New VPX Rackmount Chassis Provides Dual 10 GbE to The Front Panel
Features up to 2TB of NVMe M.2 removable storage and 64GbE of SSD on board. Provides right to left push/pull cooling to the VPX payload and RTM slots, with an air filter removable from the front. Accepts 0.8-inch, 0.85-inch and 1.0-inch pitch modules and is ideal for commercial deployment.
Read More »New VPX Rackmount Chassis Provides Dual 10 GbE to The Front Panel
Features up to 2TB of NVMe M.2 removable storage and 64GbE of SSD on board. Provides right to left push/pull cooling to the VPX payload and RTM slots, with an air filter removable from the front. Accepts 0.8-inch, 0.85-inch and 1.0-inch pitch modules and is ideal for commercial deployment.
Read More »New Chassis With Card Guide for Air-cooled or Conduction-cooled Modules
Features ground only backplane with 1 VPX and dual VITA 67.3c slots. Allows VITA 65 and VITA 67 boards to be plugged into the same backplane. Offers modular power supplies, an optional fan speed control dial and a convenient carry handle.
Read More »New Chassis With Card Guide for Air-cooled or Conduction-cooled Modules
Features ground only backplane with 1 VPX and dual VITA 67.3c slots. Allows VITA 65 and VITA 67 boards to be plugged into the same backplane. Offers modular power supplies, an optional fan speed control dial and a convenient carry handle.
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Check out this white paper to read about the six questions to consider before selecting an injection molder for your packaging application.
Read More »New 10-slot 3U Development Chassis Features Removable Sidewalls
Speed of the backplane supports 40GbE and PCIe Gen3 signals with high-grade PCB material and back-drilling. Includes multiple VITA 67.3c and VITA 67.3d cutouts for RF interfaces through the backplane. 10-slot backplane has clocking and VITA 46.11 system management connections per SOSA requirements.
Read More »New 10-slot 3U Development Chassis Features Removable Sidewalls
Speed of the backplane supports 40GbE and PCIe Gen3 signals with high-grade PCB material and back-drilling. Includes multiple VITA 67.3c and VITA 67.3d cutouts for RF interfaces through the backplane. 10-slot backplane has clocking and VITA 46.11 system management connections per SOSA requirements.
Read More »New 3U VPX Platform with Connectivity for RF and Optical Interfaces
Model 8256 utilizes VITA 46.11 and HOST aligned chassis management module. Built-in forced-air cooling supports conduction-cooled boards in a standard 19” rackmount profile chassis. Ideal for application development with Quartz® RFSoC data acquisition and processing boards.
Read More »New 3U VPX Platform with Connectivity for RF and Optical Interfaces
Model 8256 utilizes VITA 46.11 and HOST aligned chassis management module. Built-in forced-air cooling supports conduction-cooled boards in a standard 19” rackmount profile chassis. Ideal for application development with Quartz® RFSoC data acquisition and processing boards.
Read More »Pixus Releases Conduction-Cooled Version of OpenVPX Chassis Manager
Waterloo, Ontario — Jan 25, 2021 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a conduction-cooled model for their 3U OpenVPX Chassis Manager. Compliant to the VITA 46.11 specification for system management and to VITA 48.2 for mechanical design, the Tier 2 Pixus OpenVPX Chassis Manager monitors at least 6 temperature sensors and 10 fans with...
Read More »Pixus Releases Conduction-Cooled Version of OpenVPX Chassis Manager
Waterloo, Ontario — Jan 25, 2021 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a conduction-cooled model for their 3U OpenVPX Chassis Manager. Compliant to the VITA 46.11 specification for system management and to VITA 48.2 for mechanical design, the Tier 2 Pixus OpenVPX Chassis Manager monitors at least 6 temperature sensors and 10 fans with...
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Are you struggling to find an absorbent that doesn't result in at least some leaching? SpillVak outperforms all rock and clay-based materials. Check out our video to learn more.
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