Circuits

N-Channel Power MOSFETs achieve low resistance.

N-Channel Power MOSFETs achieve low resistance.

Part of NexFET™ product line, 25 V Model CSD16570Q5B supports max Rdson of 0.59 mΩ, while 30 V Model CSD17570Q5B achieves max Rdson of 0.60 mΩ. Both are housed in 5 x 6 mm QFN package and are suitable for hot swap and ORing applications. For low-voltage battery-powered applications, 12 V Model CSD13383F4 comes in 0.6 x 1.0 mm FemtoFET™ package with Rdson of 44 mΩ at 4.5 V.

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MOSFET Gate Drivers operate from 4.5-35 V.

MOSFET Gate Drivers operate from 4.5-35 V.

Housed in 3 x 3 mm DFN package, Models IX4426/7/8M are capable of sourcing and sinking 1.5 A, and can switch 1,000 pF load in less than 10 ns. For high current requirements, 2 outputs can be paralleled for total of 3 A peak sourcing and sinking current. Inputs are TTL and CMOS compatible and are virtually immune to latch-up. Operating from -40 to +125°C,- Models IX4426/7/8M are suitable for...

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Scalable 10/40GbE Controller suits datacenter/cloud applications.

Terminator 5 (T5) integrated, hyper-virtualized 10/40GbE controller- offers full offload support of- complete Unified Wire solution, NVGRE, and VXLAN support, security and filtering, and traffic analytics and management. Performance is limited only by PCIe Gen3 bus. Due to multiple physical channels through ASIC, product scales to true 40 Gigabit line rate operation from- single TCP connection...

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Thermocouple Interface IC fosters production of greener cars.

Thermocouple Interface IC fosters production of greener cars.

Addressing requirements for next generation powertrains, MLX90327 enables monitoring of operating temperatures from -40 to +155°C without any compromise- to accuracy. Digital SENT interface is included- for advanced powertrain electronic control units (ECUs), and PWM output is available for general-purpose automotive and non-automotive applications. This IC makes it- possible to condition and...

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OmniVision and Inuitive Collaboration Brings 3D Cameras to Wide Range of Next-Gen Applications

LAS VEGAS- – OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced from the Consumer Electronics Show (CES) in Las Vegas, that it is collaborating with Inuitive Ltd. to develop a reference design for building compact modules that enable 3D imaging in consumer electronics. OmniVision's family of computer vision-optimized sensors...

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MediaTek Reveals the Future of Premium Wireless Connectivity with Its New MT7615 SoC

802.11ac Wave2 chipset with MU-MIMO support designed for high-end home gateway, set-top box, video bridge, router and enterprise-class AP LAS VEGAS - MediaTek today announces the release of MT7615, the most advanced 802.11ac System on Chip (SoC) for Wi-Fi connectivity. MediaTek once again demonstrates its commitment to leading Wi-Fi technology through the MU-MIMO and beamforming techniques...

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DSP Group and Sensory Introduce Voice-Controlled IoT Solution

The Two Companies Offer First-of-Its-Kind Voice-Managed IoT (Internet of Things) Solution Leveraging ULE (Ultra Low- Energy) RF Technology LOS ALTOS, Calif.- – DSP Group®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, and Sensory, a leader in speech technologies for consumer electronics, announced today the joint development of a...

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Cloud-Ready Wi-Fi/Bluetooth SoC addresses IoT application needs.

Along adaptive co-existence engine, fully integrated WILC3000 wireless link controller combines Wi-Fi 802.11n and Bluetooth Smart-ready technologies in 4.1 x 4.1 mm WLCSP. Solution offers multiple peripheral interfaces –- UART, SPI, I2C, and SDIO –- and cloud-ready connectivity software. Also available, WINC3400 network controller features embedded flash memory that lets device host network...

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System on Chip targets wearable devices.

Designed for wearable devices based on Google's Android Wear software, Model MT2601 features 1.2 GHz dual-core ARM Cortex-A7, ARM Mali-400 MP GPU, and qHD display resolution. Device interfaces with host of external sensors and wireless connectivity SoC MT6630 for Bluetooth—all in PCBA footprint of less than 480 mm-². Small PCB size meets design requirements of wearable devices in sports and...

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DSP Group's DHX91 ULE SoC Powers Panasonic's New Home Monitoring and Control System

DSP Group's ULE System-on-a-Chip (SoC) Delivers the Benefits of Ultra-Low Power and Advanced Video Capabilities to Panasonic's Home Monitoring Range of Products LOS ALTOS, Calif. –- DSP Group®, Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, announced today that Panasonic has selected DSP Group's advanced ULE (Ultra Low Energy) SoC...

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