LED Printed Circuit Assemblies support low and high power applications.
Compatible with LED subassemblies across several industries, LED Printed Circuit Assemblies support rigid and flexible circuits used in packaging LED products. Proprietary BIN control ensures consistent lot-by-lot LED luminosity output ranges. Products support backlighting applications with polyester circuits that support lower-power consumption applications as well as heat-sinked polyimide and...
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LED Printed Circuit Assemblies support low and high power applications.
Compatible with LED subassemblies across several industries, LED Printed Circuit Assemblies support rigid and flexible circuits used in packaging LED products. Proprietary BIN control ensures consistent lot-by-lot LED luminosity output ranges. Products support backlighting applications with polyester circuits that support lower-power consumption applications as well as heat-sinked polyimide and...
Read More »High Performance Capacitor Laminate is halogen-free.
Consisting of thin capacitor laminate, Embedded Capacitance Material can be embedded into printed circuit boards and computer chip packages to minimize impedance, power bus noise, EMI, and discrete capacitor count. Halogen-free ECM is RoHS-compliant and compatible with standard rigid and flexible printed circuit board processing, including laser drilling.
Read More »High Performance Capacitor Laminate is halogen-free.
Consisting of thin capacitor laminate, Embedded Capacitance Material can be embedded into printed circuit boards and computer chip packages to minimize impedance, power bus noise, EMI, and discrete capacitor count. Halogen-free ECM is RoHS-compliant and compatible with standard rigid and flexible printed circuit board processing, including laser drilling.
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Understanding Water Hammer
DFT Inc's engineers have been working with professionals in a range of industries for decades, helping to identify and resolve the underlying causes of water hammer. In this eBook you will learn about many of these common causes, how they impact your system and some of the basic changes you can make to eliminate them. In this eBook you will learn: What causes water hammer and why it is such a persistent problem. The role design plays in reducing the risk water hammer poses to your system. DFT's professional recommendations for coping with water hammer.
Read More »PCB Substrate is designed for LED module applications.
Tlam(TM) SS LLD is thermally-conductive PCB substrate that allows for heat dissipation in bright and ultra-bright LED module applications. Product features copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric, which provides electrical isolation, thermal transfer, and adhesion layer for substrate. Standard constructions are made with 1 or 2 oz copper and...
Read More »PCB Substrate is designed for LED module applications.
Tlam(TM) SS LLD is thermally-conductive PCB substrate that allows for heat dissipation in bright and ultra-bright LED module applications. Product features copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric, which provides electrical isolation, thermal transfer, and adhesion layer for substrate. Standard constructions are made with 1 or 2 oz copper and...
Read More »Mechatronics Module enables development of custom actuators.
Featuring 3.3 V input voltage for battery-powered operation, M3 Micro-Mechatronic Module Design Platform yields complete closed-loop actuator on PCB measuring 12 x 30 mm or less. No external control board is necessary; serial commands drive on-board PID controller using standard I2C, SPI, or USART interface. Typical specifications for linear drive system based on M3 Design Platform include 0.5...
Read More »Mechatronics Module enables development of custom actuators.
Featuring 3.3 V input voltage for battery-powered operation, M3 Micro-Mechatronic Module Design Platform yields complete closed-loop actuator on PCB measuring 12 x 30 mm or less. No external control board is necessary; serial commands drive on-board PID controller using standard I2C, SPI, or USART interface. Typical specifications for linear drive system based on M3 Design Platform include 0.5...
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HDI Flex Circuits offer microvia capability.
Minimizing layer count and circuit size, High Density Interconnect Flexible Circuits feature blind and buried microvia capability down to 75 microns and trace and space capabilities down to 50 microns. Minimum core dielectric thickness is 25 microns and minimum copper thickness is 9 microns. Copper via fill is available.
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HDI Flex Circuits offer microvia capability.
Minimizing layer count and circuit size, High Density Interconnect Flexible Circuits feature blind and buried microvia capability down to 75 microns and trace and space capabilities down to 50 microns. Minimum core dielectric thickness is 25 microns and minimum copper thickness is 9 microns. Copper via fill is available.
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Oilfield Improvements® Wheeled Rod Guide® Couplings Celebrate 35th Anniversary
For over 35 years our Wheeled Rod Guide Couplings, have been at work in oil fields across the globe. Our products are engineered to extend the service life of sucker rods and tubing, delivering cutting-edge innovation that enhances oilfield operation, maximizes output, and enhancing overall operations. To learn about the advantages of using Wheeled Rod Guide Couplings in your wells, see our video.
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