New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
Read More »New 112G XSR/USR PHY for Data Center, Networking, 5G, HPC and AI/ML Applications
112G XSR/USR PHY is a critical enabler of the D2D and D2OE interconnects for chiplet architectures. Chiplet connectivity solution has been demonstrated in silicon to exceed the challenging reach/BER performance of the CEI-112G XSR specification. Supports NRZ and PAM-4 signaling at various data rates for maximum design flexibility.
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New CDR SR Solutions for Ethernet Switches Over 70 m of OM3 Fiber and 100 m of OM4 Fiber
GN2558 is a quad PAM4 CDR with an integrated VCSEL driver. GN2559 provides high receiver performance with fast adaptation and startup. Includes configurable output equalization enabling robust electrical interfaces.
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
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The ROI of a Full Service Manufacturer
Full service manufacturers incorporate a complete line of production capabilities to facilitate fast, cost-efficient manufacturing of complex products without the need for multiple contractors.
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New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
Read More »New MIPI C-PHY/D-PHY IP Provides Fast Connectivity in Mobile and Automotive Applications
Delivers less than 1.3pJ/bit, operating at 24 Gb/s, for optimal energy consumption in high-resolution imaging devices. Offers comprehensive built-in test capabilities, including pattern generator, logic analyzer and loopback modes covering all circuits. Enables 4K and beyond displays and 100-megapixel cameras with support for up to 4.5 Gb/s per lane maximum speed in D-PHY configuration and 3.5...
Read More »Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design
DesignWare 56G PHY Delivers Leading Power and Performance with High Reliability Mountain View, Calif., March 19, 2020 /PRNewswire/ -- Highlights: Inomize selected Synopsys' DesignWare 56G Ethernet PHY IP for its next-generation fully integrated high-performance computing and software-defined radio communications SoC requiring low power and high reliability The DesignWare 56G Ethernet PHY...
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REDBUD LABS STR™ Microfluidic Chip Enables 1000x Faster Sample Prep for On-cartridge Magnetic Bead Assay
Cartridge-ready™ STR Chip facilitates lower-risk development of point-of-care diagnostics by leveraging proven magnetic bead sample prep chemistry Research Triangle Park, N.C., Dec. 19, 2019 /PRNewswire/ -- Redbud Labs announced today new results that expand the menu of functional chemistries for its sample preparation chip, STR™ ( sorter ). The new protocol outperformed not only the...
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Valens Ensures Automotive Functional Safety Per ISO 26262 Process Certification
-- Certified by SGS-TÜV Saar GmbH, Valens' certification emphasizes the company's vision to provide a safer, reliable solution for in-vehicle connectivity -- HOD HASHARON, Israel, Dec. 17, 2019 /PRNewswire/ -- Valens, the leader in ultra-high-speed in-vehicle connectivity, announced today that the company has been certified per ISO 26262 ASIL-B requirements for functional safety in...
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Valens In-Vehicle Ultra-High-Speed Connectivity Chipsets Selected as a CES 2020 Innovation Awards Honoree
The CES Innovation Awards program is an annual competition honoring outstanding design and engineering technology HOD HASHARON, Israel, Nov. 11, 2019 /PRNewswire/ -- Valens, the leader in ultra-high-speed in-vehicle connectivity, announced today that its in-vehicle ultra-high-speed connectivity chipsets have been chosen as a CES 2020 Innovation Awards Honoree. Valens' latest chipset – the...
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Delivery Equipment That Really Delivers
Are you in need of safer, more efficient transportation equipment? Do you feel like your delivery equipment could really use an upgrade? Check out this video, and learn about Halo Ramp Company's patented safety platforms, and how they help you bypass your trickiest delivery challenges.
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