Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets
SAN JOSE, Calif., Nov. 19 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has...
Read More »Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets
SAN JOSE, Calif., Nov. 19 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has...
Read More »Texas Instruments Selects Certicom to Secure Next-Generation of Government-Issued Identification Documents
MISSISSAUGA, ON, and DALLAS, TX, Nov. 12 - Certicom Corp. (TSX: CIC) today announced that Texas Instruments Incorporated (TI) (NYSE:TXN) is licensing Certicom's Elliptic Curve Cryptography (ECC) technology to deliver enhanced security as part of the TI RF360 next-generation, smart integrated circuit (IC) platform for government-issued electronic identification (e-ID) documents (www.ti.com/govid)....
Read More »Texas Instruments Selects Certicom to Secure Next-Generation of Government-Issued Identification Documents
MISSISSAUGA, ON, and DALLAS, TX, Nov. 12 - Certicom Corp. (TSX: CIC) today announced that Texas Instruments Incorporated (TI) (NYSE:TXN) is licensing Certicom's Elliptic Curve Cryptography (ECC) technology to deliver enhanced security as part of the TI RF360 next-generation, smart integrated circuit (IC) platform for government-issued electronic identification (e-ID) documents (www.ti.com/govid)....
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How to Choose the Right Adhesive Tape for Your Application
With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.
Read More »FPGA Based Solution suits SPI-4.2 and SFI-4.1 interfaces.
Featuring ML550 hardware verification board, SPI-4.2 LogiCORE(TM) IP, and SFI-4.1 reference design, Virtex(TM)-5 LXT FPGAs-based solution aids development/evaluation of wired networking systems that require OC-192 (10 Gbps), multiple OC-48 (2.5 Gbps), or 10 Gbps Ethernet interfaces. ChipSync(TM) technology provides accurate dynamic alignment of clock and data using 75 ps programmable delays,...
Read More »FPGA Based Solution suits SPI-4.2 and SFI-4.1 interfaces.
Featuring ML550 hardware verification board, SPI-4.2 LogiCORE(TM) IP, and SFI-4.1 reference design, Virtex(TM)-5 LXT FPGAs-based solution aids development/evaluation of wired networking systems that require OC-192 (10 Gbps), multiple OC-48 (2.5 Gbps), or 10 Gbps Ethernet interfaces. ChipSync(TM) technology provides accurate dynamic alignment of clock and data using 75 ps programmable delays,...
Read More »Express Logic Introduces ThreadXR RTOS Support for Tensilica's New Diamond Standard 106Micro
Small, fast RTOS for smallest licensable 32-bit core San Diego, CA, December 3, 2007 - Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced ThreadX RTOS and middleware support for Tensilica's new Diamond Standard 106Micro 32-bit microcontroller core. With the addition of support for the new 106Micro, Express Logic continues to provide...
Read More »Express Logic Introduces ThreadXR RTOS Support for Tensilica's New Diamond Standard 106Micro
Small, fast RTOS for smallest licensable 32-bit core San Diego, CA, December 3, 2007 - Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOS), today announced ThreadX RTOS and middleware support for Tensilica's new Diamond Standard 106Micro 32-bit microcontroller core. With the addition of support for the new 106Micro, Express Logic continues to provide...
Read More »Phylinks Announces Working-First-Silicon for PHY-820: PCIe PHY with Leading-Edge DFT Features
New product line debuts; collaboration with ASIC Architect enables combination of silicon-proven PCIe PHY with link controller and IP verification by Avery Design SAN FRANCISCO, Nov. 14 -- Phylinks, Inc., an innovator of IP cores for the design of physical layer (PHY) high-speed serial interfaces, announced today that it has delivered working-first-silicon of its PHY-820 PCIe PHY at the .13u...
Read More »Phylinks Announces Working-First-Silicon for PHY-820: PCIe PHY with Leading-Edge DFT Features
New product line debuts; collaboration with ASIC Architect enables combination of silicon-proven PCIe PHY with link controller and IP verification by Avery Design SAN FRANCISCO, Nov. 14 -- Phylinks, Inc., an innovator of IP cores for the design of physical layer (PHY) high-speed serial interfaces, announced today that it has delivered working-first-silicon of its PHY-820 PCIe PHY at the .13u...
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Standex Engraving Mold-Tech Offers Nickel Shell Capabilities on a Global Scale
Standex Engraving Mold-Tech is the premier, global supplier for mold texturing and surface finishing. With a full range of services, Standex Engraving Mold-Tech is also the only nickel shell supplier producing in three global locations. See our video to learn more.
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