Assembly Machinery

Splicers

Sonobond Announces Plans to Exhibit Two Ultrasonic Units at the Assembly & Automation Technology Expo, September 20-22, 2011.

The Dual Head SpliceRite(TM) Ultrasonic Wire Splicer and the SeamMaster(TM) High Profile Textile Bonder are leading examples of Sonobond's innovative technology. Both machines will be on display at Chicago's McCormick Place North, Booth #1147. WEST CHESTER, Pennsylvania - Melissa Alleman, Vice President of Sonobond Ultrasonics, announced today that the company will be exhibiting two examples of...

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Sonobond Announces Plans to Exhibit Two Ultrasonic Units at the Assembly & Automation Technology Expo, September 20-22, 2011.
Friction / Fusion Welders

Sonobond Announces Plans to Exhibit Two Ultrasonic Units at the Assembly & Automation Technology Expo, September 20-22, 2011.

The Dual Head SpliceRite(TM) Ultrasonic Wire Splicer and the SeamMaster(TM) High Profile Textile Bonder are leading examples of Sonobond's innovative technology. Both machines will be on display at Chicago's McCormick Place North, Booth #1147. WEST CHESTER, Pennsylvania, July 20, 2011-Melissa Alleman, Vice President of Sonobond Ultrasonics, announced today that the company will be exhibiting two...

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Assembly Machinery

NexLogic Technologies Adds New Fuji NXTII Ultra-High Accuracy Placement System

The new Fuji machine has a number of important features. But among its key ones benefiting NexLogic's OEM customers are high-speed, extreme placement accuracy of fine-pitch, small packaged components, advanced camera capabilities, and placement flexibility. NexLogic Technologies, Inc., a complete one-stop shop for PCB design, fabrication, and assembly, today announced the addition of a new Fuji...

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Assembly Machinery

Bosch Introduces New RIL 300 High-Speed Rod Inserter and Labeler for Syringes

o Accurate, high-speed rod insertion and labeling of up to 300 syringes per minute o Continuous product flow for high production capacity o Advanced controls ensure product quality and sterility At Interpack 2011 in Düsseldorf, Bosch Packaging Technology presents the RIL 300 Rod Inserter and Labeler, a high-speed, integrated system that inserts plunger rods into syringes after filling and...

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Assembly Machinery

Essemtec to Highlight Paraquda SMD Pick-and-Place in Utrecht

At the upcoming Electronics & Automation exhibition, taking place from May 25-27 in Utrecht, Netherlands, Essemtec will highlight the Paraquda SMD pick-and-place, the first system using ePlace operation software. Also highlighted will be the new Cobra feeder. Electronics & Automation in Utrecht is the most important exhibition in the Benelux for the electronics industry. Essemtec, the Swiss...

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Bonders

Sonobond Ultrasonics Bonding Equipment is Ideal for Assembling the Woven and Nonwoven Fabrics Used for Agricultural and Landscape Applications

EvoOrganic, a leader in Green Lifestyle Products, is one example of a company that relies on Sonobond units to ultrasonically assemble its garden fabrics. WEST CHESTER, Pennsylvania-Demand for environmentallyfriendly fabrics for agricultural, landscape, and garden applications continues to grow. Products made from these fabrics can be used as crop covers, turf protection, and frost barriers, as...

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Assembly Machinery

Essemtec to Premier Cobra Pick-and-Place in Paris

Essemtec will introduce the Cobra SMD pick-and-place at the upcoming Cien Exhibition in Paris, from May 24-26. Cobra is the latest product from Essemtec, the Swiss manufacturer of production machines for electronics. It combines very high flexibility with the fast placement speed of an 8-axes placer. Essemtec is the Swiss provider of Real Turnkey Solutions for electronics manufacturing: machines,...

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Assembly Machinery

Board Assembly System converts from manual to automatic.

Designed with focus on process adaptability, Grid-Lok(TM) Silver enables assembly specialists to begin with manual version and, through few modifications, convert to fully automatic system. Functionality allows for operation in manual, semi-automatic, or fully automatic mode. With benefits of automatic board support technology, system delivers adaptable and stable underside support for...

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Universal Demonstrates Newest Platforms at NEPCON China
Placement Equipment

Universal Demonstrates Newest Platforms at NEPCON China

Universal Instruments will showcase its newest surface mount and through-hole platforms together with China/Hong Kong-area sales representative Gentron International Limited on booth 1A03 at the 2011 NEPCON China tradeshow in Shanghai, China on May 11-13. The flagship Genesis Series 2 Platform, delivering the ultimate in modular performance for standard-to-extreme surface mount applications, will...

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