Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver 'More than Moore' Density, Bandwidth and Power Efficiency
Enables 100x Improvement in Die-to-Die Bandwidth Per Watt and 2-3x Capacity Advantage Over Monolithic Devices TAIPEI, Taiwan, -- Xilinx, Inc. (Nasdaq: XLNX) today announced the industry's first stacked silicon interconnect technology for delivering breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package for applications that require high-transistor and logic...
Read More »Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver 'More than Moore' Density, Bandwidth and Power Efficiency
Enables 100x Improvement in Die-to-Die Bandwidth Per Watt and 2-3x Capacity Advantage Over Monolithic Devices TAIPEI, Taiwan, -- Xilinx, Inc. (Nasdaq: XLNX) today announced the industry's first stacked silicon interconnect technology for delivering breakthrough capacity, bandwidth and power savings using multiple FPGA die in a single package for applications that require high-transistor and logic...
Read More »Altera Cuts Development Time and Increases Industrial Design Flexibility with a Kit and a Click
Altera Expands Industrial Networking Partner Program to Include IP and Terasic's Industrial Networking Kit Featuring Altera's Cyclone IV E FPGA SAN JOSE, Calif., Oct. 18 - Reducing development time for industrial networking designers, Altera Corporation (Nasdaq: ALTR) today announced the expansion of its Industrial Networking Partner Program (INPP) with a new Industrial Networking Kit (INK) from...
Read More »Altera Cuts Development Time and Increases Industrial Design Flexibility with a Kit and a Click
Altera Expands Industrial Networking Partner Program to Include IP and Terasic's Industrial Networking Kit Featuring Altera's Cyclone IV E FPGA SAN JOSE, Calif., Oct. 18 - Reducing development time for industrial networking designers, Altera Corporation (Nasdaq: ALTR) today announced the expansion of its Industrial Networking Partner Program (INPP) with a new Industrial Networking Kit (INK) from...
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TOP 3 SEAL TROUBLE SIGNS and HOW TO FIX IT
If ignored, broken seals can lead to a loss in production and equipment shut down. For more information on seals and seal repairs, download now.
Read More »Altera Launches Embedded Initiative with New System Level Integration Tool for Embedded Systems Configurability
Single FPGA Design Flow will Support Range of Embedded Processor Offerings Based on ARM, Intel, MIPS-® Architectures SAN JOSE, Calif., -- To accelerate the integration of programmable logic and processors in embedded systems, Altera Corporation (Nasdaq: ALTR) today announced its Embedded Initiative. With this initiative, Altera is providing designers a single FPGA design flow based on its...
Read More »Altera Launches Embedded Initiative with New System Level Integration Tool for Embedded Systems Configurability
Single FPGA Design Flow will Support Range of Embedded Processor Offerings Based on ARM, Intel, MIPSÃ-® Architectures SAN JOSE, Calif., -- To accelerate the integration of programmable logic and processors in embedded systems, Altera Corporation (Nasdaq: ALTR) today announced its Embedded Initiative. With this initiative, Altera is providing designers a single FPGA design flow based on its...
Read More »XMC Module combines FPGA with high-speed PCIe interface. .
Combining configurable Xilinx Virtex-5 FPGA with high-speed memory buffers and PCIe bus 4-lane interface, Model XMC-VLX is capable of executing custom instruction sets and algorithms. Field I/O interfaces to FPGA via rear J4/P4 connector and/or with optional front mezzanine plug-in I/O modules. Up to 64 I/O lines are accessible through J4 connector. Available in 3 versions, module offers choice...
Read More »XMC Module combines FPGA with high-speed PCIe interface. .
Combining configurable Xilinx Virtex-5 FPGA with high-speed memory buffers and PCIe bus 4-lane interface, Model XMC-VLX is capable of executing custom instruction sets and algorithms. Field I/O interfaces to FPGA via rear J4/P4 connector and/or with optional front mezzanine plug-in I/O modules. Up to 64 I/O lines are accessible through J4 connector. Available in 3 versions, module offers choice...
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560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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