Circuits

Broadcom Selected for Wi-Fi CERTIFIED Passpoint(TM) Test Bed

Participation Underscores Leadership in Connectivity and Commitment to Driving Wi-Fi Standards and Adoption IRVINE, Calif. - - Test Bed leverages Broadcom technology as a benchmark for certification; chips among first to obtain Wi-Fi CERTIFIED Passpoint designation - Program enables certified devices to connect automatically, making Wi-Fi access on-the-go seamless - Passpoint program coupled with...

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Samsung Launches New Galaxy Android Smartphone Leveraging Marvell's Industry-leading TD-SCDMA Solution

Marvell affirms its leadership in China's TD-SCDMA standard with introduction of the Samsung's new Galaxy i8250 powered by Marvell's PXA920H Single-Chip Solution SANTA CLARA, Calif., - Marvell (NASDAQ: MRVL) today announced Samsung has released its new Android- smartphone for China Mobile powered by Marvell's PXA920H Single-Chip solution, an advanced, highly integrated 3G platform with TD-SCDMA...

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Marvell Extends Leadership with Worldwide Adoption of Its WCDMA Solutions with Samsung's New GALAXY Xcover Android Smartphone

Marvell's PXA968 mobile platform offers high-performance, cost-effective multimedia processing for Samsung's GALAXY Xcover (GT-S5690) SANTA CLARA, Calif.- Marvell (NASDAQ: MRVL) today announced that its industry leading Wideband Code Division Multiple Access (WCDMA) single-chip solution, the PXA968, is powering the new, rugged Samsung GALAXY Xcover (GT-S5690). The new Samsung GALAXY Xcover is the...

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LNA GaAs MMICs feature single voltage of +3.0 V at 52 mA.

LNA GaAs MMICs feature single voltage of +3.0 V at 52 mA.

Suited for applications from 26-34 GHz, including 30 GHz satellite communications, Model CMD162 features typical noise figure of 1.7 dB with small-signal gain of 22 dB and output 1 dB compression point of +7 dB. Models CMD157 and CMD157P3, intended for 6-18 GHz applications, each feature noise figure of 1.5 dB, deliver greater than 25 dB of flat gain, and have corresponding output 1 dB...

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PLC Modem SoC suits smart metering, building automation markets.

PLC Modem SoC suits smart metering, building automation markets.

Supplied in 8 x 8 x 1 mm QFN-52 package, NCN49597 power line carrier (PLC) modem system-on-chip (SoC) combines 32-bit ARM Cortex M0 processor with analog front-end for applications such as e-metering, home automation, solar energy, and lighting control. SoC is based on dual 4800-baud S-FSK (Spread Frequency Shift Keying) channel technology and complies with IEC61334-5-1 standard. Features include...

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High-Voltage BCD Process has 0.18 µm form factor.

With operability rating of 60 V, Premium 0.18 micron Bipolar-CMOS-DMOS (BCD) high-voltage process will support additional voltage ranges (12-60 V) for applications such as DC/DC converters, PoE, LED drivers, audio amps, and PMICs for mobile and consumer markets. Solution employs deep-trench isolation technology and high-voltage LDMOS device optimization, is compatible with standard CMOS...

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Smartphone Power SoC Chipset manages power for ~60 channels.

TINI-® Power SoC chipset in Galaxy S-® III operates with Exynos 4412 quad-core applications processor to minimize smartphone form factor while increasing it efficiency. Covering all power management, charging, and USB multiplexing needs, chipset provides balance between size and flexibility to power Samsung-® applications processor and baseband processor. Green Mode regulators and...

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Direct Digital Synthesizer ICs offer up to 64-bit resolution.

Synthesizing analog output sinusoidal waveforms at up to 1.4 GHz, programmable DDS ICs achieves clock speeds of 3.5 GSPS (Model AD9914) and 2.5 GSPS (Model AD9915). Units include 32-bit parallel port, for changes to frequency, phase, and amplitude of output signal, and 12-bit D/A converter. They also feature programmable modulus mode for precise frequency generation. Consuming approximately 2.5 W...

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Toshiba Introduces New High Gain, High Power X-Band GaN Hybrid IC

Supporting AESA, PESA Radar Applications, GaN Hybrid IC Optimized for High Gain, High Power MONTREAL, - 2012 INTERNATIONAL MICROWAVE SYMPOSIUM, Booth #2710 - Toshiba America Electronic Components, Inc. (TAEC*) and its parent company, Toshiba Corp., today announced the introduction of its new gallium nitride (GaN) hybrid IC (HIC), which is optimized for high gain and power. Available in small...

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