Chip Sets

Signal Processors

Qualcomm's DSP Access Program Debuts

- Program Enables Manufacturers (OEMs) and Independent Software Vendors (ISVs) to Optimize Multimedia Solutions Utilizing Qualcomm Audio and Video Acceleration Hardware - SAN DIEGO -- Qualcomm Incorporated (Nasdaq: QCOM) today announced that OEMs and ISVs will now be able to program their own audio and video codecs using optimized processors and hardware on select versions of Qualcomm's Mobile...

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Miscellaneous Controllers

Atmel maXTouch Solution Powers LG Electronics Mobile's G-Slate Tablet 8.9" Touchscreen

SAN JOSE, Calif. - Atmel® Corporation (Nasdaq: ATML), a leader in microcontroller and touch technology solutions, today announced that LG Electronics Mobile, one of the largest handset manufacturers in the world, has selected the Atmel maXTouch solution for its recently-launched G-Slate 8.9-inch Android tablet touchscreen. The new LG Electronics Mobile G-Slate is a 4G tablet with an...

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Miscellaneous Processors

Altair Semiconductor and Alcatel-Lucent Jointly Deliver LTE Band Class 12 Solution in North America

First Commercial Band Class 12 Compliant Chipset from Altair Semiconductor HOD HASHARON, Israel -- Altair Semiconductor (www.altair-semi.com), the world's leading developer of ultra-low power, small footprint and high performance LTE chipsets, announced today that its Band Class 12 solution, combining Altair's 4G LTE chipsets and Alcatel-Lucent's LTE infrastructure, has successfully completed a...

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Toray Introduce a New Dimension in Microarray Sensitivity
Arrays

Toray Introduce a New Dimension in Microarray Sensitivity

Innovative 3D-Gene(TM) DNA chips incorporate unique features to increase microarray accuracy London : Toray has today announced the European release of its groundbreaking 3D-Gene(TM) products, a range of three dimensional DNA chips for use in microarray analysis. The new microarrays utilise several unique features to enhance assay sensitivity, providing the perfect platform for working with low...

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Miscellaneous Controls

Fujitsu Announces World's First High-End Controller with APIX2 Interface for Automotive Applications

Virtual dashboards, car navigation and camera-based driver assistance from a single chip Langen, Germany - Fujitsu Semiconductor Europe announces the new graphics SoC (System-on-Chip) for next-generation high-end automotive graphics applications - the first SoC in the world with integrated APIX®2 interface. MB86R12 'Emerald-P' will be produced to automotive quality grade (AEC-Q100) and is a...

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Circuits

Fujitsu's New 'Emerald' Family Enables 360° Wrap-around View for Automotive Sector ... with the Added Flexibility of Virtual Cluster Applications

Langen and Nuremberg, Germany - Fujitsu Semiconductor Europe has developed an advanced wrap-around view technology that represents a novel driver's visual assistance methodology. The images are taken by 4 cameras and combined in such a way as to appear as if taken from a bird's-eye view. The video images from these cameras are combined seamlessly and projected onto a virtual 3D curved surface....

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Circuits

Alcatel-Lucent and Altair Semiconductor Enable TD-LTE Solutions for Emerging Markets

Companies to Jointly Participate in TD-LTE Field Trials in India and China BARCELONA, Spain, Feb. 16, 2011 - Mobile World Congress - Altair Semiconductor, the world's leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, today announced that their TD-LTE solution, combining Altair's 4G LTE chipsets and Alcatel-Lucent's (Euronext Paris and NYSE: ALU) LTE...

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Modems

Qualcomm Introduces 28nm Mass Market LTE/DC-HSPA+ Chipsets for Mobile Broadband Products

MDM9615 to Support Multi-Mode LTE and MDM8215 to Support Dual-Carrier HSPA+ BARCELONA, Spain, -- Qualcomm Incorporated (Nasdaq: QCOM) today announced two new devices in its family of Mobile Data Modem(TM) (MDM(TM)) chipsets, the MDM9615(TM) and MDM8215(TM). The next generation MDM9615 will support LTE (FDD and TDD), DC-HSPA+, EV-DO Rev-B and TD-SCDMA and the MDM8215 will support DC-HSPA+. These...

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Single Board Computers (SBC)

Qualcomm Announces Next-Generation Snapdragon Mobile Chipset Family

Qualcomm Announces Next-Generation Snapdragon Mobile Chipset Family -- Mobile Technology Leader Debuting New Quad-, Dual- and Single-core Snapdragon Chipsets with a new CPU Architecture -- BARCELONA, Spain, -- Qualcomm Incorporated (Nasdaq: QCOM) today announced its next mobile processor architecture for the Snapdragon family. The new processor micro-architecture, code-named Krait, in the...

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Poly-Phase Metering Chipset enhances modular smart meters.
Circuits

Poly-Phase Metering Chipset enhances modular smart meters.

Together, STPMC1 and STPMS1/S2 support 50-60 Hz IEC and ANSI standards for up to 0.2 class AC Watt meters. Metrology IC STMPC1 accepts measurements from 3 phases, with option of fourth channel for tamper/temperature detection and fifth to accept magnetic field information from Hall sensor. Respectively featuring first- and second-order modulator, STPMS1/2 dual-channel delta-sigma modulators...

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