Plastic GaN HEMTs support LTE and radar applications.
Supplied in 4.5 x 6.5 mm plastic SMT packages, Models CGHV27060MP and CGHV35060MP are 50 V/60 W broadband GaN HEMTs fabricated on SiC substrate with 0.4 -µm process. Model CGHV27060MP, supporting frequencies from UHF through 2.7 GHz, provides 16.5 dB gain, 70% drain efficiency, and 80 W output power at pulsed PSAT with 100 µs pulse width and 10% duty cycle. Model CGHV35060MP operates from...
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Plastic GaN HEMTs support LTE and radar applications.
Supplied in 4.5 x 6.5 mm plastic SMT packages, Models CGHV27060MP and CGHV35060MP are 50 V/60 W broadband GaN HEMTs fabricated on SiC substrate with 0.4 Ã-µm process. ModelàCGHV27060MP, supporting frequencies from UHF through 2.7 GHz, provides 16.5 dB gain, 70% drain efficiency, and 80 W output power at pulsed PSAT with 100 õs pulse width and 10% duty cycle. Model CGHV35060MP...
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ToF IC enhances object detection and distance measurement.
Supplied in 4 x 5 mm, 24-lead TQFN package, ISL29501 time-of-flight (ToF) signal processing IC provides- complete object detection and distance measurement solution when combined with external emitter (IR LED or laser) and photodiode. On-chip DSP calculates ToF for proximity detection and distance measurement up to 2 m in both dark and bright ambient light conditions. Other features include...
Read More »MOST INICs foster integration of in-vehicle CI+-based pay TV.
Supporting high-quality video streaming as defined by MOST-® Stream Transmission Specification, MOST Intelligent Network Interface Controllers (INICs) enable automotive infotainment system designers to bring CI+-based Pay TV to cars. Aproved content protection schemes for DTCP implemented in MOST Multimedia Companion ICs allow transport of CI+ protected content, and DTCP software stack completes...
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Choosing the Right Material for Your Project
When choosing an appropriate metal material, the range of options is so broad that selecting the correct material for your unique application can be challenging. Different metals have characteristics that can affect weldability, ductility, and formability. Our new eBook outlines the unique properties and applications of popular metals including: Stainless Steel Brass Aluminum Copper Titanium
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ToF IC enhances object detection and distance measurement.
Supplied in 4 x 5 mm, 24-lead TQFN package, ISL29501 time-of-flight (ToF) signal processing IC providesÃ- complete object detection and distance measurement solution when combined with external emitter (IR LED or laser) and photodiode. On-chip DSP calculates ToF for proximity detection and distance measurement up to 2 m in both dark and bright ambient light conditions. Other features include...
Read More »MOST INICs foster integration of in-vehicle CI+-based pay TV.
Supporting high-quality video streaming as defined by MOSTÃ-® Stream Transmission Specification, MOST Intelligent Network Interface Controllers (INICs) enable automotive infotainment system designers to bring CI+-based Pay TV to cars. Aproved content protection schemes for DTCP implemented in MOST Multimedia Companion ICs allow transport of CI+ protected content, and DTCP software stack...
Read More »Microsemi and Athena Announce FPGA Cores with Strong DPA Countermeasures for Cryptography Users
Powerful Anti-Tamper Security Microprocessor Technology Available Immediately as Soft Intellectual Property for SmartFusion2 and IGLOO2 FPGAs ALISO VIEJO, Calif. - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and The Athena Group, Inc. (Athena), a leading provider of security, cryptography,...
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Curtiss-Wright and DRS Technologies Collaborate to Bring U.S. Army's MORA Architecture Compliant RF Capabilities to Rugged Embedded COTS Systems
NEW OPENVPX-BASED RF SYSTEMS DELIVER STANDARD RF AND MICROWAVE MODULES AND SYSTEMS MODULES IN SUPPORT OF MODULAR OPEN RF ARCHITECTURE (MORA) AUSA 2015, WASHINGTON, D.C. (Booth #6717) – Curtiss-Wright Corporation (NYSE: CW) today announced that its Defense Solutions division is collaborating with DRS Technologies, Inc., a Finmeccanica Company, to bring RF capabilities to a new range of rugged...
Read More »Microsemi and Athena Announce FPGA Cores with Strong DPA Countermeasures for Cryptography Users
Powerful Anti-Tamper Security Microprocessor Technology Available Immediately as Soft Intellectual Property for SmartFusion2 and IGLOO2 FPGAs ALISO VIEJO, Calif. - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and The Athena Group, Inc. (Athena), a leading provider of security, cryptography,...
Read More »
Curtiss-Wright and DRS Technologies Collaborate to Bring U.S. Army's MORA Architecture Compliant RF Capabilities to Rugged Embedded COTS Systems
NEW OPENVPX-BASED RF SYSTEMS DELIVER STANDARD RF AND MICROWAVE MODULES AND SYSTEMS MODULES IN SUPPORT OF MODULAR OPEN RF ARCHITECTURE (MORA) AUSA 2015, WASHINGTON, D.C. (Booth #6717) – Curtiss-Wright Corporation (NYSE: CW) today announced that its Defense Solutions division is collaborating with DRS Technologies, Inc., a Finmeccanica Company, to bring RF capabilities to a new range of rugged...
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Precision Machined Parts for High Tech Applications
For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.
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