FPGA and Development Kit suit high-speed applications.
Offering programmable solution, 90 nm StratixÃ-® II GX EP2SGX90E features 12 embedded transceivers and 90,960 equivalent logic elements. Stratix II GX signal integrity development kit evaluates and validates 6.375 Gbps transceivers. It includes all necessary components for validating high-speed backplane interface, chip-to-chip, and communications protocol-bridging applications. In addition...
Read More »Altera Delivers Military Temperature FPGAs
Company's Enhanced COTS strategy demonstrates commitment to military market; Stratix devices now offering this segment high-density and performance San Jose, Calif., March 21, 2006-Altera Corporation (NASDAQ: ALTR) today announced qualification of its high-performance Stratix-® FPGA family for military temperature operation requirements, from -55-°C to +125-°C. This increase in operational...
Read More »Filter Arrays feature integrated ESD protection diodes.
VEMI filter arrays provide EMI filtering and ESD protection for data lines in space-critical mobile applications. Units are available in LLP75-6A, LLP75-7A, LLP70-9A, and FlipChip (BGA) packages and in 2-, 3-, 4-, and 6-channel configurations, respectively. Devices combine -30 dB filter attenuation from 900 MHz to 2.3 GHz and 30 kV ESD protection. Arrays provide I/O protection in mobile and smart...
Read More »Xilinx First to 65nm with Next Generation Virtex FPGAs
New Family Poised to Further Propel FPGAs Into $22B ASIC/ASSP Market by Delivering Robust System-Level Solutions for High-Performance DSP, Embedded and Serial Connectivity Application Domains MONTEREY, Calif., Feb. 28 / -- At the Globalpress Summit 2006 today, Xilinx, Inc. (NASDAQ:XLNX), the world's leading supplier of programmable logic solutions and inventor of the FPGA, demonstrated first...
Read More »Advantages of Thermoset Plastics vs. Engineered Thermoplastics and Metal Parts
Thermosets and engineered thermoplastics are sometimes better suited to differing situations, but they do have some overlap in relevant use cases.
Read More »Actel Ships Industry's First MIL-STD-883B Qualified Flash-Based FPGAs
Company Continues to Strengthen Military Offering With Fully-Qualified Flexible and Reprogrammable Platform MOUNTAIN VIEW, Calif., Dec. 6 - Helping its customers address the rigorous reliability requirements of military applications, Actel Corporation (NASDAQ:ACTL) today announced the availability of the industry's first fully qualified MIL-STD 883B flash-based field-programmable gate arrays...
Read More »Ultra Electronics Chooses Altera's Stratix II Devices to Cut IP Security Costs and Seek New SDR Markets
Unique intellectual property security feature safeguards transfer of tactical radio technology, eliminating the need for costly custom chip development Ville Saint-Laurent, Quebec and San Jose, Calif., February 8, 2006-Ultra Electronics, Tactical Communication Systems (TCS) and Altera Corporation (NASDAQ: ALTR) today announced the Canadian tactical radio maker is using the unique security...
Read More »DIL/NetPC Module Goes Open Source
Two years after the Linux based embedded softcore computing module ADNP/ESC1 has launched, SSV publishes the circuit schematic, parts list, layout plan and all soft-ware source codes of the FPGA module. With the GPL in mind the published sources can be used for developing and producing the ADNP/ESC1 by oneself. The main advantages of the FPGA module like the independence of obsolete processors...
Read More »Altera's Stratix II FPGAs Enable 667-Mbps DDR2 SDRAM Data Rate
See 667-Mbps DDR2 SDRAM Interface Demonstration at DesignCon 2006 SAN JOSE, Calif., Feb. 6 / -- Altera Corporation (NASDAQ:ALTR) today announced that its Stratix(R) II device family is qualified to support the 667-Mbps DDR2 SDRAM interface data rate. Altera's new auto-calibrating PHY memory interface controller intellectual property (IP) core and the superior signal integrity of its Stratix II...
Read More »Interconnect Arrays provide up to 500 I/Os.
Featuring choice of solder-crimps on tails, SEARAY(TM) SEAM/SEAF Series high density interconnects offer traditional tin-lead alloy or RoHS compliant tin-only and provide solid grid of contacts on .050 in. pitch. Products are available with stack heights of 7, 8.5, and 10 mm, and array sizes of 8 or 10 rows by 20, 30, 40, or 50 pins per row. Connectors' performance at -3 dB insertion loss is 4...
Read More »Altera Offers Faster Speed Grade for High-Density Stratix II FPGAs
Excellent Yield and Successful Production Qualification Results in Faster Speed Grade SAN JOSE, Calif., July 18 -- Altera Corporation (NASDAQ:ALTR) today announced that it is offering a new, faster speed grade for the two largest members of the Stratix(R) II family, the EP2S130 and EP2S180 devices. Altera added the new speed grade (-3) to the two devices following their successful production...
Read More »Precision Machining Solutions with Over 25 Years of Experience
Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.
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