Valens In-Vehicle Ultra-High-Speed Connectivity Chipsets Selected as a CES 2020 Innovation Awards Honoree
The CES Innovation Awards program is an annual competition honoring outstanding design and engineering technology HOD HASHARON, Israel, Nov. 11, 2019 /PRNewswire/ -- Valens, the leader in ultra-high-speed in-vehicle connectivity, announced today that its in-vehicle ultra-high-speed connectivity chipsets have been chosen as a CES 2020 Innovation Awards Honoree. Valens' latest chipset – the...
Read More »Spreadtrum Announces Support for Tizen Operating System
Samsung's Z1, its first Tizen smartphone now launched in India, combines Spreadtrum's WCDMA chipsets with the Tizen operating system SHANGHAI –- Spreadtrum Communications, a leading fabless semiconductor company in China with advanced technology in 2G, 3G and 4G wireless communications standards, today announced that it has successfully completed the integration of the Tizen operating system...
Read More »Xilinx and Over 30 Alliance Program Members to Showcase Zynq All Programmable SoC Solutions at Embedded World 2015
Presentations and demonstrations to feature solutions for smarter automotive, industrial, and vision-based applications SAN JOSE, Calif.,- – Xilinx, Inc. (NASDAQ: XLNX) and over 30 Alliance Program Members will showcase Zynq-® All Programmable SoCs at Embedded World 2015. Through a series of presentations and demonstrations, Xilinx will feature solutions for smarter automotive, industrial,...
Read More »Actions Semiconductor's Tablet Chipsets Provide Advanced, Efficient Graphics with Imagination's PowerVR GPUs
Companies extend close relationship for future-generation OWL chipsets ZHUHAI, China and BARCELONA, Spain- – Imagination Technologies (IMG.L) and Actions Semiconductor Co., Ltd. (Nasdaq: ACTS), one of China's leading fabless semiconductor companies, are extending their collaboration in bringing advanced graphics to a range of Actions' OWL chipsets which are designed to address each segment of...
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Read More »Quad- and Octa-Core Chipsets integrate 5-mode global LTE.
Integrating 3rd Generation LTE modem and 64-bit capabilities, octa-core Snapdragon™ 610 and quad-core Snapdragon™ 615 support Category 4 data rates for requirements such as LTE-Broadcast and LTE Dual SIM Dual Active. Both chipsets also integrate critical 3G technologies, including HSPA+ up to 42 Mbps, CDMA, and TD-SCDMA. Enabling optimized graphics performance, Adreno 405 GPU supports Full...
Read More »Micro Mirror Array delivers bright images, extends battery life.
Based on DLP Cinema-® technology, 0.3 in.- HD Tilt & Roll Pixel (TRP) DLP-® Pico™ chipset can generate high-definition (HD) displays from compact electronics. This micro-mirror array leverages TRP DLP architecture and adaptive IntelliBright™ suite of algorithms. Switching speeds of up to thousands of times per second enables compact, true-color RGB engines with 120 Hz video performance.
Read More »Single-Mode LTE Chipset supports range of advanced functions.
Based on SDR architecture supporting 3GPP Release 10 (software-upgradable to support Release 11), FourGee-3802 LTE-Advanced baseband processor supports RF band span of 400–3,800 MHz with 6 parallel MIMO RF ports, has on-chip HD VoLTE, and offers- advanced LTE feature support. Product, together with FourGee-6300 companion radio chip, supports such features as- Category 6 throughputs of up to...
Read More »DesignCon Recognizes Altera for Outstanding FPGA and SoC Innovations
Altera Wins Two 2014 DesignVision Awards for its 14 nm Stratix 10 FPGAs and SoCs and ARM DS-5 Altera Edition Toolkit for SoCs SAN JOSE, Calif. –- Altera Corporation (NASDAQ: ALTR) today announced it received two DesignVision Awards at DesignCon 2014 for its innovations in FPGA and SoC technology. Altera's next-generation, 14 nm Stratix 10 FPGAs and SoCs won for best semiconductor and IP, and...
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PICMG 1.0 SBC handles complex industrial application demands.
With onboard Intel-® B75 chipset,- FSB-B75G Intel 3rd Generation Core™ i7/i5/i3 LGA1155 socket PICMG 1.0 full-size SBC is compatible with legacy ISA and PCI interfaces and built for system failure resistance. SBC supports up to 16 GB of DDR3 1333/1600- for system memory- as well as- optional onboard CFast™ slot. Operating from 0 to +60-
Read More »Altair Selected by NTMore to Power Its LTE Mobile Hotspot Device
The NTMore-Altair Device Will Be Introduced in Several LTE Markets in 2013 HOD HA'SHARON, Israel and BARCELONA, Spain- Altair Semiconductor (http://www.altair-semi.com), the world's leading developer of high performance, single-mode LTE chipsets, today announced that its FourGee-3100/6202 chipset has been selected by NTMore (http://www.ntmore.kr), a leading manufacturer of LTE devices, to power...
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