Low-Power FPGA targets 3G basestation designs.
Featuring DSP capacity of 320 18 x 18 multipliers, 6.8 Mbits of memory, and up to sixteen 3.2 Gbps SERDES channels, LatticeECP3(TM)-150 is suited for complex Wireless Remote Radio Heads such as MIMO-based RF antenna solutions. Device also provides Wireline Access developers with low-power Ethernet, SONET, and PCI Express solutions. FPGA is supported by ispLEVER® v8.0 design suite, which...
Read More »FPGA Series balance power, memory, and DSP capabilities.
Supporting mainstream serial protocols, Cyclone® IV series responds to bandwidth requirements driven by demand for mobile video, voice, and data access. Cyclone IV GX devices, supplied in packages down to 11 x 11 mm, have up to 150K logic elements, up to 6.5 Mbit RAM, 360 multipliers, and 8 integrated 3.125 Gbps transceivers. Cyclone IV E devices offer features suited for power-sensitive...
Read More »FPGAs integrate 11.3 Gbps transceivers.
With 36 transceiver channels operating from 2.488-11.3 Gbps, Stratix® IV GT EP4S100G2 FPGAs meet bandwidth requirements for next-generation framer, MAC, bridging, and switching applications for 100-Gigabit Ethernet and 100-Gigabit Optical Transport Networks. Single-chip devices meet IEEE 802.3 standard for 100G systems and offer jitter performance to meet 10G, 40G, and 100G protocol...
Read More »FPGAs feature up to 820 K logic elements.
Intended for high-end digital applications, 40 nm Stratix® IV E FPGA Series features 4 devices ranging in density from 230 to 820 K logic elements. Model EP4SE820 provides 650 K registers and 23.1 Mbits of 600 MHz embedded memory, as well as 960 18 x 18 multipliers running up to 550 MHz, 1,120 I/Os, and 1.25 Gbps LVDS performance. Devices are suitable for ASIC prototyping and emulation,...
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Choosing the Right Material for Your Project
When choosing an appropriate metal material, the range of options is so broad that selecting the correct material for your unique application can be challenging. Different metals have characteristics that can affect weldability, ductility, and formability. Our new eBook outlines the unique properties and applications of popular metals including: Stainless Steel Brass Aluminum Copper Titanium
Read More »FPGA features 36 embedded transceivers.
Providing 230 K logic elements, 13.9 Mbits of embedded memory, and 1,288 18 x 18 multipliers, 40 nm Stratix® IV GX EP4SGX230 FPGA is suited for variety of high-speed backplane and cabling interfaces, chip-to-chip interconnects, and protocol-bridging applications. Embedded transceivers offer optimal jitter performance at data rates from 600 Mbps to 8.5 Gbps. They support PCI® Express...
Read More »Avnet Electronics Marketing Releases New Xilinx Spartan-6 FPGA Evaluation and Development Kits
PHOENIX -- The Avnet Electronics Marketing operating group of Avnet, Inc. (NYSE: AVT), announces the release of the Xilinx® Spartan®-6 LX16 FPGA Evaluation Kit and Spartan®-6 LX150T FPGA Development Kit. Both kits support the new FMC expansion standard, which enables the addition of add-on modules and easy customization when working with Field Programmable Gate Array (FPGA)...
Read More »Software Defined Radio targets 4G wireless applications.
Programmable and reconfigurable nGEN Elemental Computing Array platform is designed for multi-mode, multi-band, and multi-functional 4G wireless applications. It enables users to develop applications as software, which then can be modified, replaced, and managed for deployment of new standards and feature sets. System is built around massively parallel, multi-threaded ECA architecture, which...
Read More »Prototype FPGAs help build space-flight systems.
RTAX-DSP prototype devices enable hardware demonstration and timing validation of designs targeted to Actel RTAX-DSP space-flight FPGAs. They have same pin assignment, mechanical footprint, and identical timing properties as their space-qualified counterparts. RTAX-DSP space-flight FPGAs add embedded radiation-tolerant multiply-accumulate blocks to industry-standard RTAX-S product family,...
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FPGA Development Kit accelerates 3 Gbps evaluations.
Offering complete system of pre-verified components and supporting hardware reference designs, Arria® II GX FPGA Development Kit provides hardware and software resources needed to evaluate and adopt Arria II GX 40 nm FPGAs. Entire PCIe Gen1 end-point design package features PCI-SIG-compliant Arria II GX FPGA-based development board with embedded PCIe Gen1 hard IP core. Users also get...
Read More »FPGA Series targets aerospace and defense industries.
Virtex®-5Q FPGAs leverage ASMBL(TM) architecture and underlying programmable technologies to optimize speed, capacity, and power consumption. Cryptographic capabilities are included along with inherent re-programmability and SCC technology, while ruggedized packaging across board provides redundant protection against tin-whiskering and support for military assembly processes. Defense-grade...
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Harpro Modular Containers Offer an Eco-friendly, Portable Recycling Solution
Harpro's MiddleMan™ recycling container frames and reusable bags are made from eco-friendly material, fold for easy storage, and are easy to assemble. Check out the video to learn more.
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