New Heyco Labkits Now Available For Product Design Departments, Experimental Labs, And Prototype Work
Plugs and Stoppers

New Heyco Labkits Now Available For Product Design Departments, Experimental Labs, And Prototype Work

Heyco Products, Inc., a leading ISO 9001:2000 US-based designer and manufacturer of wire protection products, has announced availability of seven LabKits for product design departments, experimental labs, and prototype work. The kit offerings include LabKit #1 (Stain Relief Bushings); LabKit #2 (Bushings); LabKit #3 (Hole Plugs); LabKit #5 (Wire Positioning); LabKit #7 (Rubber Grommets); LabKit...

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New Heyco Labkits Now Available For Product Design Departments, Experimental Labs, And Prototype Work
Plugs and Stoppers

New Heyco Labkits Now Available For Product Design Departments, Experimental Labs, And Prototype Work

Heyco Products, Inc., a leading ISO 9001:2000 US-based designer and manufacturer of wire protection products, has announced availability of seven LabKits for product design departments, experimental labs, and prototype work. The kit offerings include LabKit #1 (Stain Relief Bushings); LabKit #2 (Bushings); LabKit #3 (Hole Plugs); LabKit #5 (Wire Positioning); LabKit #7 (Rubber Grommets); LabKit...

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Sand

Coated Infill is safe, clean, and non-toxic.

Combining naturally occurring infill granules with ceramic coating, PermaCoat Naturally Tough Infill offers eco-friendly alternative for artificial turf infilling. Product is lead and heavy metals free, and manufactured without noxious solvents or chemicals. After curing, ceramic coating encapsulates granules making infill virtually dust-free and water resistant. Available in 2 standard UV...

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Sand

Coated Infill is safe, clean, and non-toxic.

Combining naturally occurring infill granules with ceramic coating, PermaCoat Naturally Tough Infill offers eco-friendly alternative for artificial turf infilling. Product is lead and heavy metals free, and manufactured without noxious solvents or chemicals. After curing, ceramic coating encapsulates granules making infill virtually dust-free and water resistant. Available in 2 standard UV...

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Mills

Pressed-to-Size Inserts perform aggressive metal cutting.

Available in T or D variations, CNC-pressed Toroid inserts have shock-absorbing cutting edge designed to handle heavy chip loads. Products offer heat absorption capabilities and are designed to promote extended tool life. Positive top rake reduces cutting forces and torque. T-land offers reinforced cutting edge for steels, irons, and hard milling, while dished face provides high-positive cutting...

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Mills

Pressed-to-Size Inserts perform aggressive metal cutting.

Available in T or D variations, CNC-pressed Toroid inserts have shock-absorbing cutting edge designed to handle heavy chip loads. Products offer heat absorption capabilities and are designed to promote extended tool life. Positive top rake reduces cutting forces and torque. T-land offers reinforced cutting edge for steels, irons, and hard milling, while dished face provides high-positive cutting...

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Modules

Computer Interface Module offers USB and RS232c interface.

Computer Interface Module, designed for Laser Microgage 2D Alignment System, can be added or removed at anytime by disconnecting interface cable. Pinpoint Capture software is included for selecting and collecting data. It lets users scale measurement readings, apply offsets, change preferred measurement units, and view readings in numerical or graphic formats. Limit settings and indicators are...

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Modules

Computer Interface Module offers USB and RS232c interface.

Computer Interface Module, designed for Laser Microgage 2D Alignment System, can be added or removed at anytime by disconnecting interface cable. Pinpoint Capture software is included for selecting and collecting data. It lets users scale measurement readings, apply offsets, change preferred measurement units, and view readings in numerical or graphic formats. Limit settings and indicators are...

Read More »
Semiconductor Processing Equipment

Production Mask Aligner suits 3D packaging applications.

Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque...

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Semiconductor Processing Equipment

Production Mask Aligner suits 3D packaging applications.

Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque...

Read More »

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