Qualcomm Announces New UMTS Products Available to Customers for the United States Market
SAN DIEGO, Jan. 2 - Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced the availability of new UMTS (WCDMA) chipsets designed to comply with the latest ruling from a federal judge in Santa Ana, CA. The Company's new products are available to device manufacturing customers for product shipment into the United...
Read More »Fujitsu and Sigma Designs Announce Wireless HDAV Technology Collaboration; Demonstrations at CES 2008
Wireless HDAV First to Leverage H.264 and WiMedia Standards for Streaming High Definition Content without Cables MILPITAS, Calif. and SUNNYVALE, Calif., Jan. 2 - Sigma Designs (NASDAQ:SIGM), a leading provider of highly integrated systems-on-a-chip (SoC) solutions, and Fujitsu Microelectronics America, Inc. (FMA), an innovative leader providing high-performance, reliable semiconductor products...
Read More »Chip enables high-definition wireless audio.
STS DARR81 chip enables uninterrupted streaming of HD uncompressed wireless audio and is bidirectional, allowing HD audio to be transmitted and received with single device simultaneously. Up to 8 different concurrent single streams or 4 bidirectional streams of HD audio are allowed, enabling 5.1 and 7.1 surround sound, headphone, and multiroom applications at same time. Range is up to 150 ft...
Read More »Metalink Announces the General Availability of Its Performance-Leading 802.11n Home Networking Solution at CES
YAKUM, Israel, December 18 - Metalink Ltd. (NASDAQ: MTLK), a provider of high-performance wireless and wireline broadband communication silicon solutions, today announced that its award winning 802.11n WLANPlus(TM) chipset is now commercially available and featured in cutting-edge products such as Residential Gateways, Set-top boxes and Video Bridges by major companies worldwide. Metalink offers...
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5 Unique Applications for Surface Treatment Equipment eBook
The surface requirements and restrictions for components may vary from one industry to another. For this reason, components may have to undergo different types of surface treatments.
Read More »Agilent Technologies and Fujitsu Microelectronics Pacific Asia Ltd. to Deliver Chipset Test Solution for Mobile WiMAX(TM) with Highest Measurement Throughput
SANTA CLARA, Calif., and TAIPEI, Taiwan, Oct. 24, 2007 Agilent Technologies Inc. (NYSE: A) and Fujitsu Microelectronics Pacific Asia Ltd. today announced the integration of Agilent's WiMAX(TM) test solutions into Fujitsu's chipset test solution for Mobile WiMAX, enabling the highest measurement throughput available in the industry today. The Agilent MXZ-1000 Manufacturing Test System for WiMAX is...
Read More »Wi-Fi Chips enable broad deployment of triple-play gateways.
Suited for multiplay gateways, XSPAN(TM) 2.4 GHz/5 GHz Model AR9220 provides 802.11a/g/n performance, supporting up to 300 Mbps physical data rates and 200 Mbps of user throughput on uplink and downlink. Single-band 2.4 GHz Model AR9223 brings 802.11n throughput levels into basic home gateways with up to 300 Mbps physical data rates. PCI interface allows for direct integration on DSL...
Read More »Xilinx XtremeDSP Solution Enables Dolby's LED-Backlit LCD Display Technology
FPGA-enabled HDR technology offers real-world perception of depth, detail and color SAN JOSE, Calif., Dec. 11 -- Xilinx Inc., (NASDAQ:XLNX) today announced that its Virtex(TM)-4 SX field programmable gate arrays (FPGAs) chipsets have been approved for Dolby Laboratories, Inc.'s (NYSE:DLB) recent high dynamic range (HDR) innovations. Dolby joins a growing number of industry leaders leveraging the...
Read More »Centillium Leads the Way to Greener Broadband with Initiative for Environmentally Friendly, Low-Power Communications Chipsets
FREMONT, Calif., Nov. 27 -- Centillium Communications, Inc. (NASDAQ:CTLM), today announced an initiative to facilitate greener broadband by developing its next-generation communications systems-on-chip (SoC) with smaller form factors and significantly reduced power consumption. Centillium has consistently maintained a leadership position in developing chipsets that require less power than...
Read More »Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets
SAN JOSE, Calif., Nov. 19 -- CEVA, Inc. [(NASDAQ:CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has...
Read More »Spreadtrum and ZTE First to Demonstrate TD-MBMS
SHANGHAI, China, Oct. 23 / - Spreadtrum Communications, Inc. and Zhongxing Telecommunication Equipment Co., Ltd. (ZTE Corporation, 0763.HK) today announced that ZTE Corporation R&D Centre (Shanghai) has successfully demonstrated TD-MBMS network services using Spreadtrum's TD-SCDMA/GSM/GPRS dual-mode chipset solution. MBMS, Multimedia Broadcast/Multicast Service, is a packet based broadcast...
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Innovative Dampney Coating Systems Suit Even the Most Specialized Applications
Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.
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