Conductive Adhesive is silver-filled.
QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150-
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Epoxy Adhesive cures at low temperatures.
TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60-
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Epoxy provides clear lamination.
TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.
Read More »Universal Epoxy bonds well with glass ceramic.
AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100-
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Customized Silicone Technology: For Today's and Next Generation Electronic Applications
This white paper provides and in-depth overview into the customized silicone technology for electronic protection.
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The Carbontec System: A Smarter Way to Heat Your Buildings
Carbontec's paper-thin radiant heating systems reduce energy consumption costs by warming the building surfaces instead of controlling air temperature. Check out our video to learn more.
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