Texas Instruments Perpetuates Innovation with Leading Analog, Wireless and Embedded Processing Solutions at ESC 2011
Texas Instruments perpetuates innovation with leading analog, wireless and embedded processing solutions at ESC 2011 WHAT: New ultra-low-power, video decode and display and ARM-® solutions are just a few of the cutting-edge technologies that Texas Instruments Incorporated (TI) will showcase at booth #1530 during the Embedded Systems Conference (ESC), Silicon Valley in San Jose, Calif. TI experts...
Read More »Texas Instruments Perpetuates Innovation with Leading Analog, Wireless and Embedded Processing Solutions at ESC 2011
Texas Instruments perpetuates innovation with leading analog, wireless and embedded processing solutions at ESC 2011 WHAT: New ultra-low-power, video decode and display and ARMÃ-® solutions are just a few of the cutting-edge technologies that Texas Instruments Incorporated (TI) will showcase at booth #1530 during the Embedded Systems Conference (ESC), Silicon Valley in San Jose, Calif. TI...
Read More »Capacitive Touch Portfolio provides touch sense capabilities to MCUs.
Enabling low-power touch sense capabilities on MSP430 devices, 16-bit MSP430 MCU capacitive touch portfolio includes hardware and software solutions. Open source software library eliminates need to develop complex touch sensing algorithms and supports various capacitive touch sensor types. MSP430 Value Line G2xx2 and G2xx3 devices include capacitive touch IOs, which enable developers to interface...
Read More »Capacitive Touch Portfolio provides touch sense capabilities to MCUs.
Enabling low-power touch sense capabilities on MSP430 devices, 16-bit MSP430 MCU capacitive touch portfolio includes hardware and software solutions. Open source software library eliminates need to develop complex touch sensing algorithms and supports various capacitive touch sensor types. MSP430 Value Line G2xx2 and G2xx3 devices include capacitive touch IOs, which enable developers to interface...
Read More »5 Common Liquid Injection Molding Mistakes (And How to Avoid Them)
This guide offers insights about steering clear of common LIM problems and maximizing your project's efficiency.
Read More »I/O Interface Kit enhances integration with small package.
Intended for OEMs and system integrators, 1010 - PhidgetInterfaceKit 8/8/8 Mini-Format delivers all 1018 - InterfaceKit 8/8/8 functionality from DIP-36 package that can be inserted in socket or soldered to user's own board. It lets users connect devices to any of 8 analog inputs, 8 digital inputs, and 8 digital outputs, providing generic means to interface end-user system with various devices....
Read More »I/O Interface Kit enhances integration with small package.
Intended for OEMs and system integrators, 1010 - PhidgetInterfaceKit 8/8/8 Mini-Format delivers all 1018 - InterfaceKit 8/8/8 functionality from DIP-36 package that can be inserted in socket or soldered to user's own board. It lets users connect devices to any of 8 analog inputs, 8 digital inputs, and 8 digital outputs, providing generic means to interface end-user system with various devices....
Read More »Quad Core Multiprocessor aids defense intelligence applications.
Based on 2nd generation Intel-® Core(TM) i7 chip set, Model DSP280 meets real-time demands of ISR, radar, sonar, and image/sensor processing applications. Dual socket 6U VPX multiprocessor offers more than 260 Gigaflops peak performance and main memory bandwidth up to 21 GBps/CPU node. HPEC architecture can scale from 1 to many processor nodes per enclosure via RDMA-enabled 10 GigE and DDR...
Read More »Quad Core Multiprocessor aids defense intelligence applications.
Based on 2nd generation IntelÃ-® Core(TM) i7 chip set, Model DSP280 meets real-time demands of ISR, radar, sonar, and image/sensor processing applications. Dual socket 6U VPX multiprocessor offers more than 260 Gigaflops peak performance and main memory bandwidth up to 21 GBps/CPU node. HPEC architecture can scale from 1 to many processor nodes per enclosure via RDMA-enabled 10 GigE and DDR...
Read More »Digi Extends ConnectCore i.MX Product Family and Freescale Collaboration with New iDigi-Enabled Wireless Module
Wireless module with Freescale processor and iDigi cloud computing service ideal for developing wireless multimedia devices MINNETONKA, Minn. - Digi International (NASDAQ: DGII) today introduced the ConnectCore(TM) Wi-i.MX53, the second in a series of core processors based on the Freescale Semiconductor i.MX processor family. The new solutions-on-module enables wired and wireless networking of...
Read More »Digi Extends ConnectCore i.MX Product Family and Freescale Collaboration with New iDigi-Enabled Wireless Module
Wireless module with Freescale processor and iDigi cloud computing service ideal for developing wireless multimedia devices MINNETONKA, Minn. - Digi International (NASDAQ: DGII) today introduced the ConnectCore(TM) Wi-i.MX53, the second in a series of core processors based on the Freescale Semiconductor i.MX processor family. The new solutions-on-module enables wired and wireless networking of...
Read More »Ensure Safety, Reliability in Your Cement Plant with Aerzen Blowers and Compressors
Aerzen offers blowers and compressors for challenging cement applications such as pneumatic conveying from raw mill to raw meal silos, combustion air, cement silos fluidization, and more. At Aerzen, safety is our top priority. Check out our video to learn more.
Read More »