Interconnect Fabric IP cuts SoC development time.
Embedded within FlexNoC interconnect IP fabric, FlexNoC Composition feature allows SoC architecture to be subdivided for implementation by various specialist design teams, each working independently on their own subsystem. Once all subsystems are complete, each can be integrated into one complete full chip-level FlexNoC interconnect fabric without requiring bridges. Unlike hybrid bus or crossbar,...
Read More »Leading European Service Provider SFR Launches Hybrid Set-Top Box for Both Broadcasting and Streaming with Google Services for Smart TV Powered by Marvell's ARMADA 1500 Plus HD Media Platform
Marvell's award-winning SoC platform powers Europe's first hybrid set-top box offering Google services for Smart TV SANTA CLARA, Calif. - Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that European leading service provider, SFR, has launched its hybrid set-top box powered by Marvell's ARMADAÃ-® 1500 Plus (88DE3108) system-on-chip (SoC) platform....
Read More »Atmel Expands Third-Party Ecosystem of Tools and Software Partners for Recently Launched ARM Cortex-A5 Processor-Based Family
Designers Gain Quick Access to a Variety of Easy-to-Use Tools Utilizing Android, Embedded Linux or Real-Time Operating Systems for Faster Time to Market NUREMBERG, Germany - Embedded World 2013, AtmelÃ-® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has expanded its third-party ecosystem of tools and software partners...
Read More »Qualcomm Snapdragon 800 Processor First to Use TSMC's 28HPM Advanced Process Technology
Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices SAN DIEGO and HSINCHU, Taiwan, R.O.C. - Qualcomm Incorporated (NASDAQ: QCOM) and TSMC (TWSE: 2330, NYSE: TSM) today announced that Qualcomm's wholly owned subsidiary, Qualcomm Technologies, Inc., will be the first company to produce working silicon on TSMC's 28nm HPM (High Performance Mobile)...
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Polymer Protection For Optical Fiber
To learn more about the challenges your optical fibers face, and which polymers are best to protect them, download this white paper.
Read More »Atmel Showcases Smart, Connected Applications from the Lab to the Digital Living Room at Embedded World 2013
- Meet Our Technology Experts at EW Nuremberg, Germany, at Hall 5-Stand 5-311 - Atmel Technology Experts to Speak on Building an Intelligent Lighting Control Network, Ultra-low Power System Designs and Automotive Applications NUREMBERG, Germany - Embedded World 2013, AtmelÃ-® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the...
Read More »Streamlined Development of 2G, 3G and 4G Radio Access Systems with High Performance Analog Wideband Transceiver and Advanced Radio IP
Streamlined development of 2G, 3G and 4G radio access systems with high performance analog wideband transceiver and advanced radio IP SAN JOSE, Calif. - Xilinx, Inc., (NASDAQ: XLNX) today announced the availability of a high performance development solution for designing next-generation heterogeneous wireless networks, such as high-end picocells, microcells, macrocells, and active antenna arrays....
Read More »Allegro DVT Showcases Its HEVC/H.265 Video Decoder IP at Mobile World Congress 2013
GRENOBLE, France - HEVC (aka High Efficiency Video Coding ) is the next generation video standard, developed by the JCT-VC team. JCT-VC is a joint team between MPEG and VCEG. The HEVC standard, finalized in January 2013, will bring 50% bit rate savings compared to equivalent H.264/AVC encodings. At the Mobile World Congress, Allegro DVT will present on its booth: HEVC/H.265 Hardware Decoding IP,...
Read More »CEVA Introduces MUST(TM) Multi-Core System Technology, Adds Vector Floating-Point Capabilities for CEVA-XC DSP Architecture Framework
Architecture framework further enriched with full support for ARMÃ-® AXI4 specification, AMBA 4 ACE cache coherency and a broad range of optimized tightly coupled extensions for wireless applications MOUNTAIN VIEW, Calif. - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced a suite of...
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FPGA Evaluation Kit enables small form factor designs.
Equipped with All Programmable Artix-7 200T device,Ã- Artix™-7 FPGA AC701 Evaluation Kit has IP and reference design toolsÃ- needed to accelerate design cycle. Artix-7 FPGA, featuring analog mixed signal, DDR3, DSP resources, parallel and serial I/O, provides optimal performance for low-end remote radio head, mobile backhaul, software defined radio, and motor control...
Read More »Movea's MotionCore(TM) Will Be Showcased on ST-Ericsson NovaThor(TM) Mobile Platform at MWC 2012
Companies to offer Industry First Motion Processing Core on NovaThor platform for Smartphones and Tablets Grenoble, France - Movea, a world leader in motion-processing and data fusion technology, announced today that it is working with ST-Ericsson, a world leader in the development of wireless platforms and semiconductors, to integrate Movea's MotionCore software modules and motion processing IP...
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Aerzen USA Process Gas Blower and Compressor Installations Worldwide
Aerzen is firmly established as a global leader in compressed air, gas, and vacuum solutions. Our reputation as an industry leader is built on consistently delivering innovative products that are at the cutting edge of technology. To learn about the industries finest blowers and oil-free and oil-injected screw compressors, see our video.
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