Assembly Machinery

Wafer Feeder offers on-line wafer expander option.
Assembly Machinery

Wafer Feeder offers on-line wafer expander option.

Wafer Feeder is compatible with industry-standard wafer sizes, including 12, 8, and 6 in., and accepts full 25-wafer cassettes. It combines programmable die ejection, theta correction and expansion with wafer mapping and ink dot recognition, bar code identification, and tracking of wafers to handle complex dies in 300 mm format. Use of parallel processing has pared tact time as low as 1 sec/ die....

Read More »
Placement Machine offers placement rates to 54,000 cph.
Placement Equipment

Placement Machine offers placement rates to 54,000 cph.

Platform-based Genesis Lightning features dual heads, each with radial array of 30 modular, individually controlled spindles. Each plug-in spindle module contains tiny venturi vacuum generator to maintain very short vacuum path. Dual on-the-head optics allow machine to address components from 01005 to 30 x 30 mm. Machine supports component preorientation as well as on-the-head rejection for small...

Read More »
Pre-Assembly Equipment helps eliminate operator error.
Assembly Machinery

Pre-Assembly Equipment helps eliminate operator error.

Lockit Pre-Assembly Equipment permanently secures Lockit(TM) strain relief bushings to electrical cable and wire, repetitively. Headlock(TM) manual, single-feed assembly tool fits onto any tabletop. Autolock(TM) and Footlock(TM) models are semi-automatic tools for high-volume production runs. Stand-alone Autolock(TM) includes large-capacity vibratory feeder bowl, while tabletop Footlock(TM)...

Read More »
Assembly System is plug-and-play ready.
Assembly Machinery

Assembly System is plug-and-play ready.

ServoPress System, Model 405/4000, features 100% in-process control and monitoring with 180 lb peak load and 115 lb continuous duty load. Industrial servo actuator offers up to 5.9 in. ram stroke and max ram speed of 11.8 ips, while spindle assembly features load cell and mechanical clutch. Equipped with .000004 in. resolution encoder, system uses precision ground ball screw with direct motor...

Read More »
Stud Bumper handles 12 in. wafers in one pass.
Semiconductor Processing Equipment

Stud Bumper handles 12 in. wafers in one pass.

WaferPRO plus single-pass stud bumper bonds 22 bumps/sec, depending on bump type, size, and pitch. It offers +5 Â-µm positional accuracy at 3 sigma and can bump down to 65 µm. Various manual chucks and fully automatic wafer handling options are available. WaferPRO plus kit, which includes hardware, specialized servo code, and motion profiles, provides upgrade path for existing...

Read More »
Machine aids in prototype/testing applications.
Prototyping Systems

Machine aids in prototype/testing applications.

Measuring 8 in. wide with dimensionally warranted precision modules in 18 in. increments, Agileslim PL is available in 3 configurations: carrousel, vertical, or over and under. It utilizes servo-controlled or cam controlled motion for intermittent or continuous movement. Unit can be expanded, contracted, or modified, and is available with 2 or 3 in. precision links. It serves as production...

Read More »
Placement Machine offers speeds of up to 48,000 cph.
Placement Equipment

Placement Machine offers speeds of up to 48,000 cph.

Model 4797R HSP measures 3,100 x 2,155 mm and can handle boards up to 610 mm x 460 mm. It includes twelve 5-spindle, direct-drive placement heads and UCT53 software for offline programming. Three-sigma accuracy is 0.08 mm for MELFs and small chips, and 0.05 mm for leaded components. Machine accepts up to 72 unique components on standard 8 mm tape feeders, or 96 unique components with dual-track...

Read More »
Assembly Machinery

Press Center assembles complex backplanes.

Accommodating large and complex backplanes, modular Model EPC III rapidly fits PCBs with power terminals, HM connectors, ERmet ZD, and DIN strips. Connectors up to 180 mm in length are fed from packaging trays to transport conveyors. Robot makes it possible to remove and feed special connectors up to 250 mm long from any packaging. With pressing force of 80 kN, machine handles 1,200 x 600 mm PCBs...

Read More »
Tray Feeder handles range of semiconductor component trays.
Parts Feeders

Tray Feeder handles range of semiconductor component trays.

Model TF30 Automated Tray Feeder processes devices in and out of JEDEC and semiconductor-specific matrix trays during programming. Self-adjusting feature allows it to change tray configurations in seconds without need for operator adjustments. Batch Plus(TM) process allows component replenishment to feeder while host machine continues to program and process components. Model TF30 is compatible...

Read More »
Placement Machine offers up-front configurability.
Assembly Machinery

Placement Machine offers up-front configurability.

Built on Vantis platform, AdVantis(TM) scalable solution is suited for low-margin assembly applications. Basic in its standard format, machine features single-beam positioning system and is available with various options to make it readily configurable to specific applications. Product is suited for high-mix and high-volume manufacturers who need no more than it takes to perform certain tasks but...

Read More »

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers