Rugged Dual GPGPU OpenVPX Module delivers 5 TFLOPS in one slot.
Bringing floating point processingÂ- capacities of NVIDIA® Maxwell architecture class GPGPUs (general purpose graphics processor units) to embedded aerospace and defense market, CHAMP-GP3 GPGPU Application Accelerator features dual 1536-core Tesla M6 MXMs HPC devices to provide 5 TFLOPS compute performance in one slot. SWaP-optimized 6U OpenVPX™ module, which supports...
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SFF SMARC Module supports ARM Cortex A9 i.MX6 processors.
Powered by quad core/dual core/dual lite/solo coreÂ- 1.0 GHz Freescale i.MX6 processor, 82 x 50 mm RM-F600-SMC SMARC (Smart Mobility ARChitecture) module is suited for mobile and HMI systems. Integrated features include image capture interface for MIPI cameras; 18/24-bit parallel LCD, LVDS, and HDMI interface; as well as full-HD, 1080p hardware video codec engine. Further...
Read More »Heterogeneous Multi-Processing SoC supports Micrium RTOS kernels.
CombiningÂ- 7 processors, Xilinx All Programmable Zynq® UltraScale+™ MPSoC enables development of flexible, standards-based platforms. Micrium’s µC/OS-II® and µC/OS-III® kernels and full suite of RTOS components run on ARM Cortex A53 and Cortex R5 CPUs as well as Xilinx MicroBlaze™ FPGA-based soft processor core. This lets users...
Read More »All-Programmable MPSoC increases next gen platform flexibility.
By providing any-to-any connectivity with security and safety required for next generation ADAS, I-IoT, and 5G wireless systems, All Programmable Zynq® UltraScale+™ MPSoC enables development of flexible, standards-based platforms. This heterogeneous multi-processing SoC (MPSoC), which uses TSMC's 16FF+ process, combinesÂ- 7 user-programmable processors, and also includes...
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Industrywide Applications for Deep Drawn Metal Stamping
Deep-drawn metal stamping applies a significant punching force to radically draw metal sheets into a die cavity. Finished components produced by this process tend to have a depth that exceeds their diameter, which is why manufacturers refer to it as "deep-drawn" metal stamping.
Read More »Drive Processor IDK increases device intelligence capabilities.
Allowing developers to differentiate and optimize motor control industrial system design, Sitara™ AM437x Industrial Development Kit (IDK) aids in evaluation of multi-protocol, industrial communication, and feedback interface capabilities of Sitara AM4379 and AM4377 processors based on ARM® Cortex®-A9 core. Combination of motor control feedback and certified industrial Ethernet...
Read More »Vivante Announces Support for Vulkan GPU Rendering and Compute Standards
New close to the metal APIs are a natural fit for Vivante's Vega GPU Architecture SAN FRANCISCO -- Game Developers Conference 2015 (#GDC15, #MWC15) -- VivanteÂ-(TM) Corporation welcomes today's Khronos Group's announcement at GDC of the new Vulkan(TM) open standard API--an innovative, ground-up design that will unleash the newest innovations inside Vivante's latest GPU...
Read More »Octa-Core 64-bit Mobile SoC supports WorldMode modem capability.
Helping designers meet graphics-intensive multimedia requirements while maintaining battery efficacy, MT6753 Smartphone SoC employs eight 64-bit ARM® Cortex®-A53 CPUs (up to 1.5 GHz) with CorePilot multi-processor technology and Mali-T720 GPU with support for Open GL ES 3.0 and Open CL 1.2 APIs. Integrated CDMA2000 ensures total market compatibility, and other features include...
Read More »Multi-Core Android Tablet SoC leverages ARM Cortex-A72 CPU.
With big.LITTLE architecture combiningÂ- 64-bit ARM® Cortex®-A72 and -A53 CPUs, quad-core MT8173 meets mobile user demand for 4K Ultra HD content and graphic-intensive operation. Tablet SoC offers up to 2.4 GHz performance, supports OpenCL with deployment of MediaTek Corepilot® 2.0, and enables heterogeneous computing between CPU and GPU. Increasing tablet performance while...
Read More »Cavium Breaks 100Gbps IPsec Throughput Barrier Using OpenDataPlane(TM) at Mobile World Congress 2015
OCTEON® III 48 Core 64-bit Processor SoC Provides 2.5X+ Performance Boost delivering the critical secure backhaul requirements for future LTE-A and 5G Wireless Core Network Applications BARCELONAÂ- — Mobile World Congress - Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless...
Read More »Cavium to Showcase Wireless Infrastructure Innovations at Mobile World Congress 2015
Solution demos Covering Cloud Data Centers, NFV, Cloud-RAN, vEPC, Wireless Core, Macro Cells and Small cells BARCELONA, Spain,Â- – Mobile World Congress - Cavium, Inc., (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for enterprise, data center, wired and wireless networking, will showcase innovative solutions spanning wireless infrastructure...
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Fresh Air Intake Designed to Meet ASHRAE 62.2 standards
Alan Manufacturing has a long history of developing innovative solutions for HVAC applications. With over 1,000 product designs under our belt, we have gained a reputation as the go-to source for HVAC dampers, hardware, duct supports, zone control systems, and much more. Adding to this extensive list of achievements we now announce the release of our new line of Fresh Air Intake products. Designed to meet ASHRAE 62.2 standards, they are the most robust and high-performance product of their kind. See our video to learn more.
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