Arrays

Development Platform is for Virtex-5 LX-based applications.

Along with 256 MB DDR2 SODIMM socket and flash memory for configuration bit stream storage, Model ML501 combines features of 65 nm LX50 device with interfaces such as USB, PS/2 for keyboard and mouse, RJ-45 connector for 10/100 Ethernet networking, RS-232 serial port, video output (DVI/VGA), and audio in and out ports. Development platform provides single-ended and differential I/O expansion, and...

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Field Programmable Object Arrays operate up to 1 GHz.

Re-programmable Arrix FPOAs support 400 independent, configurable objects linked via programmable 1 GHz interconnect fabric. Units operate in industrial temperature ranges and are available in both standard eutectic and RoHS-compliant packaging. Products are suited for performance-demanding applications in industries such as machine vision, professional video, medical imaging, and...

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Tektronix and FS2 Collaborate on Real-Time Logic Debug Solution for Xilinx FPGAs

Tektronix TLA Series Logic Analyzers and FS2 FPGAView Software Provide Complete Debug Package for Xilinx FPGAs BEAVERTON, Ore., Sept. 20 /-- Tektronix, Inc. (NYSE:TEK) and First Silicon Solutions (FS2) (NASDAQ:MIPS), today announced the FPGAView(TM) software package for Tektronix(R) TLA Series logic analyzers that enables real-time debugging of Xilinx(R) FPGAs. Using the FPGAView software, design...

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Xilinx Demonstrates Video-Over-IP, HD-SDI and H.264 Solutions at IBC 2006

What: Xilinx demonstrates its programmable broadcast solutions at IBC 2006 When: 8-12 September 2006 Where: RAI Convention Center, Amsterdam, Netherlands (Hall 8 - Stand Number 8.219) DUBLIN, Ireland, Sept. 6 -- Xilinx, Inc. (NASDAQ:XLNX), the world's leading programmable logic supplier, today announced it will be demonstrating multiple FPGA-based solutions for the broadcast industry at the...

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Low Power FPGAs consume 5 -µW of static power.

Available in 8 x 8 mm, 196-pin chip scale package, Actel IGLOO(TM) family FPGAs support 1.2 V and offer 3 modes for optimizing power consumption. Flash*Freeze(TM) conserves power while maintaining FPGA content; low-power active maintains capabilities with FPGA core, clocks, and I/O; while sleep mode drops power below 25 Â-µW when power to FPGA core is removed. Features include up to 3 million...

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RAID Storage System is PCI Express-based.

Featuring 1U form factor, RAID storage system provides 4 hot-swappable SATA II/SAS drives with total storage capacity of up to 2 TB. It operates from host PC on either PCI Express x4 or x8 cable when PCIe adapter card is inserted into host PC's PCIe x4, x8, or x16 slot. RAID controller organizes data on drives and controls flow of data, enabling speeds up to 40 GB/sec. System supports RAID levels...

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BGA-to-BGA Adapter solves RoHS-related soldering problems.

BGA-to-BGA Adapter solves RoHS-related soldering problems.

BGA-to-BGA adapter solves solder joint reliability problems that occur when RoHS-compliant solder balls are assembled with devices whose connections are not lead-free. Adapter body is made from high-temperature glass reinforced material that allows lead-free components to be mounted at higher temperatures, while eutectic tin-lead ball terminations, which have standard reflow temperatures...

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Novalux Demonstrates First Red Necsel(TM) Arrays; Meets 3-Watt Power Goal for Green and Blue

Red, Green, Blue Arrays Combine to Enable Laser TVs with Unmatched Necsel Color SUNNYVALE, Calif., August 30, 2006 - Novalux, Inc., developer of Necsel(TM) laser technology, has demonstrated its first Necsel laser arrays that emit over 750 mW of red light. The company has also met its 3-watt power output target for its prototype blue and green arrays; doubling the power of previous devices. These...

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Discover How Altera's Programmable Solutions Drive Innovation in the Broadcast Industry at IBC2006

SAN JOSE, Calif., Aug. 29 // Altera Corporation (NASDAQ:ALTR) will showcase its portfolio of industry- leading programmable logic solutions for the digital broadcast industry at the upcoming International Broadcasting Convention (IBC2006) event in Amsterdam. Visitors to Altera's booth will see demonstrations of programmable logic-based solutions that enable designers of broadcast applications to...

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Memory Solution features space-saving stacked design.

Designed for mobile phone applications, Package-on-Package (PoP) memory solution is available in 12 x 12 mm (128 balls) and 14 x 14 mm (152 balls) sizes, with 0.65 mm ball pitch. Bottom PoP package features array of metallic balls on underside and array of footprints (lands) on top surface to receive mating Top BGA package. Technique allows devices to be assembled in vertical stacks consisting of...

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