Adhesives

Needle-Bonding Adhesives increased throughput via cure speed.
Adhesives

Needle-Bonding Adhesives increased throughput via cure speed.

With typical cure time of 2.5 sec or less, 1400 Series LED-curable needle bonders increase production speed and throughput while promoting quality control with aid of fluorescing technology. Adhesives cure with 385 or 405 nm wavelengths, allowing design flexibility within automation process, and are available in 15 L pails.- Products pass ISO 10993-5 Cytotoxicity testing and support short-term (

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Needle-Bonding Adhesives increased throughput via cure speed.
Adhesives

Needle-Bonding Adhesives increased throughput via cure speed.

With typical cure time of 2.5 sec or less, 1400 Series LED-curable needle bonders increase production speed and throughput while promoting quality control with aid of fluorescing technology. Adhesives cure with 385 or 405 nm wavelengths, allowing design flexibility within automation process, and are available in 15 L pails.Â- Products pass ISO 10993-5 Cytotoxicity testing and support...

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Abrasive Coated Discs

Ceramic Abrasives support heavy grinding and finishing.

Engineered for aggressive metal removal and finishing, CERAMIQ™ Abrasives offer optimum surface finish by avoiding scoring, marking, and bluing of work piece. Flap Discs are designed for grinding and finishing in one operation, while Quick Change- Minidiscs provide material removal and blending where accessibility is a problem. Flexidisc® and Mini-Flexidisc®  optimize blending and...

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Abrasive Coated Discs

Ceramic Abrasives support heavy grinding and finishing.

Engineered for aggressive metal removal and finishing, CERAMIQ™ Abrasives offer optimum surface finish by avoiding scoring, marking, and bluing of work piece. Flap Discs are designed for grinding and finishing in one operation, while Quick ChangeÂ- Minidiscs provide material removal and blending where accessibility is a problem. Flexidisc® and Mini-Flexidisc®  optimize...

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UV Cure Adhesive suits microelectronic assembly applications.
Epoxies

UV Cure Adhesive suits microelectronic assembly applications.

Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 is- also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not contain...

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UV Cure Adhesive suits microelectronic assembly applications.
Epoxies

UV Cure Adhesive suits microelectronic assembly applications.

Designed to eliminate any warpage of components in disk drive assemblies, nonconductive and ionically clean 535-18M-57 isÂ- also suited for lens bonding in camera modules, chip encapsulation in smart cards, and various general bonding applications in photonics assembly. Low-outgassing, flexible, high-strength epoxy adhesive cures when exposed to high-intensity UV light and does not...

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Adhesives

Polyolefin-Based Hotmelt helps reduce interior auto weight.

Applied through- roll coating process, TECHNOMELT XPO 1050 can bond range of interior-related substrates without requiring pretreatment of plastic surface. In addition to ability to reduce vehicle mass by 0.8–2.2 kg per vehicle, use of this product can eliminate need for heat ovens and tunnels and pretreatment flame equipment or additional surface primers. Interior applications include door...

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Adhesives

Polyolefin-Based Hotmelt helps reduce interior auto weight.

Applied throughÂ- roll coating process, TECHNOMELT XPO 1050 can bond range of interior-related substrates without requiring pretreatment of plastic surface. In addition to ability to reduce vehicle mass by 0.8–2.2 kg per vehicle, use of this product can eliminate need for heat ovens and tunnels and pretreatment flame equipment or additional surface primers. Interior applications include...

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How SpinSelect Can Save You Time and Money
Sponsored

How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.

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