New Boards Products

CorEdge Networks and Fujitsu Demonstrate Industry's First 10GbE MicroTCA Implementation at the MicroTCA Summit, May 30 to June 1, Baltimore, at Booth #29

BOSTON and SUNNYVALE, Calif., May 25 // -- CorEdge Networks and Fujitsu Microelectronics America, Inc. (FMA) have collaborated to develop the industry's first 10GbE MicroTCA demonstration. It will be shown at the MicroTCA Summit in Baltimore, Maryland, between May 30th and June 1st. The demonstration is housed in CorEdge's 2U PicoTCA system, a 3.5 x 13 x 8.5 (H x W x D) platform, which integrates...

Xilinx Virtex-5 SXT FPGAs Achieve PCI Express v1.1 Compliance

Proven solution enables users to rapidly adopt industry's fastest 65nm FPGAs with integrated low power endpoint blocks for PCI Express and serial transceivers SAN JOSE, Calif., May 23 / - Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable solutions, today announced that its XtremeDSP(TM) Virtex(TM)-5 SXT FPGAs have passed the latest PCI Express-® Endpoint v1.1 base...

Controller suits AdvancedTCA and MicroTCA platforms.

Based on Wintegra Winpath2 Processor technology, Model ATMIV AdvancedMC broadband communication controller offers 4 OC3/STM-1 or 2 OC12/STM-4 trunks and is suitable interface to process ATM and IP signaling and bearer traffic. Board and driver provide AAL2/5 to UDP/IP interworking, IP routing and forwarding over ATM, AAL2, and AAL5 termination, and AAL2 and AAL5 switching. High bandwidth carrier...

Xilinx Simplifies Memory Interface Designs with New Complete FPGA Solutions

SAN JOSE, Calif., May 29 /- Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable solutions, today announced immediate availability of its low cost Spartan(TM)-3A FPGA development kit for DDR2 SDRAM interfaces, the Virtex(TM)-5 FPGA development platform (ML-561) for multiple high-performance memory interfaces (I/Fs), and the memory interface generator (MIG) software version...

Key Considerations When Choosing the Right Medical Device Development Experts: From Concept to Market

This eBook covers various factors to consider when selecting a medical device development partner to ensure proper guidance from concept to launch.

Digital Input PCI Card also functions as relay actuator.

Model PCI-1763UP delivers 8 optically-isolated digital inputs with isolation protection of 2,500 Vdc for collecting digital inputs in noisy environments and 8 relay actuators for serving as on/off control devices or small power switches. It features LED indicators to show active relays, 8 form C type relay output channels, output status read-back, retained relay output values for hot system...

Graphics Board is UGM 1.0 compliant.

Designed for embedded and rugged mobile applications, Model UGM-M72 delivers high-end PEG features including support of DirectX 10 and Shader Model to accelerate 3D graphics for Windows Vista Aero. Board is equipped with 450-700 MHz version of R600 core, hardware-managed power modes, and Powerplay v7.0 power management technology. It provides full HD visualization, and supports hardware-decoded...

Compact PCI Card performs multiple functions.

Offred in -40 to +85Ã-

Data Acquisition System offers high-resolution measurements.

Mounted on single board computer, 24/7 Data Acquisition Wildcard accepts low level signals directly from transducers, amplifies and conditions them, and converts them with 24 bits of resolution with no missing codes. Analog-to-digital subsystem performs signal conditioning and conversion for up to 7 input channels, with conversion rate programmable from 4.8 Hz to over 1,010 Hz. Measuring 2 x 2.5...

Kit aids development of networked embedded systems.

Intended for STR91x 32-bit microcontroller family based on ARM966EÃ-® core, STR9-comStick is configured as USB stick with built-in USB connector that enables it to plug into host PC. Included Hitex software tools allow developer to modify and recompile application source code, program STR91x MCU, and debug applications as they run on development system. Kit also includes sample applications,...

Chips offer through-hole packaging option.

Electrically and thermally identical to SMT versions, VoI Chips with through-hole packaging are compatible with hand soldering and wave solder techniques. Through-hole assembly facilitates multi-chip, cold-plate or heatsink mounting, speeding system assembly. Packing option is available for all VoI Chips, including MIL-COTS versions.