New Metal-Resin Bonding Technology Uses Metal Insert Molding
Poltplstic’s Quick-10® Metal-Resin Bonding Technology is used in bonding metal parts and resins by a molten resin applying via injection molding to metal parts that have gone surface treatment. The technology is suitable for mobile device parts such as mobile phones, tablets and digital cameras. Resin composites exhibits properties of metals and engineering plastics. Quick-10 utilizes quick...
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New Metal-Resin Bonding Technology Uses Metal Insert Molding
Poltplstic’s Quick-10® Metal-Resin Bonding Technology is used in bonding metal parts and resins by a molten resin applying via injection molding to metal parts that have gone surface treatment. The technology is suitable for mobile device parts such as mobile phones, tablets and digital cameras. Resin composites exhibits properties of metals and engineering plastics. Quick-10 utilizes quick...
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New Electrically Conductive Adhesives Increase Module Performance
Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...
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New Electrically Conductive Adhesives Increase Module Performance
Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...
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The Ultimate Guide to Packaging Automation Solutions
This ebook provides an in-depth guide to packaging automation solutions.
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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...
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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...
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New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality
Ossid’s TS-72 Sealing/Lidding Machines are used for packaging beef, chicken, pork and seafoods in trays, cups, rounds and vacuum packs. The machine provides high yielding output with an operating cycle of up to 15 per minute. Units are available for ambient, modified atmosphere packaging (MAP) and MAP with vacuum applications. TS-72 machines allow production of range of stock keeping units on...
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New TS-72 Sealing/Lidding Machines Come with Quick Changeover Functionality
Ossid’s TS-72 Sealing/Lidding Machines are used for packaging beef, chicken, pork and seafoods in trays, cups, rounds and vacuum packs. The machine provides high yielding output with an operating cycle of up to 15 per minute. Units are available for ambient, modified atmosphere packaging (MAP) and MAP with vacuum applications. TS-72 machines allow production of range of stock keeping units on...
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New LT Compounds Can be Used as Lightweight Alternatives
Light and Tough Compounds come with a weight of 5-10% less than typical filled compounds. The compounds are used to provide weight reductions in parts molded with glass fiber reinforcement and the density offered by the compounds is independent of wall thickness. Product is suitable for handheld, battery-operated tools, sporting goods, handheld appliances and recreational vehicle.
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New LT Compounds Can be Used as Lightweight Alternatives
Light and Tough Compounds come with a weight of 5-10% less than typical filled compounds. The compounds are used to provide weight reductions in parts molded with glass fiber reinforcement and the density offered by the compounds is independent of wall thickness. Product is suitable for handheld, battery-operated tools, sporting goods, handheld appliances and recreational vehicle.
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Triad's Next-Gen Power Supplies Offer Increased Reliability and Reduced Noise Performance
Triad Magnetics, an established leader in power supply design and manufacturing, is proud to announce their next generation WAU AC and WDU DC Series of power supplies. These linear wall plug-ins offer minimum noise performance without sacrificing reliability or life. See our video to learn more.
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