Chip Sets

Teracom and Broadcom Collaborate on Ultra HD Broadcast Demonstration

HEVC Decode for Content Delivery Using DVB-T2 Terrestrial Standard at TV-Puls STOCKHOLM —Â- Teracom TV-Puls - Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that Teracom, a provider of terrestrial network operations in Sweden and Denmark, has selected BroadcomÂ-® silicon to demonstrate 4K...

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Quad-Core Chipset supports WCDMA/HSPA+ in tablets.

IntegratingÂ- quad-core ARM Cortex™-A7 CPU, Model SC5735 supports Android 4.4 and dual-band WCDMA/HSPA+ as well as quad-band GSM/GPRS/EDGE communications standards. Solution integrates quad or dual Mali 400 for high performance graphics, and supports up to 1080p screen resolution as well as 5 megapixel primary camera and up to 2 megapixel secondary camera. Connectivity functions include...

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ALi STB Chipsets Integrated with Middleware from ACCESS STB Labs to Provide Value-added Services and Applications

Bangalore and Taipei –Â- ALi Corporation, a leading Set-Top Box (STB) solution provider, today announced that ALi’s STB chipsets have incorporated middleware solutions from ACCESS STB Labs, a media and entertainment software development company based in Bangalore, India, offering end-to-end innovative and cost-effective solutions for Digital TV market. Every market is looking to optimize...

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HP, Google Select Altair Semiconductor for Newest LTE-Only Chromebook

Chromebook 11.6 LTE Heralds New Era of Affordable Cloud-Based Devices HOD HASHARON, Israel,Â-  - Altair Semiconductor the world's leading developer of high-performance, single-mode LTE chipsets, today announced that its FourGee-3100/6202 chipset [http://altair-semi.com/product/fourgee-3100-6202 was selected to connect the new HP Chromebook 11.6 LTE to the Verizon Wireless 4G LTE network. The...

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Marvell G.hn-Certified Chipset Powers Netwave's Home Connectivity Solutions

Award-winning silicon enables high-speed access to multimedia content over any wires in the connected home SANTA CLARA, Calif. and LAS VEGASÂ- – Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, today announced that Netwave has selected Marvell's award-winning and HomeGrid Forum-certified G.hn chipset for its powerline to Ethernet adapter. Netwave joins the growing...

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DisplayLink and Targus Announce the Latest USB3.0 Dock, the Targus ACP7101USZ Using DisplayLink's New DL-3950 Chipset Featuring Dual 2560x1600 Resolution

PALO ALTO, Calif. and ANAHEIM, Calif.Â- — DisplayLinkÂ-®, the leading provider of USB Graphics technology and TargusÂ-® Inc, maker of the world's top-selling laptop computer cases and accessories, today announced the official launch of the new Targus Universal USB 3.0 DV2K Docking Station with Power utilizing the latest DL-3950 chipset from DisplayLink. The new Targus ACP7101USZ...

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Single-Mode LTE Chipsets support LTE Release-10 features.

Based on Altair's 3rd generation SDR architecture, FourGee™-3800/3802 Baseband Processors and FourGee™-6300 Radio Chip includeÂ- 700 MHz network processor subsystem. Units offer wide frequency band span of 400–3,800 MHz with 6 concurrent LTE bands for both primary and diversity antennas, enabling global band combinations. Providing Category 4 throughput of 150Â- Mbps DL/50 Mbps UL,...

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Broadcom Announces World's First CMOS 40G Serial Mux/Demux Chipset

Broadcom Technology Features Industry's Lowest Power Consumption LOS ANGELES, March 5, 2012 - OFC/NFOEC Technical Conference 2012 - News Highlights: o Enables new tri-rate optical module market segment: 40GbE, OC-768, and OTU-3 o Industry's lowest power consumption - mux and demux consume only two watts combined - 60% lower than nearest competitor o Industry's first 40G serial mux/demux chipset...

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Multimode Modem addresses fragmentation issues.

Suited for TD-SCDMA and LTE markets, MarvellÂ-® PXA1802 multimode TD LTE modem chipset integrates TDD, FDD LTE, and TD-SCDMA technology onto single chip. Thin architecture includes DSP modem core; cellular baseband core; PWU; DMA; and external interfaces. Supporting next-generation LTE standards with Cat 4 150 Mbps downlink throughput and Release 8 TD-SCDMA High-Speed Packet Access (HSPA+),...

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