New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
Read More »
New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
Read More »New 112G XSR/USR PHY for Data Center, Networking, 5G, HPC and AI/ML Applications
112G XSR/USR PHY is a critical enabler of the D2D and D2OE interconnects for chiplet architectures. Chiplet connectivity solution has been demonstrated in silicon to exceed the challenging reach/BER performance of the CEI-112G XSR specification. Supports NRZ and PAM-4 signaling at various data rates for maximum design flexibility.
Read More »New 112G XSR/USR PHY for Data Center, Networking, 5G, HPC and AI/ML Applications
112G XSR/USR PHY is a critical enabler of the D2D and D2OE interconnects for chiplet architectures. Chiplet connectivity solution has been demonstrated in silicon to exceed the challenging reach/BER performance of the CEI-112G XSR specification. Supports NRZ and PAM-4 signaling at various data rates for maximum design flexibility.
Read More »
A Guide to Robotic Cells in Automation: Electronics & Auto Parts
This white paper provides an overview into robotic cells in automation electronics and auto parts.
Read More »
New CDR SR Solutions for Ethernet Switches Over 70 m of OM3 Fiber and 100 m of OM4 Fiber
GN2558 is a quad PAM4 CDR with an integrated VCSEL driver. GN2559 provides high receiver performance with fast adaptation and startup. Includes configurable output equalization enabling robust electrical interfaces.
Read More »
New CDR SR Solutions for Ethernet Switches Over 70 m of OM3 Fiber and 100 m of OM4 Fiber
GN2558 is a quad PAM4 CDR with an integrated VCSEL driver. GN2559 provides high receiver performance with fast adaptation and startup. Includes configurable output equalization enabling robust electrical interfaces.
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
Read More »
New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
Read More »
New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
Read More »
Don't Let Your Money Drain Down the Hole...Drill Steel with Euroboor
As a globally recognized manufacturer of industrial grade portable tools, Euroboor is at the forefront of drilling and cutting technology. Our reputation as an industry leader is built on robust products that fit a wide range of industrial cutting and drilling applications. See our video to learn more about all of our quality products.
Read More »
