Future Electronics Presents Nebula IoT Development Board with Cloud Connectivity
Electronic Boards

Future Electronics Presents Nebula IoT Development Board with Cloud Connectivity

The Nebula IoT Development Board comes with Cypress CYW4343W Wi-Fi (802.11 a/b/g/n) and Bluetooth 4.1 chipset radio. The unit is embedded with Arm® Cortex®-M4 STM32 MCU that features 32 bit RISC Core, 180 MHz frequency, 2MB Flash, up to 256 kB SRAM. The board provides cloud connectivity to Amazon Web Services, IBM Bluemix, Alibaba Cloud and Microsoft Azure. It’s hardware can be expanded...

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New Model 6001 QuartzXM System-on-Module Features Up to 18 GBytes of DDR4 SDRAM
Electronic Boards

New Model 6001 QuartzXM System-on-Module Features Up to 18 GBytes of DDR4 SDRAM

Pentek’s Model 6001 QuartzXM™ System-on-Module creates a multichannel data conversion and processing solution on single chip with eight integrated RF-class A/D and D/A converters. The unit provides LVDS connections to Zynq UltraScale+ FPGA and GTY communications for gigabit serial communication. It accepts analog IF or RF inputs and delivers the inputs as differential pairs into the RF-signal...

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An Introduction to Plastic Injection Molding
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An Introduction to Plastic Injection Molding

We developed this eBook with designers, engineers and purchasing specialists in mind. It is written to provide a basic understanding of plastic injection molding presses, processes and costs. Our goal is to make our customers more knowledgeable about what goes into making a plastic part.

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New Model 6001 QuartzXM System-on-Module Features Up to 18 GBytes of DDR4 SDRAM
Electronic Boards

New Model 6001 QuartzXM System-on-Module Features Up to 18 GBytes of DDR4 SDRAM

Pentek’s Model 6001 QuartzXM™ System-on-Module creates a multichannel data conversion and processing solution on single chip with eight integrated RF-class A/D and D/A converters. The unit provides LVDS connections to Zynq UltraScale+ FPGA and GTY communications for gigabit serial communication. It accepts analog IF or RF inputs and delivers the inputs as differential pairs into the RF-signal...

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New MitySOM-A10S-DSC Processor Board Comes with Dual-Side Connectors
Electronic Boards

New MitySOM-A10S-DSC Processor Board Comes with Dual-Side Connectors

MitySOM-A10S-DSC Processor Board is designed for machine vision, test and measurement, embedded instrumentation, industrial automation and control applications. Unit comes with Intel®/Altera Arria® 10 SoC with dual core ARM and up to 480KLE FPGA fabric and two DDR4 RAM memory subsystems. Supporting OpenCL™ and high-level synthesis (HLS) tools, the processor accelerates design cycles.

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New MitySOM-A10S-DSC Processor Board Comes with Dual-Side Connectors
Electronic Boards

New MitySOM-A10S-DSC Processor Board Comes with Dual-Side Connectors

MitySOM-A10S-DSC Processor Board is designed for machine vision, test and measurement, embedded instrumentation, industrial automation and control applications. Unit comes with Intel®/Altera Arria® 10 SoC with dual core ARM and up to 480KLE FPGA fabric and two DDR4 RAM memory subsystems. Supporting OpenCL™ and high-level synthesis (HLS) tools, the processor accelerates design cycles.

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New HDClear 3-Mic Development Kit Features Programmable Dual-Core DSP
Electronic Boards

New HDClear 3-Mic Development Kit Features Programmable Dual-Core DSP

HDClear™ 3-Mic Development Kit enables developers to build Alexa-enabled devices such as smart speakers, wearable computing device, smart home devices and remote controls. Kit comes with improved voice algorithms such as echo cancellation, noise reduction, beamforming and far-field enhancement. Unit’s DSP features SPI, I2C, UART and SLIMbus application processor interfaces. HDClear™ kit...

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