCIe®) 2.0 and PCIe 3.0 technology for TSMC's 16nm FinFET Plus (16FF+) process have passed PCI-SIG® compliance testing. The...

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Miscellaneous Software

Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process

Multi-protocol PHY supports PCI Express 2.0, PCI Express 3.0, USB 3.0 and SGMII specifications SAN JOSE, Calif.Â- – Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its multi-protocol Serializer/Deserializer (SerDes) PHY IP for PCI Express® (PCIe®) 2.0 and PCIe 3.0 technology for TSMC's 16nm FinFET Plus (16FF+) process have passed PCI-SIG® compliance...

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Cores

EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM® Processor Optimized for High-Performance Networking Applications

Offering Best Application Density, Scalability and Power Efficiency for Data-Center and Carrier Networks YOKNEAM, Israel – Introducing the TILE-Mx, a new family of multicore processors featuring an unmatched combination of high-performance processing, throughput and efficiency: - Â Â Â Â Â Â  - One hundred 64bit ARM CPU cores in one chip for highest compute power...

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Cores

EZchip Introduces TILE-Mx100 World's Highest Core-Count ARM-® Processor Optimized for High-Performance Networking Applications

Offering Best Application Density, Scalability and Power Efficiency for Data-Center and Carrier Networks YOKNEAM, Israel – Introducing the TILE-Mx, a new family of multicore processors featuring an unmatched combination of high-performance processing, throughput and efficiency: Â- Ã‚ Â Â Â Â Â  - One hundred 64bit ARM CPU cores in one chip for highest...

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Cores

Mindtree Enables Next Generation Bluetooth® Low Energy Chips at Cypress

WARREN, N.J. and BANGALORE Provides High-Performance, Low-Power Connectivity to Programmable SoC Solutions Mindtree , a global technology services company, today announced that its BlueLitE Bluetooth-® intellectual property (IP) has been incorporated into the newPSoC® 4 BLE and PRoC™ BLE system-on-chip products from Cypress Semiconductor Corp., a leading provider of programmable solutions....

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Cores

Mindtree Enables Next Generation Bluetooth-® Low Energy Chips at Cypress

WARREN, N.J. and BANGALORE Provides High-Performance, Low-Power Connectivity to Programmable SoC Solutions Mindtree , a global technology services company, today announced that its BlueLitE BluetoothÂ-® intellectual property (IP) has been incorporated into the newPSoC® 4 BLE and PRoC™ BLE system-on-chip products from Cypress Semiconductor Corp., a leading provider of programmable...

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Vision and Imaging Sensors / Detectors

CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs

CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth Wi-Fi technologies; Visit CEVA at booth A50, hall 6 MOUNTAIN VIEW, Calif.- – CEVA, Inc. (NASDAQ: CEVA),...

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Vision and Imaging Sensors / Detectors

CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs

CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth Wi-Fi technologies; Visit CEVA at booth A50, hall 6 MOUNTAIN VIEW, Calif.Â- – CEVA, Inc. (NASDAQ:...

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Modems

Xilinx and BEEcube Deliver World's First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications

Xilinx 256QAM millimeter wave modem IP integrated on the BEEcube BEE7 baseband platform provides complete out of the box" solution for wideband backhaul prototyping SAN JOSE, Calif. –- Xilinx, Inc. (NASDAQ: XLNX) and BEEcube today announced they have delivered the world's first millimeter wave (mmWave) prototyping platform solution for pioneering development of 5G applications. Xilinx's newest...

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Modems

Xilinx and BEEcube Deliver World's First Millimeter Wave Prototyping Platform Solution for Pioneering Development of 5G Applications

Xilinx 256QAM millimeter wave modem IP integrated on the BEEcube BEE7 baseband platform provides complete out of the box" solution for wideband backhaul prototyping SAN JOSE, Calif. –Â- Xilinx, Inc. (NASDAQ: XLNX) and BEEcube today announced they have delivered the world's first millimeter wave (mmWave) prototyping platform solution for pioneering development of 5G applications. Xilinx's...

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