Nordson EFD to Exhibit Multiple Technologies for Improving Efficiency and Profitability in Electronics Manufacturing Processes

Company will showcase a range of innovative fluid dispensing solutions at Jisso/Protec Japan 2012 trade show TOKYO- – Nordson EFD, a subsidiary of Nordson Corporation (Nasdaq: NDSN), will be demonstrating their latest fluid dispensing technologies for improving electronics manufacturing processes at Jisso/Protec Japan 2012, to be held in Tokyo June 13-15. Nordson EFD products, including their...

Read More »
Assembly Adhesive suits edgebonding applications.

Assembly Adhesive suits edgebonding applications.

Designed for rapid ruggedization of circuit board components, Ultra Light-Weld-® 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual...

Read More »
Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity

Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity

Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic industries. In addition to its electrical properties, this system is very...

Read More »

PPS Stock Shapes combine resilience and machinability.

Stocked in rod and plate, TECATRON-® PPS is made from FDA-compliant resins and maintains chemical resistance and purity while exhibiting tensile strength of 15,000 psi, tensile modulus of 731,500 psi, and compressive modulus of 367,000 psi. Additional properties include flexural strength of 24,000 psi; flexural modulus of 622,000 psi; and compression strength 17,800 psi. These properties result...

Read More »

Heraeus Exhibits New Products at PV Taiwan 2013, the Taiwan International Photovoltaic Exhibition

Heraeus provides Taiwan with local customer service supported by global resources. TAIPEI- — The Heraeus Photovoltaics Business Unit will be exhibiting at this year's PV Taiwan 2013 photovoltaic exhibition from October 30th - November 1st in Taipei, Taiwan. Heraeus will feature their line of metallization pastes for conventional and advanced solar cell designs in Hall 1, Booth A0910. Jason Lu,...

Read More »

Plastics Color Corp. Now Offering Thermoset Compounds

Calumet City, Ill. – Plastics Color Corporation, a leader in thermoplastic compounds and solutions, is now offering thermoset plastic molding compounds through its new venture with German manufacturer Raschig GmbH, headquartered in Ludwigshafen. Plastics Color and Raschig are both subsidiaries of Sun Valley, California-based PMC Global Inc. Raschig will be distributing PCC's complete line of...

Read More »
Conductive Adhesive suits die attach applications.

Conductive Adhesive suits die attach applications.

Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature...

Read More »

Purolite Corporation to Develop Bioseparation Resins Based on Agarose Media

BALA CYNWYD, Pa.- — Purolite announced today that it will develop bioseparation resins for chromatography based on agarose media that will be manufactured in their cGMP, FDA regulated facility. The new line will expand the LifeTech™ family of products to cover the SEC, HIC, IEX and affinity bio-purification media for the fast-growing biomolecules market. The new products will launch in 2014...

Read More »

All Topics