Universal to Present Leading-edge Placement Technology at Mexitronica 2006
Universal Instruments has announced plans to showcase the highly flexible AdVantis AX-72 and Quadris-S machine sets from booth #718 at this year's Mexitronica, being held over October 10th - 12th in Guadalajara, Mexico. An example of the AdVantis Platform's inherent flexibility, Universal's AdVantis AX-72 display will highlight one of the most adaptable models in the AdVantis collection. A...
Read More »
MIMOT's New 'Advantage X' Boosts Placement Rates
MIMOT's New 'Advantage X' Boosts Placement Rates Irvine, California, USA - MIMOT's new 'Advantage X' enhancement package boosts placement rates by 15%. The retrofittable Advantage X upgrade is suitable for all MIMOT pick and place machines; it combines both hardware and software advances. It is especially beneficial for MIMOT high-mix pick and place systems, bringing the c/h rate to 24,000 for...
Read More »
MIMOT's New 'Advantage X' Boosts Placement Rates
MIMOT's New 'Advantage X' Boosts Placement Rates Irvine, California, USA - MIMOT's new 'Advantage X' enhancement package boosts placement rates by 15%. The retrofittable Advantage X upgrade is suitable for all MIMOT pick and place machines; it combines both hardware and software advances. It is especially beneficial for MIMOT high-mix pick and place systems, bringing the c/h rate to 24,000 for...
Read More »
Tape Feeders suit high-speed chip placement equipment.
Including PSV sensor that notifies machine and line software when component reels are serviced by operator, High-Performance Gold Feeders support line-level reporting and traceability functionality. They offer continuous splice capability and high speed chip component presentation. Single lane 8 and 12 mm feeders have features for precise and repeatable feeder registration, while 16, 24, and 32...
Read More »
Custom Presentation Kits - Elevating ideas from conception to creation!
To find out more about how you can get a custom presentation kit tailored to your exact needs, download this whitepaper now.
Read More »
Tape Feeders suit high-speed chip placement equipment.
Including PSV sensor that notifies machine and line software when component reels are serviced by operator, High-Performance Gold Feeders support line-level reporting and traceability functionality. They offer continuous splice capability and high speed chip component presentation. Single lane 8 and 12 mm feeders have features for precise and repeatable feeder registration, while 16, 24, and 32...
Read More »
Universal Instruments to Showcase AdVantis Platform at ATExpo 2006
Universal Instruments has unveiled plans to showcase its popular AdVantis placement platform from booth #5842 at this year's Assembly Technology Expo, taking place over September 26th - 28th in Chicago, US. The Universal display will highlight AdVantis' ability to blend high-end machine productivity and operator flexibility for a value-driven performance. Equipped to respond to a variety of...
Read More »
Universal Instruments to Showcase AdVantis Platform at ATExpo 2006
Universal Instruments has unveiled plans to showcase its popular AdVantis placement platform from booth #5842 at this year's Assembly Technology Expo, taking place over September 26th - 28th in Chicago, US. The Universal display will highlight AdVantis' ability to blend high-end machine productivity and operator flexibility for a value-driven performance. Equipped to respond to a variety of...
Read More »Mass Imager performs singulated substrate processing.
SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms...
Read More »Mass Imager performs singulated substrate processing.
SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms...
Read More »Dispensing System features dual lane capability.
Enabling underfill flow-out in one lane while jetting underfill in opposite lane, Axiom X-1022 Dual-Lane dispensing system optimizes throughput in multi-pass underfill applications. SMEMA compliant, programmable, flat-belt conveyors are independently controlled, allowing different sized parts to be processed in each lane. System is configured with 6 stations of contact or impingement heating to...
Read More »
Von Ruden's Driven Tools Are Built to Last
Von Ruden's driven tools are designed to each specific machine in order to maximize performance. All of our tools are performance tested and made in the USA per ISO 9001:2015 standards. Check out our video to learn more.
Read More »
