Adhesive Transfer Film adheres to skin without irritation.

Bioflex-® Rx230U medical grade, unsupported acrylic adhesive carries Device Master File Number with Bureau of Medical Devices. It is supplied on 60# white densified kraft release liner and can be laminated to variety of substrates. Adhesive film provides UV and humidity resistance, and is suitable for use on medical devices that will adhere to human skin such as wound care and ostomy products.

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Structural Adhesive is chemical and water resistant.

Type XD 4661-A/B methacrylate adhesive joins substrates such as thermoplastics, aluminum, thermoset composites, and ferrous metals. Product requires 1:1 pbv mix ratio, 3 min work life, and can be handled after 8 min at room temperature. Full cure cycle is 18 min at 77-

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Acrylic Adhesive bonds low energy plastics.

Loctite-® 3030, 2-component adhesive has 10:1 mix ratio and cures at room temperature to provide fixturing strength within 8-10 min. Once cured, product maintains strength under elevated temperature and humidity conditions. Formulated to bond substrates such as HDPE, LLDPE, polyethylene, and polypropylene, thixotropic material may also be used as general-purpose adhesive on other substrates....

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Potting Compound handles temperatures to 2800

Potting Compound handles temperatures to 2800

Grade H-115 thermally conductive, electrically insulating ceramic cement resists thermal shock, withstands rapid heating or cooling at wide temperature fluctuations, and prevents vibration-loosening of components. Supplied as single-component, dry, white powder, compound sets by chemical reaction, forming near impervious ceramic within 16 hr. Compound does not contain asbestos or other fibers and...

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Adhesive resists temperatures to 400

Room temperature curing EP21HT, 2-component epoxy adhesive, has 1:1 mix ratio, weight or volume. It is 100% reactive and contains no solvents or volatiles. With service operating temperature range of -60 to +400-

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Conductive Adhesive is offered in syringe system.

Conductive Adhesive is offered in syringe system.

Able to cure at room temperature in 24 hr, CHO-BOND-® 584-29 conductive adhesive is contained within syringe system that consists of a pair of syringes, 1 containing hardener and 1 with conductive resin, separated by connector. Compounds are mixed between syringes, and 1 syringe is used to apply mixed conductive adhesive. With silver filler, compound provides low-volume resistivity of 0.002...

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Surface Mount Adhesive suits high-speed applications.

Without requiring higher than normal print temperatures or higher nozzle temperature control, Chipbonder-® 3627 may be dispensed at rates of 40,000+ DPH and is fully jettable. Controlled rheology provides high-speed printing for use with fine pitch components. Stable at room temperatures, fully cured adhesive provides adhesion to various substrates and has glass transition temperature (Tg) of 90...

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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.

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