Adhesive Tapes

Foam Glazing & Muntin Mounting Tapes are pressure sensitive.

ARclad® pressure-sensitive foam glazing tapes offer cold flex, good sealing characteristics, and cyclic shock resistance. They require no cure time, apply and adhere without oozing, and require no cleanup. ARclad® 2000 glazing tapes offer high shear and internal strength. ARclad® 8231 double-faced glazing tape delivers permanent anchorage to foam. ARclad®...

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Epoxies

Epoxy features built-in cure indicator.

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80° C and moisture resistance, chip is assured of...

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Resins

Acrylic Capstock Resin provides weatherability to HIPS.

Solarkote® H Acrylic Capstock imparts weatherability to high-impact polystyrene (HIPS) sheets via co-extrusion. It provides protection from ultraviolet light for HIPS substrates without sacrificing impact performance of composite sheet. Co-extruded Solarkote H acrylic cap layers are inherently colorless. Cap layer screens out UV while maintaining high visible light transmission.

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How to Choose the Right Adhesive Tape for Your Application
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How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

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Conductive Adhesive is silver-filled.
Adhesives

Conductive Adhesive is silver-filled.

QMI 526 silver-filled, thermally conductive adhesive can be cured inline using Skip-Cure(TM) processing in 8 sec at 150°C. This product can perform in lead-free, 260°C reflow applications. Hydrophobic, and stable at high temperatures, QMI 526 delivers void-free bond lines with excellent adhesive strength on organic and metal surfaces. Its adhesion mechanism compensates for fluorine...

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Epoxy Adhesive cures at low temperatures.
Epoxies

Epoxy Adhesive cures at low temperatures.

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60° C. Epoxy contains no volatile solvents and features excellent temperature resistance, hardness and strength.

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Epoxy provides clear lamination.
Epoxies

Epoxy provides clear lamination.

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

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Epoxies

Universal Epoxy bonds well with glass ceramic.

AngstromBond AB9320 two-part, blue epoxy, low-stress adhesive will not cause fiber core cracking or fiber pistoning. This low viscosity system can be cured in 10 minutes at 100°C, and produces a glass transition temperature of over 120°C. It bonds well to glass ceramic, metals and most plastics. Heat-cured product has 90 minute working time. Designed for terminating multimode and...

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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life

For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.

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