GNSS Chip supports place-based mobile commerce.
Intended for indoor/outdoor positioning in smartphones, Model BCM4752 provides multi-constellation support by simultaneously collecting data from GPS, GLONASS, QZSS, and SBAS satellites and using best received signals. Platform uses data from inertial sensors, Wi-Fi access points, and Bluetooth beacons to enable indoor positioning capabilities. Integration with NFC enables secure mobile payments...
Read More »GNSS Chip supports place-based mobile commerce.
Intended for indoor/outdoor positioning in smartphones, Model BCM4752 provides multi-constellation support by simultaneously collecting data from GPS, GLONASS, QZSS, and SBAS satellites and using best received signals. Platform uses data from inertial sensors, Wi-Fi access points, and Bluetooth beacons to enable indoor positioning capabilities. Integration with NFC enables secure mobile payments...
Read More »Wi-Fi System-in-Package features integrated networking stack.
Providing integrated 802.11n single-stream Wi-Fi package, Model AR4100P supports machine-to-machine communications in smart home, building, and appliance channels. Device is featured in SP137 development kit, which provides reference design for low-power IP sensors, and integrates Energy Micro's EFM32 Gecko Cortex-M3 microcontroller running Micrium uC/OS-III(TM) OS. With additional onboard...
Read More »Wi-Fi System-in-Package features integrated networking stack.
Providing integrated 802.11n single-stream Wi-Fi package, Model AR4100P supports machine-to-machine communications in smart home, building, and appliance channels. Device is featured in SP137 development kit, which provides reference design for low-power IP sensors, and integrates Energy Micro's EFM32 Gecko Cortex-M3 microcontroller running Micrium uC/OS-III(TM) OS. With additional onboard...
Read More »Material Selection Guide: High & Low Density Polyethylene
In this eBook, learn about high-density and low-density polyethylene's similarities, differences, and practical applications from New Process Fibre.
Read More »Maxim to Present Technical Training Seminars and Demos at X-Fest 2012
Maxim Integrated Products collaborates with Xilinx and Avnet to demo its highly integrated technology for FPGAs. Sunnyvale, CA - Maxim Integrated Products Inc. (NASDAQ: MXIM) today announced that the company is collaborating with Xilinx and Avnet during the 2012 season of X-Fest. Maxim will provide content for several technical seminars and present demos on the company's highly integrated analog...
Read More »Maxim to Present Technical Training Seminars and Demos at X-Fest 2012
Maxim Integrated Products collaborates with Xilinx and Avnet to demo its highly integrated technology for FPGAs. Sunnyvale, CA - Maxim Integrated Products Inc. (NASDAQ: MXIM) today announced that the company is collaborating with Xilinx and Avnet during the 2012 season of X-Fest. Maxim will provide content for several technical seminars and present demos on the company's highly integrated analog...
Read More »Operating with supply voltage of 3.3-5 V, GALAXY CHT-74-4040 can be used as frequency divider with division rate up to 4,096. Counter features typical propagation delay of 19 nsec, low quiescent current of 21 -µA max, and output drive capability of 4 mA max. Available in ceramic CSOIC16 and CDIL16 hermetic packages, 12-stage asynchronous counter is suitable for clock generation and clock modules...
Read More »Set-Top Box ICs provide platform for next-generation services.
Manufactured in 40 nm process technology and supplied in 27 x 27 mm BGA packages, STiH207/237/239/273 support range of HD broadcast and multimedia codecs, hybrid and IP standards, security and content protection standards, and middleware stacks. Green features include energy-efficient Ethernet and 0.5 W stand-by mode with fast-resume capability. Depending on model, these STB system-on-chip ICs...
Read More »Operating with supply voltage of 3.3-5 V, GALAXY CHT-74-4040 can be used as frequency divider with division rate up to 4,096. Counter features typical propagation delay of 19 nsec, low quiescent current of 21 Ã-µA max, and output drive capability of 4 mA max. Available in ceramic CSOIC16 and CDIL16 hermetic packages, 12-stage asynchronous counter is suitable for clock generation and clock...
Read More »Set-Top Box ICs provide platform for next-generation services.
Manufactured in 40 nm process technology and supplied in 27 x 27 mm BGA packages, STiH207/237/239/273 support range of HD broadcast and multimedia codecs, hybrid and IP standards, security and content protection standards, and middleware stacks. Green features include energy-efficient Ethernet and 0.5 W stand-by mode with fast-resume capability. Depending on model, these STB system-on-chip ICs...
Read More »Locon Sensors Withstand Extreme Temperatures
Locon Sensor Systems offer robust sensor solutions for even the most severe environmental conditions. Their line of high-temp inductive sensors and their cylindrical photoelectric series can operate in temperatures up to 250 degrees Celsius. See our video to learn more.
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