
New Switching Battery Charger Offers 95% Efficiency at 4.6-V and 0.5-A Output
BQ25619 enables 7% high battery capacity and long run time. Includes integrated charge, boost converter and voltage protection to support design for space-constrained applications. Reduces battery leakage down to 6 uA in ship mode.
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New USB Power Delivery ICs Available with MPLAB Connect Configurator Hub Configuration Tool
UPD301A simplifies the implementation of basic USB Type-C PD charging functionality. Ideal for applications from rear seat charging in vehicles to portable equipment to public charging stations. USB705x family enables fast device charging and introduces PD implementations called HostFlexing and PDBalancing.
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New ISL78714 Battery Management IC is AEC-Q100 Grade-2 Qualified
Monitors and balances up to 14 series connected cells with ±2mV accuracy. includes a precision 14-bit analog-to-digital converter and associated data acquisition circuitry. Offers up to six external temperature inputs and includes fault detection and diagnostics for all key internal functions.
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New InnoSwitch3 AC-DC Converter ICs for Energy-efficient Power Conversion
Innoswitch3-CP, Innoswitch3-EP and Innoswitch3-Pro ICs feature up to 95% efficiency across the full load range. Combines primary, secondary and feedback circuits in single surface-mounted package. Provides accurate CV/CC/CP independent of external components.
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Inventory Management Services
This white paper provides an overview into the benefits, approaches and considerations for inventory management services.
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Motion Control Chips offer direct upgrade paths.
Series PCD46x1A features single-axis (PCD4611A), dual-axis (PCD4621A), and quad-axis (PCD4641A) models. With respective QFPs of 48, 64, and 100 pins, chip package and terminal allocation of all three models- are compatible with those of PCD46x1 series. Series PCD46x1A can also mount on same boards as previous chips. Functionality lets CPU connect to chips with 8-bit parallel bus connection or...
Read More »Cryptography-Enabled 32-bit MCU adds security to IoT devices.
Supplied in 144-WFBGA package, CEC1302 (Part No. CEC1302D-SZ-C0) allows for pre-boot authentication of system firmware to ensure- it is untouched and uncorrupted. This- prevents- such attacks as man-in-the-middle, denial-of-service, and backdoor vulnerabilities. Also, MCU can be used to authenticate any firmware updates and thereby- protect system from malware or memory corruption. Features...
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Micro-Power Buck Converters (65 V) feature low quiescent current.
Respectively intended for powering factory automation and automotive sensor applications, LM5165 and LM5165-Q1 are 65 V, 150 mA synchronous DC/DC buck converters that- feature 10.5 -µA quiescent current and 10-pin, 3 x 3 mm VSON package. Input voltage range of 3–65 V and dual control modes optimize efficiency and PCB area. Other features include dual MOSFETs, PFM and COT control...
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Vision DSP targets embedded neural network applications.
Based on Cadence Tensilica Xtensa-® architecture, Cadence-® Tensilica-® Vision P6 combines flexible hardware choices with library of vision/imaging DSP functions and applications. Device quadruples multiply-accumulate (MAC) performance compared to previous generation, and utilizes 8- and 16-bit arithmetic to optimize key vision functions such as convolution, FIR filters, and matrix...
Read More »TV White Space Module ensures reliable broadband connection.
Using low-band spectrum in vacant UHF TV frequencies and IEEE 802.11af WiFi standard, Picasso Gen3 TV White Space Chip Module will allow hundreds of users to receive reliable broadband connection with data download speeds up to 96 Mbps from single base station. Unlike other wireless technologies, Gen3 non-line-of-sight signal penetrates walls, trees, foliage, and bends over hills, even at long...
Read More »Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
CEVA-XC DSP powers Autotalks’ second-generation V2X communications solution supporting concurrent IEEE802.11p and IEEE802.11a/b/g/n/ac operation MOUNTAIN VIEW, Calif and KFAR NETTER, Israel. - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, and Autotalks Ltd., the world’s leading provider of integrated V2X chipsets, today announced that...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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