Visteon Showcases Solutions to Improve Value of Connected Car at 2015 Mobile World Congress

Global automotive supplier will demonstrate automotive-first Firmware Over-the-Air (FOTA) updates using LTE multicast technology. BARCELONA, Spain- – Leading automotive electronics supplier Visteon Corporation (NYSE: VC) will showcase how mobility and connected technologies and services can improve a vehicle's lifetime value while enhancing the ownership and driving experience at the 2015...

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Optical Incremental Encoders target OEM designs.

Optical Incremental Encoders target OEM designs.

Available in 64 different configurations, Models E30C and E30D are 5 V encoders suited for precision-motion control applications. Model E30C has resolutions of 200, 250, 256, 400, or 500, while Model E30D has resolutions of 500, 512, 1000, 1024, 2000, or 2048. Supplied in modular package measuring 30 x 8 mm, both operate from -20 to +85-

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RFID Inlays are based on Impinj Monza R6 chip.

Suited for large-scale deployment in supply chain, RFID inlays for retail industry feature designs that accelerate writing speed while promoting backscatter strength, parallel encoding capabilities, and read- and write-sensitivity. Belt inlay, with compact form factor and minimized antenna size, meets ARC requirements for European and US apparel retailers. With 42 x 16 mm antenna, SMARTRAC...

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Fairview Microwave Releases Comprehensive Lines of RF Isolators and Circulators

Fairview Microwave Releases Comprehensive Lines of RF Isolators and Circulators

New Portfolio of Ferrite Passive Devices up to 40 GHz Announced by Fairview Microwave Allen, TX - Fairview Microwave, Inc. a global supplier of on-demand microwave and RF components, releases new RF Circulators and Isolators which are commonly used in radar systems, wireless communications, distributed antenna systems (DAS), test labs and amplifier systems where sensitive RF equipment would...

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RADWIN Announces New Additional Small Cell Backhaul Wins with Tier-1 Carriers

RADWIN Announces New Additional Small Cell Backhaul Wins with Tier-1 Carriers

Meet RADWIN at Mobile World Congress, March 2-5, Barcelona Booth G25, Hall 1 TEL-AVIV, Israel- – RADWIN (www.radwin.com), the global leader of the NLOS Small Cell Backhaul market, today announced that additional tier-1 carriers in North America, Europe and Latin America have selected RADWIN as their Small Cell Backhaul supplier. RADWIN is in the process of deploying its advanced RADWIN 5000...

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Express Logic Launches ViewX(TM) System Analyzer to Speed Optimization of IoT Applications

ViewX captures and displays real-time system performance data Embedded World 2015, Nuremberg, Germany — Express Logic, Inc., the worldwide leader in royalty-free real-time operating systems (RTOSes), has introduced ViewX™, a real-time performance monitoring tool for IoT systems where optimization of highly networked activity is critical for the success of the system. ViewX can be used to...

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Microsemi to Showcase Innovative Products for Wireless Networks and Small Cells Deployment at Mobile World Congress 2015

Exhibition for Mobile Industry Takes Place March 2-5 in Barcelona WHAT: -  Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will be participating in Mobile World Congress 2015 to showcase how its innovative product portfolio addresses wireless communications and small cells deployment. Microsemi will be sharing...

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Sunpartner Technologies and Kyocera Unveil the First Solar Smartphone Designed for Rugged, Outdoor Use

Sunpartner Technologies and Kyocera Unveil the First Solar Smartphone Designed for Rugged, Outdoor Use

An exclusive world premiere at the Mobile World Congress March 2-5 in Barcelona, Spain AIX-EN-PROVENCE, France -- At this renowned international mobile technology trade show, Sunpartner Technologies, French specialists in innovative solar solutions, and Kyocera Corporation, a leading Japanese mobile phone maker, will unveil the first results of their partnership: a working prototype of a...

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Supermicro® Expands Embedded Computing Solutions with New Wireless IoT Gateway at Embedded World, Nurnberg

Supermicro® Expands Embedded Computing Solutions with New Wireless IoT Gateway at Embedded World, Nurnberg

Ultra Low-Power Edge to Cloud Mesh Network Device offers Connectivity, Programmability, Security and Reliability for Data Sense and Analytics Infrastructure NURNBERG, Germany- — Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing debuts its latest lineup of Embedded Building Block Solutions this week at...

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Microwave Baseband/RF SoCs support growing wireless traffic.

Integrating cross-polarization interference cancellation (XPIC) and line-of-sight multiple-input and multiple-output (LoS-MIMO) functionalities, BCM85650 supports channel aggregation and delivers 4K-QAM (quadrature amplitude modulation). Employing digital RF correction mechanisms, BCM85820 integrates support for XPIC, MIMO, 4K-QAM modulation, 112 MHz channels, and channel aggregation. Both SoCs...

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